High-density inter-package connections for ultra-thin package-on-package structures, and processes of forming same

• US 8,987,896 B2
• Filed: 09/24/2010
• Issued: 03/24/2015
• Est. Priority Date: 12/16/2009
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Cheah, Bok Eng, Periaman, Shanggar, Ooi, Kooi Chi
• Primary Examiner(s): Fan, Michele
• Application Number:
  US12/890,345
• Publication Number:
  US 20110140268A1
• Time in Patent Office: 1,642 Days
• Field of Search: 257/690, 257/723, 257/724, 257/737, 257/777, 257/E23.01, 257/E23.141
• US Class Current: 257/724
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45 of an individual wire connector
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1041 Special adaptations for top connections of the lowermost container, e.g. redistribution layer, integral interposer
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0655 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/15174 : in different layers of the multilayer substrate
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19106 : in a mirrored arrangement on two different side of a common die mounting substrate
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H05K 1/0298 : Multilayer circuits
• CPC Class Codes: H05K 1/111 : Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 1/183 : Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 1/185 : Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2201/10674 : Flip chip
• CPC Class Codes: H05K 3/10 : in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• CPC Class Codes: H05K 3/34 : by soldering
• CPC Class Codes: H05K 3/36 : Assembling printed circuits with other printed circuits H05K7/142 takes precedence
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

An apparatus includes a coreless mounting substrate and an interposer disposed on the coreless mounting substrate with a chip disposed in a recess in the interposer and upon the coreless substrate. The apparatus may include an inter-package solder bump in contact with an interconnect channel in the interposer, and a top chip package including a top package substrate and a top die disposed on the top package substrate. The top package substrate is in contact with the inter-package solder bump.

Claims

1. An apparatus, comprising:

a coreless mounting substrate;

an interposer disposed on the coreless mounting substrate, wherein the interposer includes;

a die side and a land side that is parallel planar to the die side;

a chip recess that communicates to the die side and the land side, wherein the chip recess projects a footprint onto the coreless mounting substrate;

an interconnect channel that passes through the interposer, wherein the interconnect channel is electrically coupled to the coreless substrate by contact with a substrate bump; and

a trace in the coreless mounting substrate, wherein the recess footprint is asymmetrically located with respect to a symmetry line that equally bisects the coreless substrate.

2. An apparatus, comprising:

a coreless mounting substrate;

an interposer disposed on the coreless mounting substrate, wherein the interposer includes;

a die side and a land side that is parallel planar to the die side;

a chip recess that communicates to the die side and the land side, wherein the chip recess projects a footprint onto the coreless mounting substrate;

an interconnect channel that passes through the interposer, wherein the interconnect channel is electrically coupled to the coreless substrate by contact with a substrate bump; and

a trace in the coreless mounting substrate, wherein the recess is a first recess, the apparatus further including;

a second recess spaced apart from the first recess, wherein the second recess communicates to the die side and the land side; and

wherein the first recess footprint is asymmetrically located with respect to a symmetry line that equally bisects the coreless substrate.

3. An apparatus, comprising:

a coreless mounting substrate;

an interposer disposed on the coreless mounting substrate, wherein the interposer includes;

a die side and a land side that is parallel planar to the die side;

a chip recess that communicates to the die side and the land side, wherein the chip recess projects a footprint onto the coreless mounting substrate;

an interconnect channel that passes through the interposer, wherein the interconnect channel is electrically coupled to the coreless substrate by contact with a substrate bump; and

a trace in the coreless mounting substrate, wherein the recess is a first recess, the apparatus further including;

a second recess spaced apart from the first recess, wherein the second recess communicates to the die side and the land side;

a first chip disposed on the coreless substrate in the first recess; and

a second chip disposed on the coreless substrate in the second recess, wherein the second chip is wire-bonded to the coreless substrate.