Microelectromechanical system and method
First Claim
1. A microelectromechanical system, comprising:
- a first element and a second element, the first element having a first conductive surface facing a second conductive surface of the second element;
wherein at least one of the first element and the second element is operable to constrainedly move nearer and farther from the other element; and
at least one insulating separating member which is operable to mechanically maintain a separation between the first surface and the second surface, wherein;
the insulating separating member comprises a first contact area which couples with the first surface and a second contact area which contacts with the second surface at least when the first element and the second element are nearest to one another;
wherein the first contact area defines a first projection which is a projection of a circumference of the first contact area on a reference plane which is substantially parallel to at least one of the first surface and the second surface, and the second contact area defines a second projection which is a projection of a circumference of the second contact area on the reference plane;
wherein a minimal distance between the first projection and the second projection is larger than a minimal separation maintained by the insulating separating member between the first element and the second element.
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Accused Products
Abstract
A microelectromechanical system, including a first element and a second element, the first element having a first conductive surface facing a second conductive surface of the second element; wherein at least one of the first element and the second element is operable to constrainedly move nearer and farther from the other element; and at least one insulating separating member which is operable to mechanically maintain a separation between the first surface and the second surface, wherein a minimal distance between a first projection of a first contact area of the insulating separating member and a second projection of a second contact area of the insulating separating member is larger than a minimal separation maintained by the insulating separating member between the first element and the second element.
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Citations
19 Claims
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1. A microelectromechanical system, comprising:
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a first element and a second element, the first element having a first conductive surface facing a second conductive surface of the second element;
wherein at least one of the first element and the second element is operable to constrainedly move nearer and farther from the other element; andat least one insulating separating member which is operable to mechanically maintain a separation between the first surface and the second surface, wherein; the insulating separating member comprises a first contact area which couples with the first surface and a second contact area which contacts with the second surface at least when the first element and the second element are nearest to one another; wherein the first contact area defines a first projection which is a projection of a circumference of the first contact area on a reference plane which is substantially parallel to at least one of the first surface and the second surface, and the second contact area defines a second projection which is a projection of a circumference of the second contact area on the reference plane; wherein a minimal distance between the first projection and the second projection is larger than a minimal separation maintained by the insulating separating member between the first element and the second element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A microelectromechanical system, comprising:
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a first element and a second element, the first element having a first conductive surface facing a second conductive surface of the second element;
wherein at least one of the first element and the second element is operable to constrainedly move nearer and farther from the other element; andat least one insulating separating member which is operable to mechanically maintain a separation between the first surface and the second surface, wherein; the insulating separating member comprises a first contact area which couples with the first surface and a second contact area which contacts with the second surface at least when the first element and the second element are nearest to one another; wherein the first contact area defines a first projection which is a projection of a circumference of the first contact area on a reference plane which is substantially parallel to at least one of the first surface and the second surface, and the second contact area defines a second projection which is a projection of a circumference of the second contact area on the reference plane; wherein a minimal distance between the first projection and the second projection is larger than 0.2 μ
m. - View Dependent Claims (12, 13)
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14. A microelectromechanical system, comprising:
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a first element and a second element, the first element having a first conductive surface facing a second conductive surface of the second element;
wherein at least one of the first element and the second element is operable to constrainedly move nearer and farther from the other element; andat least one insulating separating member which is operable to mechanically maintain a separation between the first surface and the second surface, wherein; the insulating separating member comprises a first contact area which couples with the first surface and a second contact area which contacts with the second surface at least when the first element and the second element are nearest to one another; wherein the first contact area defines a first projection which is a projection of a circumference of the first contact area on a reference plane which is substantially parallel to at least one of the first surface and the second surface, and the second contact area defines a second projection which is a projection of a circumference of the second contact area on the reference plane; wherein a minimal distance between the first projection and the second projection is larger than a manufacturing accuracy of the separating member. - View Dependent Claims (15, 16)
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17. A method for fabrication of a microelectromechanical system, the method comprising:
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obtaining a semiconductor substrate; and deposing a plurality of material layers onto the substrate, thereby generating the microelectromechanical system which comprises a first element and a second element, the first element having a first conductive surface facing a second conductive surface of the second element;
wherein at least one of the first element and the second element is operable to constrainedly move nearer and farther from the other element; and
at least one insulating separating member which is operable to mechanically maintain a separation between the first surface and the second surface;
wherein the insulating separating member comprises a first contact area which couples with the first surface and a second contact area which contacts with the second surface at least when the first element and the second element are nearest to one another;
wherein the first contact area defines a first projection which is a projection of a circumference of the first contact area on a reference plane which is substantially parallel to at least one of the first surface and the second surface, and the second contact area defines a second projection which is a projection of a circumference of the second contact area on the reference plane;
wherein a minimal distance between the first projection and the second projection is larger than a minimal separation maintained by the insulating separating member between the first element and the second element. - View Dependent Claims (18, 19)
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Specification