Conformal surface wave feed

• US 8,994,609 B2
• Filed: 09/23/2011
• Issued: 03/31/2015
• Est. Priority Date: 09/23/2011
• Status: Active Grant

• Current Assignee: HRL Laboratories LLC (The Boeing Co.)
• Original Assignee: HRL Laboratories LLC (The Boeing Co.)
• Inventors: Gregoire, Daniel J.
• Primary Examiner(s): DUONG, DIEU HIEN
• Application Number:
  US13/242,102
• Publication Number:
  US 20130285871A1
• Time in Patent Office: 1,285 Days
• Field of Search: 343/700.MS, 343/909, 343/850, 343/863, 343/756
• US Class Current: 343/909
• CPC Class Codes: H01Q 13/20 Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
• CPC Class Codes: H01Q 13/26 Surface waveguide constituted by a single conductor, e.g. strip conductor

Abstract

A transmission line feed for a surface wave medium having a dielectric substrate with an array of electrically conductive patches formed thereon. The transmission line feed includes a microstrip substrate, the microstrip substrate having a first permittivity which is lower than a second permittivity of the dielectric substrate of the surface wave medium, the microstrip substrate abutting against the dielectric substrate of the surface wave medium; a tapered microstrip disposed on the microstrip substrate, the tapered microstrip tapering from a relatively narrow end to a relatively wide end, the relative wide end terminating where the microstrip substrate abuts against the surface wave substrate; and an adapter for coupling a transmission line to the relatively narrow end of the tapered microstrip.

Claims

1. A transmission line feed for a surface wave medium having a dielectric substrate with an array of electrically conductive patches formed thereon, the transmission line feed comprising:

a. a microstrip substrate, the microstrip substrate having a first permittivity which is lower than a second permittivity of the dielectric substrate of the surface wave medium, the microstrip substrate abutting against the dielectric substrate of the surface wave medium;

b. a tapered microstrip disposed on the microstrip substrate, the tapered microstrip tapering from a relatively narrow end to a relatively wide end, the relative wide end terminating where the microstrip substrate abuts against the surface wave substrate; and

c. an adapter for coupling a transmission line to the relatively narrow end of the tapered microstrip.

2. The transmission line feed of claim 1 wherein an upper surface of the surface wave substrate and an upper surface of the microstrip substrate are co-planar with each other.

3. The transmission line feed of claim 1 coupled to an AIS antenna, the AIS antenna comprising at least a portion of said surface wave medium.

4. The transmission line feed of claim 1 coupled to an AIS antenna, the AIS antenna having a substrate which abuts against the dielectric substrate of said surface wave medium.

5. The transmission line feed of claim 1 wherein the transmission line is a coaxial cable and the adapter is a coaxial cable to microstrip adapter.

6. The transmission line feed of claim 1 wherein the tapered microstrip follows a Klopfenstein taper.

7. The transmission line feed of claim 1 wherein the electrically conductive patches disposed on the surface wave medium decrease in size with increasing distance from the relatively wide end of the tapered microstrip.

8. The transmission line feed of claim 1 wherein the electrically conductive patches are metallic.

9. The transmission line feed of claim 8, wherein the metallic patches mimic a Klopfenstein impedance taper in a region immediately adjacent the relative wider end of the tapered microstrip.

10. The transmission line feed of claim 9, wherein at least a portion of the surface wave substrate with the array of electrically conductive patches formed thereon defines a surface-wave impedance matching region wherein the patches on the surface wave substrate in the surface-wave impedance matching region vary in size along a direction of surface wave propagation from and/or to said tapered microstrip.

11. The transmission line feed of claim 9 wherein the electrically conductive patches decrease in size along a direction moving away from said tapered microstrip.

12. A method of feeding RF energy to a surface wave medium having a dielectric substrate with an array of electrically conductive patches formed thereon, the RF energy being fed to said surface via a coaxial transmission line feed, said method comprising:

providing a microstrip substrate having a first permittivity which is lower than a second permittivity of the dielectric substrate of the surface wave medium;

butting the microstrip substrate against the dielectric substrate of the surface wave medium;

forming a tapered microstrip on the microstrip substrate, the tapered microstrip tapering from a relatively narrow end to a relatively wide end, the relative wide end terminating where the microstrip substrate abuts against the surface wave substrate; and

coupling the coaxial transmission line to the relatively narrow end of the tapered microstrip.

