Parallel thermoelectric heat exchange systems

• US 8,991,194 B2
• Filed: 04/22/2013
• Issued: 03/31/2015
• Est. Priority Date: 05/07/2012
• Status: Active Grant

• Current Assignee: Phononic, Inc.
• Original Assignee: Phononic Devices, Inc.
• Inventors: Edwards, Jesse W., June, M. Sean, Therrien, Robert Joseph, Yadav, Abhishek
• Primary Examiner(s): Ciric, Ljiljana
• Assistant Examiner(s): COX, ALEXIS K
• Application Number:
  US13/867,589
• Publication Number:
  US 20130291561A1
• Time in Patent Office: 708 Days
• Field of Search: 62/31, 62/32, 62/36, 62/37
• US Class Current: 62/3.6
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: F25B 21/04 reversible
• CPC Class Codes: F25B 23/006 boiling cooling systems
• CPC Class Codes: F25B 2321/021 Control thereof
• CPC Class Codes: F25B 2321/0212 of electric power, current or voltage
• CPC Class Codes: F25B 2321/023 Mounting details thereof
• CPC Class Codes: F25B 2321/025 Removal of heat
• CPC Class Codes: F25B 2321/0252 by liquids or two-phase fluids
• CPC Class Codes: F25B 2700/2104 of an indoor room or compartment
• CPC Class Codes: Y02B 30/00 Energy efficient heating, ventilation or air conditioning [HVAC]

Abstract

Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s).

Claims

1. A thermoelectric refrigeration system comprising:

a cooling chamber; and

a plurality of parallel thermoelectric heat exchange systems configured to extract heat from the cooling chamber and reject the heat to an external environment; and

wherein the plurality of parallel thermoelectric heat exchange systems comprises;

a first heat exchange system comprising;

a first thermoelectric heat exchanger comprising a hot side heat sink, a cold side heat sink, and a first plurality of thermoelectric coolers disposed between the hot heat sink and the cold side heat sink of the first thermoelectric heat exchanger, wherein each thermoelectric cooler of the first plurality of thermoelectric coolers is a module comprising a plurality of thermoelectric devices; and

a first reject loop that is coupled to the hot side heat sink of the first thermoelectric heat exchanger and in thermal contact with an exterior wall of the thermoelectric refrigeration system; and

a second heat exchange system comprising;

a second thermoelectric heat exchanger comprising a hot side heat sink, a cold side heat sink, and a second plurality of thermoelectric coolers disposed between the hot side heat sink and the cold side heat sink of the second thermoelectric heat exchanger, wherein each thermoelectric cooler of the second plurality of thermoelectric coolers is a module comprising a plurality of thermoelectric devices; and

a second reject loop that is coupled to the hot side heat sink of the second thermoelectric heat exchanger and in the thermal contact with the exterior wall of the thermoelectric refrigeration system;

wherein the first reject loop and the second reject loop are thermally in parallel and are not fluidly connected.

2. The thermoelectric refrigeration system of claim 1 wherein:

the first reject loop operates according to thermosiphon principles such that, when the first thermoelectric heat exchanger is active, the first reject loop provides passive, two-way transport of a medium through the first reject loop such that heat extracted from the cooling chamber by the first thermoelectric heat exchanger is rejected to the external environment; and

the second reject loop operates according to thermosiphon principles such that, when the second thermoelectric heat exchanger is active, the second reject loop provides passive, two-way transport of a medium through the second reject loop such that heat extracted from the cooling chamber by the second thermoelectric heat exchanger is rejected to the external environment.

3. The thermoelectric refrigeration system of claim 2 further comprising thermal insulation comprising at least one of a group consisting of:

thermal insulation between the first and second thermoelectric heat exchangers and the cooling chamber and thermal insulation between the first and second thermoelectric heat exchangers and the external environment.

4. The thermoelectric refrigeration system of claim 3 wherein:

the first reject loop operates as a thermal diode that together with the thermal insulation operates to prevent heat leak back into the cooling chamber when the first thermoelectric heat exchanger is deactivated; and

the second reject loop operates as a thermal diode that together with the thermal insulation operates to prevent heat leak back into the cooling chamber when the second thermoelectric heat exchanger is deactivated.

5. The thermoelectric refrigeration system of claim 1, wherein the first heat exchange system further comprises:

a first accept loop that is coupled to the cold side heat sink of the first thermoelectric heat exchanger and in thermal contact with an interior wall of the thermoelectric refrigeration system that defines the cooling chamber; and

a second heat exchange system further comprises;

a second accept loop that is coupled to the cold side heat sink of the second thermoelectric heat exchanger and in thermal contact with the interior wall of the thermoelectric refrigeration system that defines the cooling chamber.

