Molded image sensor package and method

• US 8,994,860 B2
• Filed: 01/13/2012
• Issued: 03/31/2015
• Est. Priority Date: 12/08/1999
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Webster, Steven
• Primary Examiner(s): Vieaux, Gary C
• Application Number:
  US13/350,619
• Publication Number:
  US 20120112042A1
• Time in Patent Office: 1,173 Days
• Field of Search: 348/294, 438/64, 438/69, 250/239
• US Class Current: 348/294
• CPC Class Codes: G02B 7/02 for lenses supports for magnifying lenses G02B25/002
• CPC Class Codes: G02B 7/022 lens and mount having complementary engagement means, e.g. screw/thread
• CPC Class Codes: H01L 2224/32013 the layer connector being larger than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/0232 : Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H01L 31/02325 : the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H04N 23/54 : Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 : Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 : Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: Y10T 29/49002 : Electrical device making

Abstract

An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.

Claims

1. A method comprising:

mounting an image sensor die to a packaging substrate, the packaging substrate comprising;

a lower surface;

an upper surface;

a plurality of side surfaces connecting the upper and lower surfaces of the packaging substrate; and

a perimeter edge at which the upper and side surfaces of the packaging substrate meet;

electrically connecting the image sensor die to traces on the upper surface of the packaging substrate;

providing a molding comprising a lower base portion, an upper lens holder extension portion, and a window pocket between the lower base portion and the upper lens holder extension portion, where the window pocket comprises a lower shelf surface facing generally toward the lower base portion;

after said providing a molding, attaching an upper surface of a window having no optical power to the lower shelf surface of the window pocket, such that the upper surface of the window will face away from the packaging substrate and a lower surface of the window will face the packaging substrate when the molding is attached to the packaging substrate;

attaching the lower base portion of the molding to the upper surface of the packaging substrate at the perimeter edge of the packaging substrate;

supporting a lens in a lens support; and

coupling the lens support to the lens holder extension portion of the molding in a manner that provides for movement of the lens support toward and away from the image sensor die.

2. The method of claim 1, wherein said attaching an upper surface of a window comprises using adhesive to attach the upper surface of the window to the lower shelf surface of the window pocket.

3. The method of claim 1 wherein

at least one side of the lower base portion of the molding is coplanar with at least one of the plurality of side surfaces of the packaging substrate.

4. The method of claim 1, wherein the lower base portion, the packaging substrate, a first adhesive between the lower base portion and the packaging substrate, the window, and a second adhesive between the window and the lower shelf surface form an enviro-hermetically sealed cavity in which the image sensor die and the traces on the upper surface of the packaging substrate are sealed.

5. A method comprising:

providing a molding comprising a lower base portion, an upper lens holder extension portion, and a window pocket between the lower base portion and the upper lens holder extension portion, where the window pocket that comprises a lower shelf surface facing generally toward the lower base portion;

after said providing a molding, attaching an upper surface of a window having no optical power and comprising a filter to the lower shelf surface of the window pocket, such that the upper surface of the window will face away from a packaging substrate and a lower surface of the window will face the packaging substrate when the molding is attached to the packaging substrate;

coupling an exterior surface of a lens support to an interior surface of the upper lens holder extension portion in a manner that provides for focusing movement of the lens support;

attaching a lower surface of an image sensor die to an upper surface of the packaging substrate, the image sensor die comprising an upper surface comprising an active area;

attaching the lower base portion of the molding to the upper surface of the packaging substrate around the image sensor die, wherein said attaching the lower base portion of the molding comprises using an adhesive to attach the lower base portion of the molding to the upper surface of the packaging substrate without penetrating the packaging substrate; and

trimming the adhesive around a periphery of the packaging substrate.

6. The method of claim 5 wherein the molding comprises molding compound.

7. The method of claim 5 wherein the image sensor die is selected from the group consisting of a CMOS image sensor device, a charge coupled device, and a pyroelectric ceramic on CMOS device.

8. The method of claim 5 wherein said attaching the lower base portion of the molding to the upper surface of the packaging substrate comprises creating an enviro-hermetical seal between the lower base portion of the molding and the packaging substrate.

9. The method of claim 5 wherein the packaging substrate is selected from the group consisting of an alumina-based ceramic substrate, a printed circuit board substrate, a plastic glass laminated substrate, and a tape-based substrate.

10. The method of claim 5 wherein the active area is responsive to light radiation.

11. The method of claim 5 wherein the upper surface of the image sensor die comprises bond pads.

12. The method of claim 11 wherein the packaging substrate comprises traces on the upper surface of the packaging substrate, the method comprising electrically connecting the bond pads to the traces.

13. The method of claim 12 wherein said electrically connecting the bond pads to the traces comprises wire-bonding the bond pads to the traces.

14. The method of claim 12, wherein the lower base portion, the packaging substrate, the adhesive between the lower base portion and the packaging substrate, the window, and a second adhesive between the window and the lower shelf surface form an enviro-hermetically sealed cavity in which the image sensor die and the traces on the upper surface of the packaging substrate are sealed.

15. A method comprising:

after a molding has been provided, contacting a periphery of an upper surface of a window with a lower shelf surface of the molding, the molding comprising;

a lens holder extension portion extending in an upper direction from the window, the lens holder extension portion comprising an interior surface defining a first aperture exposing the upper surface of the window; and

a base portion extending in a lower direction from the window, wherein the lower shelf surface faces generally toward the base portion of the molding;

coupling an exterior surface of a lens support to the interior surface of the lens holder extension portion in a manner that provides for movement of the lens support toward and away from the window;

supporting at least one lens in the lens support;

attaching a lower surface of an image sensor die to an upper surface of a substrate, the image sensor die comprising an upper surface comprising an active area, the upper surface of the substrate comprising exposed traces, the substrate comprising;

a lower surface opposite the upper surface of the substrates;

a plurality of side surfaces connecting the upper and lower surfaces of the substrate; and

a perimeter edge at which the upper and side surfaces of the substrate meet; and

attaching the base portion of the molding to the upper surface of the substrate around the image sensor and at the perimeter edge of the substrate, such that at least one side of the base portion of the molding is coplanar with at least one of the plurality of side surfaces of the substrate.

16. The method of claim 15, wherein said attaching the base portion of the molding to the upper surface of the substrate comprises attaching the base portion of the molding to the upper surface of the substrate with an adhesive, where the adhesive comprises a side surface that is coplanar with said at least one side of the base portion of the molding and with said at least one of the plurality of side surfaces of the substrate.

17. The method of claim 15, wherein the base portion, the substrate, a first adhesive between the base portion and the substrate, the window, and a second adhesive between the window and the lower shelf surface form an enviro-hermetically sealed cavity in which the image sensor die and the exposed traces on the upper surface of the substrate are sealed.

18. The method of claim 15 wherein the molding comprises a pocket defined, at least in part, by the lower shelf surface.

19. The method of claim 18 comprising trimming the base portion of the molding and the substrate.

20. The method of claim 18 wherein the molding comprises sides which, at least in part, define the pocket.

21. The method of claim 20 wherein the lower shelf surface extends perpendicularly from the sides of the molding.