13. A method of feeding RF energy to an AIS antenna having a dielectric substrate with an array of electrically conductive patches formed thereon, the RF energy being fed to said AIS antenna via a coaxial transmission line feed, said method comprising:

providing a microstrip substrate having a first permittivity which is lower than a second permittivity of the dielectric substrate of the AIS antenna;

butting the microstrip substrate against the dielectric substrate of the AIS antenna;

forming a tapered microstrip on the microstrip substrate, the tapered microstrip tapering from a relatively narrow end to a relatively wide end, the relative wide end terminating where the microstrip substrate abuts against the AIS antenna; and

providing an adapter for coupling the coaxial transmission line to the relatively narrow end of the tapered microstrip.

14. The method of claim 13 wherein the AIS antenna has surface wave impedance taper region disposed on the dielectric substrate of the AIS antenna, the surface wave impedance taper region being disposed next to the relatively wide end of the tapered microstrip on the microstrip substrate.

15. The method of claim 13 wherein the patches in the surface-wave impedance matching region vary in size along a direction of surface wave propagation between said AIS antenna and the relatively wide end of said tapered microstrip.

16. A transmission line feed for a surface wave medium, the transmission line feed comprising:

a. a microstrip substrate abutting against the surface wave medium;

b. a tapered microstrip disposed on the microstrip substrate, the tapered microstrip tapering from a relatively narrow end to a relatively wide end, the relative wide end terminating where the microstrip substrate abuts against the surface wave medium; and

c. means for coupling a transmission line to the relatively narrow end of the tapered microstrip.

17. The transmission line feed of claim 16 wherein an upper surface of the surface wave medium and an upper surface of the microstrip substrate are co-planar with each other.

18. The transmission line feed of claim 16 coupled to an AIS antenna, the AIS antenna comprising at least a portion of said surface wave medium.

19. The transmission line feed of claim 16 coupled to an AIS antenna, the AIS antenna having a substrate which abuts against the microstrip substrate of said surface wave medium.

20. The transmission line feed of claim 16 wherein the transmission line is a coaxial cable and the adapter is a coaxial cable to microstrip adapter.

21. The transmission line feed of claim 16 wherein the tapered microstrip follows a Klopfenstein taper.

22. The transmission line feed of claim 16 wherein the surface wave medium comprises a dielectric substrate with an array of electrically conductive patches formed thereon.

23. The transmission line feed of claim 22 wherein the electrically conductive patches disposed on the surface wave medium decrease in size with increasing distance from the relatively wide end of the tapered microstrip.

24. The transmission line feed of claim 23 wherein the electrically conductive patches are metallic.

25. The transmission line feed of claim 24, wherein the metallic patches mimic a Klopfenstein impedance taper in a region immediately adjacent the relative wider end of the tapered microstrip.

26. The transmission line feed of claim 24, wherein at least a portion of the surface wave substrate with the array of electrically conductive patches formed thereon defines a surface-wave impedance matching region wherein the patches on the surface wave substrate in the surface-wave impedance matching region vary in size along a direction of surface wave propagation from and/or to said tapered microstrip.

27. The transmission line feed of claim 24, wherein the microstrip substrate has a first permittivity which is lower than a second permittivity of a dielectric substrate of the surface wave medium.

28. A method of feeding RF energy to a surface wave medium, the RF energy being fed to said surface via a coaxial transmission line feed, said method comprising:

providing a microstrip substrate;

butting the microstrip substrate against the dielectric substrate of the surface wave medium;

forming a tapered microstrip on the microstrip substrate, the tapered microstrip tapering from a relatively narrow end to a relatively wide end, the relative wide end terminating where the microstrip substrate abuts against the surface wave substrate; and

coupling the coaxial transmission line to the relatively narrow end of the tapered microstrip.

29. A method of feeding RF energy to an AIS antenna having a dielectric substrate with an array of electrically conductive patches formed thereon, the RF energy being fed to said AIS antenna via a coaxial transmission line feed, said method comprising:

providing a microstrip substrate;

butting the microstrip substrate against the dielectric substrate of the AIS antenna;

forming a tapered microstrip on the microstrip substrate, the tapered microstrip tapering from a relatively narrow end to a relatively wide end, the relative wide end terminating where the microstrip substrate abuts against the AIS antenna; and

coupling the coaxial transmission line to the relatively narrow end of the tapered microstrip.

30. The method of claim 29 wherein the AIS antenna has surface wave impedance taper region disposed on the dielectric substrate of the AIS antenna, the surface wave impedance taper region being disposed next to the relatively wide end of the tapered microstrip on the microstrip substrate.

31. The method of claim 29 wherein the patches in the surface-wave impedance matching region vary in size along a direction of surface wave propagation between said AIS antenna and the relatively wide end of said tapered microstrip.