Backside stimulated sensor with background current manipulation

• US 8,987,841 B2
• Filed: 03/11/2014
• Issued: 03/24/2015
• Est. Priority Date: 08/09/2010
• Status: Active Grant

• Current Assignee: Omnivision Technologies Incorporated (Will Semiconductor Co., Ltd. Shanghai)
• Original Assignee: Omnivision Technologies Incorporated (Will Semiconductor Co., Ltd. Shanghai)
• Inventors: Bikumandla, Manoj, Massetti, Dominic
• Primary Examiner(s): TAYLOR, EARL N
• Application Number:
  US14/205,203
• Publication Number:
  US 20140191294A1
• Time in Patent Office: 378 Days
• Field of Search: 257/253, 257/444, 257/446, 257/460, 257/461, 250/787.5, 250/789
• US Class Current: 257/414
• CPC Class Codes: G01N 27/4145 specially adapted for biomolecules, e.g. gate electrode with immobilised receptors
• CPC Class Codes: G01N 27/4148 Integrated circuits therefor, e.g. fabricated by CMOS processing CMOS processing per se H01L21/82

Abstract

A CMOS (Complementary Metal Oxide Semiconductor) pixel for sensing at least one selected from a biological, chemical, ionic, electrical, mechanical and magnetic stimulus. The CMOS pixel includes a substrate including a backside, a source coupled with the substrate to generate a background current, and a detection element electrically coupled to measure the background current. The stimulus, which is to be provided to the backside, affects a measurable change in the background current.

Claims

1. A CMOS (Complementary Metal Oxide Semiconductor) pixel to sense at least one stimulus selected from a biological, chemical, ionic, electrical, mechanical and magnetic stimulus, comprising:

a substrate including a backside;

a source coupled with the substrate to generate a background current;

a first diode, and a detection system electrically coupled with the substrate to measure an effect on the background current;

at least one charge sensitive layer having an electrical charge and that is coupled with the backside, wherein the at least one charge sensitive layer is to interact with an analyte that is to be exposed to the at least one charge sensitive layer, and wherein interaction of the at least one charge sensitive layer with the analyte is to provide a non-light emitting stimulus that is to alter the electrical charge of the at least one charge sensitive layer and is to affect the measurable effect on the background current which is measurable by the detection system; and

a reference electrode proximate to the backside of the substrate.

2. The CMOS pixel of claim 1, wherein the detection system includes at least one of a diode, a transfer transistor, a reset transistor, a floating diffusion node, a source follower transistor, and a select transistor.

3. The CMOS pixel of claim 2, wherein the transfer transistor and the reset transistor act to reset the first diode to a voltage level that is in part determined by the effect of the stimulus on the background current.

4. The CMOS pixel of claim 2, wherein the transfer transistor, the floating diffusion node, and the source follower transistor are to read out a voltage level from the first diode that is in part determined by the effect of the stimulus on the background current.

5. The CMOS pixel of claim 1, wherein the at least one charge sensitive layer is an insulating layer.

6. The CMOS pixel of claim 1, wherein the at least one charge sensitive layer is within the substrate and is of a same material as the substrate and is adjacent to the backside of the substrate.

7. The CMOS pixel of claim 1, wherein the at least one charge sensitive layer has a capacity of affinity based modification of a charge of the first diode, and wherein the affinity based modification of the charge of the first diode affects a measurable change in an effect of the background current.

8. The CMOS pixel of claim 1, wherein the source to generate the background current includes a second diode that is substantially disposed within the substrate.

9. The CMOS pixel of claim 1, wherein the source to generate the background current includes a shallow trench isolation structure that is substantially disposed within the substrate, and wherein at least one of:

(1) the shallow trench isolation structure includes at least one rough surface; and

(2) the substrate includes a portion adjacent to the shallow trench isolation structure that includes embedded dopant atoms.

10. The CMOS pixel of claim 9, wherein the embedded dopant atoms include boron ions.

11. The CMOS pixel of claim 1, wherein the analyte comprises ions within an electrolyte, and wherein a concentration of the ions in the electrolyte is to affect the measurable effect on the background current which is measurable by the detection system.

12. The CMOS pixel of claim 11, wherein the ions comprise hydronium ions, and wherein the effect on the background current is to be used to measure a pH of the electrolyte.

13. The CMOS pixel of claim 1, wherein the reference electrode is formed on at least a portion of a surface at the backside of the substrate.

14. The CMOS pixel of claim 1, wherein the reference electrode is formed on a dielectric layer, and wherein the dielectric layer is disposed between the reference electrode and the backside of the substrate.

15. The CMOS pixel of claim 1, wherein the reference electrode comprises one of a voltage reference and a current reference.

16. The CMOS pixel of claim 1, further comprising at least one of a blocking layer and a blocking material to block light from the pixel.

17. An ion sensor comprising:

a substrate having a frontside and a backside opposite the frontside, the frontside having a metal stack over Complementary Metal Oxide Semiconductor (CMOS) circuitry;

at least one of a diode and a structure, which is disposed within the substrate, and which is operable to generate a background current;

a circuit electrically coupled with the substrate and operable to measure the background current;

an electrical charge located at the backside of the substrate, the electrical charge having a magnitude and to be coupled with an ionic charge magnitude of an electrolyte that is to be disposed on a surface at the backside of the substrate, wherein the coupling of the electrical charge with the electrolyte, without a need for light emission, is to cause a change in the background current that is to be measured by the circuit; and

a reference electrode proximate to the backside.

18. The ion sensor of claim 17, wherein the reference electrode occupies a plane substantially parallel to the surface at the backside and is displaced from the surface at the backside to allow introduction of the electrolyte.

19. The ion sensor of claim 17, wherein the reference electrode is formed on at least a portion of a surface at the backside of the substrate.

20. The ion sensor of claim 17, further comprising at least one of a blocking layer and a blocking material to block light from a pixel corresponding to the circuit.

21. An ion sensor system comprising:

a semiconductor substrate having a backside opposite a frontside;

an array of CMOS (Complementary Metal Oxide Semiconductor) pixels disposed within the semiconductor substrate;

a charge sensitive layer coupled along and adjacent to the backside of the semiconductor substrate; and

a reference electrode positioned to contact an electrolyte test sample disposed between the reference electrode and the backside of the semiconductor substrate.

22. The ion sensor system of claim 21, wherein the reference electrode is one of a voltage reference and a current reference.

23. The ion sensor system of claim 21, wherein the ion sensor system comprises a hydronium ion sensor system.