×

Communications methods and apparatus for using a single logical link with multiple physical layer connections

  • US 8,995,466 B2
  • Filed: 12/22/2005
  • Issued: 03/31/2015
  • Est. Priority Date: 12/22/2005
  • Status: Active Grant
First Claim
Patent Images

1. A communications apparatus, comprising:

  • a logical link layer control circuit including a segmentation circuit for segmenting a packet into frames to be transmitted;

    a plurality of physical layer connection circuits coupled to said logical link layer control circuit, wherein each physical layer connection circuit is configured to maintain a separate communications link with a first node, and wherein multiple simultaneous communications links to the first node are supported through different physical layer connection circuits;

    memory comprising stored information for indicating which one of said multiple simultaneous communications links was used to transmit a frame to said first node; and

    a transmitter for transmitting the frames over the different physical layer connection circuits,wherein said logical link layer control circuit comprises a first logical link layer state, said first logical link layer state configured to provide common logical link layer control for each of said multiple simultaneous communications links, andwherein said segmentation circuit is configured to segment at least some packets directed to said first node and to allocate at least some frames of a packet to be transmitted over different ones of said multiple simultaneous communications links.

View all claims
  • 5 Assignments
Timeline View
Assignment View
    ×
    ×