Light emitting devices for light emitting diodes (LEDS)

• US 8,994,057 B2
• Filed: 10/11/2013
• Issued: 03/31/2015
• Est. Priority Date: 02/16/2011
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Hussell, Christopher P.
• Primary Examiner(s): LE, DUNG ANH
• Application Number:
  US14/052,201
• Publication Number:
  US 20140097454A1
• Time in Patent Office: 536 Days
• Field of Search: 257/81, 257/84, 257/88, 257 98-100, 257433-434, 257348-348, 257 12- 13, 438 47- 52, 438 27- 28, 438/E31.117, 438/E21.592, 438/22, 313/501, 313/503, 313506-507, 313509-510, 313/512, 313/112
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a submount and a light emission area disposed over the submount. The light emission area can include one or more light emitting diodes (LEDs), a fillet at least partially disposed about the one or more the LEDs, and filling material. The filling material can be disposed over a portion of the one or more LEDs and a portion of the fillet.

Claims

1. A light emitting device, comprising:

a submount comprising at least one of a dielectric layer, a core layer, a solder mask layer and one or more reflection layer;

a light emission area disposed over the submount, wherein the light emission area comprises at least one light emitting diode (LED); and

a fillet at least partially disposed about the light emission area, wherein the fillet comprises a substantially horizontal surface disposed against the reflection layer and the fillet further comprises a substantially vertical surface disposed against at least one or more of the dielectric layer and the solder mask layer.

2. The light emitting device of claim 1, wherein a right angle is formed at an intersection of the substantially horizontal and the substantially vertical surfaces of the fillet, and the fillet comprises a curved upper surface.

3. The light emitting device of claim 2, wherein the curved upper surface of the fillet is concave.

4. The light emitting device of claim 1, further comprising retention material at least partially disposed about the light emission area and above a portion of the submount.

5. The light emitting device of claim 1, wherein the reflection layer is disposed between the core layer and a portion of the light emission area.

6. The light emitting device of claim 1, further comprising a filling material disposed over a portion of the light emission area and the fillet.

7. The light emitting device of claim 1, wherein the fillet and the at least one LED are each disposed along a planar surface of the submount.