6. The thermoelectric refrigeration system of claim 5 wherein the first and second accept loops are integrated onto the interior wall.

7. The thermoelectric refrigeration system of claim 5 wherein the first and second accept loops are integrated into the interior wall.

8. The thermoelectric refrigeration system of claim 5 wherein the first and second reject loops are integrated onto the interior wall.

9. The thermoelectric refrigeration system of claim 5 wherein the first and second reject loops are integrated into the interior wall.

10. The thermoelectric refrigeration system of claim 5 wherein:

the first accept loop operates according to thermosiphon principles such that, when the first thermoelectric heat exchanger is active, the first accept loop provides passive, two-way transport of a cooling medium through the first accept loop such that heat is extracted from the cooling chamber; and

the second accept loop operates according to thermosiphon principles such that, when the second thermoelectric heat exchanger is active, the second accept loop provides passive, two-way transport of a cooling medium through the second accept loop such that heat is extracted from the cooling chamber.

11. The thermoelectric refrigeration system of claim 10 further comprising thermal insulation comprising at least one of a group consisting of:

thermal insulation between the first and second thermoelectric heat exchangers and the cooling chamber and thermal insulation between the first and second thermoelectric heat exchangers and the external environment.

12. The thermoelectric refrigeration system of claim 11 wherein:

the first accept loop operates as a thermal diode that together with the thermal insulation operates to prevent heat leak back into the cooling chamber when the first thermoelectric heat exchanger is deactivated; and

the second accept loop operates as a thermal diode that together with the thermal insulation operates to prevent heat leak back into the cooling chamber when the second thermoelectric heat exchanger is deactivated.

13. The thermoelectric refrigeration system of claim 5 wherein:

the first accept loop and the first reject loop both operate according to thermosiphon principles such that, when the first thermoelectric heat exchanger is active, the first accept loop provides passive, two-way transport of a cooling medium through the first accept loop such that heat is extracted from the cooling chamber and the first reject loop provides passive, two-way transport of a heat transfer medium through the first reject loop such that the heat extracted from the cooling chamber by the first accept loop is rejected to the external environment; and

the second accept loop and the second reject loop both operate according to thermosiphon principles such that, when the second thermoelectric heat exchanger is active, the second accept loop provides passive, two-way transport of a cooling medium through the second accept loop such that heat is extracted from the cooling chamber and the second reject loop provides passive, two-way transport of a heat transfer medium through the second reject loop such that the heat extracted from the cooling chamber by the second accept loop is rejected to the external environment.

14. The thermoelectric refrigeration system of claim 13 further comprising thermal insulation between the first and second thermoelectric heat exchangers and the cooling chamber and thermal insulation between the first and second thermoelectric heat exchangers and the external environment.

15. The thermoelectric refrigeration system of claim 14 wherein:

the first accept loop and the first reject loop operate as thermal diodes that together with the thermal insulation between the first thermoelectric heat exchanger and the cooling chamber and the thermal insulation between the first thermoelectric heat exchanger and the external environment operates to prevent heat leak back into the cooling chamber when the first thermoelectric heat exchanger is deactivated; and

the second accept loop and the second reject loop operate as thermal diodes that together with the thermal insulation between the second thermoelectric heat exchanger and the cooling chamber and the thermal insulation between the second thermoelectric heat exchanger and the external environment operates to prevent heat leak back into the cooling chamber when the second thermoelectric heat exchanger is deactivated.

16. The thermoelectric refrigeration system of claim 1 wherein each thermoelectric heat exchange system of the plurality of parallel thermoelectric heat exchange systems comprises the thermoelectric heat exchanger.

17. The thermoelectric refrigeration system of claim 16 further comprising a controller that is configured to separately control the thermoelectric heat exchangers of the plurality of parallel thermoelectric heat exchange systems.

18. The thermoelectric refrigeration system of claim 17, wherein each thermoelectric heat exchange system of the plurality of parallel thermoelectric heat exchange systems, the thermoelectric heat exchanger of the thermoelectric heat exchange system comprises:

a hot side heat sink;

a cold side heat sink; and

a plurality of thermoelectric coolers disposed between the hot side heat sink and the cold side heat sink, wherein each thermoelectric cooler of the plurality of thermoelectric coolers is a module comprising a plurality of thermoelectric devices.

19. The thermoelectric refrigeration system of claim 18 wherein the controller is further configured to, for each thermoelectric heat exchange system of the plurality of parallel thermoelectric heat exchange systems, separately control two or more different subsets of the plurality of thermoelectric coolers of the thermoelectric heat exchanger of the thermoelectric heat exchange system.