Microelectromechanical system

• US 8,991,253 B2
• Filed: 09/23/2011
• Issued: 03/31/2015
• Est. Priority Date: 09/28/2010
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Theuss, Horst
• Primary Examiner(s): Williams, Hezron E
• Assistant Examiner(s): Shabman, Mark A
• Application Number:
  US13/241,333
• Publication Number:
  US 20120073372A1
• Time in Patent Office: 1,285 Days
• Field of Search: 735/143.8
• US Class Current: 73/514.35
• CPC Class Codes: G01P 15/08 with conversion into electric or magnetic values
• CPC Class Codes: G01P 15/105 by magnetically sensitive devices
• CPC Class Codes: G01P 15/11 by inductive pick-up
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: G01P 15/125 by capacitive pick-up

Abstract

In various embodiments, a microelectromechanical system may include a chip, a substrate, a signal generator, and a fixing structure configured to fix the chip to the substrate. The chip may be fixed in such a way that, upon an acceleration of the microelectromechanical system, the chip is moved relative to the substrate. Furthermore, a signal may be generated by the movement of the chip by means of the signal generator.

Claims

1. A microelectromechanical system, comprising:

a chip;

a substrate;

a signal generator; and

a coupling structure configured to couple the chip to the substrate;

wherein the chip is coupled in such a way that, upon an acceleration of the microelectromechanical system, the chip is moved relative to the substrate, and wherein a signal is generated by the relative movement of the chip by means of the signal generator;

wherein the chip is embodied as a signal detector and evaluator, comprising a signal detection and evaluation circuit; and

wherein the chip has a transponder.

2. The microelectromechanical system as claimed in claim 1,

wherein the substrate forms a hollow body, and

wherein the chip is coupled within the hollow body.

3. The microelectromechanical system as claimed in claim 1,

wherein the signal generator comprises at least one coil for generating magnetic fields.

4. The microelectromechanical system as claimed in claim 1,

wherein the signal generator comprises electrodes configured to generate capacitive effects.

5. The microelectromechanical system as claimed in claim 1,

wherein the signal generator comprises at least one flexible connecting element for generating piezoresistive signals.

6. The microelectromechanical system as claimed in claim 1, wherein the fixing structure configured to couple the chip comprises elastic connecting elements.

7. The microelectromechanical system as claimed in claim 6, wherein the coupling structure configured to couple the chip comprises at least one helical spring.

8. The microelectromechanical system as claimed in claim 6, wherein the coupling structure configured to couple the chip comprises at least one bent leadframe lamina.

9. The microelectromechanical system as claimed in claim 6, wherein the coupling structure configured to couple the chip comprises a connecting structure configured to generate piezoresistive signals.

10. The microelectromechanical system as claimed in claim 1, wherein the coupling structure configured to couple the chip comprises an elastic adhesive.

11. The microelectromechanical system as claimed in claim 10, wherein the chip is at least partly embedded in the elastic adhesive.

12. The microelectromechanical system as claimed in claim 1, wherein the elastic adhesive at least partly fills the hollow body.