Sintered capacitor electrode including a folded connection
First Claim
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1. An apparatus comprising:
- a first electrode;
a second electrode stacked with the first electrode;
an interconnect adapted to fold upon itself to couple the first electrode to the second electrode, wherein the first electrode, the second electrode and the interconnect include a unitary substrate;
a sintered material disposed on the unitary substrate;
a third electrode stacked between the first and second electrodes; and
a case enclosing the first electrode, the second electrode, the third electrode and the interconnect.
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Abstract
This document discusses capacitive elements including a first, second and third electrode arranged in a stack. The third electrode is positioned between the first and second electrode. An interconnect includes a unitary substrate shared with the first and second electrodes. The interconnect is adapted to deform to accommodate the stacked nature of the first and second electrodes. The unitary substrate includes a sintered material disposed thereon.
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Citations
20 Claims
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1. An apparatus comprising:
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a first electrode; a second electrode stacked with the first electrode; an interconnect adapted to fold upon itself to couple the first electrode to the second electrode, wherein the first electrode, the second electrode and the interconnect include a unitary substrate; a sintered material disposed on the unitary substrate; a third electrode stacked between the first and second electrodes; and a case enclosing the first electrode, the second electrode, the third electrode and the interconnect. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 15)
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- 12. The apparatus of claim including a ribbon physically and electrically coupling the plurality of interconnects.
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16. A method, comprising:
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sintering a first material onto a first substrate portion of a unitary substrate to form a first electrode; sintering a second material onto a second substrate portion of the unitary substrate to form a second electrode; folding an interconnect of the unitary substrate upon itself, wherein the first electrode is coupled to the second electrode by the interconnect, and stacking the first electrode onto the second electrode; stacking a third electrode between the first and second electrodes; and enclosing the first electrode, the second electrode, the third electrode and the interconnect in a case. - View Dependent Claims (17, 18, 19, 20)
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Specification