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Battery pack

  • US 8,988,044 B2
  • Filed: 03/06/2009
  • Issued: 03/24/2015
  • Est. Priority Date: 06/05/2008
  • Status: Expired due to Fees
First Claim
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1. A battery pack, comprising:

  • a bare cell comprising a cathode and an anode;

    a chip on board (COB) module, electrically connected to the cathode and to the anode of the bare cell, and configured to control current flow to or from the bare cell;

    a seating substrate to attach the COB module to the bare cell; and

    lead tabs to electrically connect the bare cell and the seating substrate,wherein the COB module comprises;

    an insulating substrate,a central processing unit positioned on a first surface of the insulating substrate,conductive pads disposed on the first surface of the insulating substrate,a plurality of terminals disposed on a second surface of the insulating substrate, wherein the second surface is opposite the first surface, anda circuit pattern printed on the first and the second surfaces of the insulating substrate and through the first surface to the second surface of the insulating substrate, wherein the circuit pattern electrically connects the conductive pads to both the terminals and to the central processing unit,wherein the central processing unit comprises;

    a plurality of electrical elements electrically connected to the circuit pattern; and

    an insulator encapsulating the plurality of the electrical elements and fixing the plurality of electrical elements to the first surface of the insulating substrate,wherein the seating substrate comprises;

    a second insulating substrate;

    conductive terminals disposed on opposing sides of the second substrate; and

    printed circuit patterns to electrically interconnect opposing pairs of the conductive terminals,wherein the conductive terminals comprise;

    a first conductive terminal and a second conductive terminal seated on an upper surface of the second insulating substrate; and

    a third conductive terminal and a fourth conductive terminal seated on a lower surface of the second insulating substrate, wherein the third conductive terminal and the fourth conductive terminal are located directly opposite the first conductive terminal and the second conductive terminal, respectively,wherein the first and second conductive terminals are connected to the conductive pads of the COB module, and wherein the third and fourth conductive terminals are connected to the lead tabs.

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