Automatic fault detection and classification in a plasma processing system and methods thereof
First Claim
1. A method for detecting a first fault condition of a plurality of fault conditions during processing of a first substrate, said method comprising:
- collecting first data via sensors during said processing of said substrate, wherein said first data includes a first set of samples and a second set of samples;
sending said first data to a fault device;
processing said first data via said fault device includingdetermining a corrected fault vector includingdetermining a drift vector corresponding to drift in one or more parameters of a plasma processing chamber,determining an uncorrected fault vector based on the first set of samples and the second set of samples, andbased on the drift vector, correcting the uncorrected fault vector to generate the corrected fault vector, andcomparing a first portion of said first data to a plurality of fault models stored within a fault library, wherein said plurality of fault models correspond respectively to said plurality of fault conditions, wherein said plurality of fault models include respective ones of (i) a plurality of fault vectors, (ii) a plurality of fault boundaries, and (iii) sets of principal component analysis (PCA) parameters, and wherein said plurality of fault vectors include said corrected fault vector; and
detecting said first fault condition based on said comparing of said first portion of said first data to said plurality of fault models.
1 Assignment
0 Petitions
Accused Products
Abstract
A method for automatically detecting fault conditions and classifying the fault conditions during substrate processing is provided. The method includes collecting processing data by a set of sensors during the substrate processing. The method also includes sending the processing data to a fault detection/classification component. The method further includes performing data manipulation of the processing data by the fault detection/classification component. The method yet also includes executing a comparison between the processing data and a plurality of fault models stored within a fault library. Each fault model of the plurality of fault models represents a set of data characterizing a specific fault condition. Each fault model includes at least a fault signature, a fault boundary, and a set of principal component analysis (PCA) parameters.
-
Citations
25 Claims
-
1. A method for detecting a first fault condition of a plurality of fault conditions during processing of a first substrate, said method comprising:
-
collecting first data via sensors during said processing of said substrate, wherein said first data includes a first set of samples and a second set of samples; sending said first data to a fault device; processing said first data via said fault device including determining a corrected fault vector including determining a drift vector corresponding to drift in one or more parameters of a plasma processing chamber, determining an uncorrected fault vector based on the first set of samples and the second set of samples, and based on the drift vector, correcting the uncorrected fault vector to generate the corrected fault vector, and comparing a first portion of said first data to a plurality of fault models stored within a fault library, wherein said plurality of fault models correspond respectively to said plurality of fault conditions, wherein said plurality of fault models include respective ones of (i) a plurality of fault vectors, (ii) a plurality of fault boundaries, and (iii) sets of principal component analysis (PCA) parameters, and wherein said plurality of fault vectors include said corrected fault vector; and detecting said first fault condition based on said comparing of said first portion of said first data to said plurality of fault models. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 21, 22, 23, 24, 25)
-
-
11. A system for detecting a first fault condition of a plurality of fault conditions during processing of a first substrate within a plasma processing chamber, the system comprising:
-
sensors configured for monitoring said plasma processing chamber during said processing of said first substrate; a fault library configured to store a plurality of fault models, wherein each of said plurality of fault models correspond respectively to said plurality of fault conditions; and a fault device configured to (i) collect first data from said sensors, wherein said first data includes a first set of samples and a second set of samples, and (ii) analyze a first portion of said first data including determining a corrected fault vector including determining a drift vector corresponding to drift in one or more parameters of said plasma processing chamber, determining an uncorrected fault vector based on the first set of samples and the second set of samples, and based on the drift vector, correcting the uncorrected fault vector to generate the corrected fault vector, comparing said first portion of said first data to at least one of said plurality of fault models, wherein said plurality of fault models include respective ones oft (i) a plurality of fault vectors, (ii) a plurality of fault boundaries, and sets of principal component analysis (PCA) parameters, wherein said plurality of fault vectors include said corrected fault vector, and wherein said at least one of said plurality of fault models includes said corrected fault vector, and detecting said first fault condition based on said comparing of said first portion of said first data to said at least one of said plurality of fault models. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
-
Specification