Method and system for controlling power for a power amplifier utilizing a leaky wave antenna

• US 8,995,937 B2
• Filed: 06/09/2010
• Issued: 03/31/2015
• Est. Priority Date: 06/09/2009
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza, Rofougaran, Maryam
• Primary Examiner(s): Kim, Wesley
• Assistant Examiner(s): Chan, Richard
• Application Number:
  US12/797,029
• Publication Number:
  US 20100311364A1
• Time in Patent Office: 1,756 Days
• Field of Search: 330/124, 455/127
• US Class Current: 455/127.1
• CPC Class Codes: G01S 13/06 Systems determining position data of a target
• CPC Class Codes: G06K 7/10316 using at least one antenna particularly designed for interrogating the wireless record carriers antennas in general H01Q1/22
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 13/20 Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
• CPC Class Codes: H01Q 13/22 Longitudinal slot in boundary wall of waveguide or transmission line H01Q13/203 takes precedence
• CPC Class Codes: H01Q 15/006 Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
• CPC Class Codes: H01Q 15/0066 said selective devices being reconfigurable, tunable or controllable, e.g. using switches
• CPC Class Codes: H01Q 15/23 Combinations of reflecting surfaces with refracting or diffracting devices
• CPC Class Codes: H01Q 19/06 using refracting or diffracting devices, e.g. lens radome H01Q1/42
• CPC Class Codes: H04B 1/0458 Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages matching circuits in general H03H
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04B 7/24 for communication between two or more posts wireless communication networks H04W

Abstract

Methods and systems for controlling power for a power amplifier utilizing a leaky wave antenna (LWA) are disclosed and may include configuring one or more power amplifiers (PAs) in a wireless device at a desired output power level. The PAs may be coupled to feed points on the LWAs that may exhibit an input impedance corresponding to an output impedance of the PAs. RF signals may be transmitted utilizing the LWAs. A resonant frequency of the LWAs may be configured utilizing micro-electro-mechanical systems (MEMS) deflection. The LWAs may be configured to transmit the RF signals in a desired direction. The LWAs may comprise microstrip or coplanar waveguides, wherein a cavity height of the LWAs is dependent on spacing between conductive lines in the waveguides. The input impedances of the feed points may be dependent on a position of the feed points in the cavities.

Claims

1. A method for communication, the method comprising:

configuring a power amplifier in a wireless device to operate at a desired power level;

coupling said configured power amplifier to one of a plurality of feed points within a cavity of a leaky wave antenna, wherein each of said plurality of feed points within said cavity each has a different height, and the one of the plurality of feed points to which the power amplifier is coupled has an input impedance corresponding to an output impedance of said power amplifier; and

transmitting wireless RF signals utilizing said leaky wave antenna via said coupled one of the plurality of feed points.

2. The method according to claim 1, comprising configuring a resonant frequency of said leaky wave antenna utilizing micro-electro-mechanical systems (MEMS) deflection.

3. The method according to claim 1, comprising configuring said leaky wave antenna to transmit said RF signals in a desired direction.

4. The method according to claim 1, wherein said leaky wave antenna comprises a microstrip waveguide.

5. The method according to claim 4, wherein a cavity height of said leaky wave antenna is dependent on spacing between conductive lines in said microstrip waveguide.

6. The method according to claim 1, wherein said leaky wave antenna comprises a coplanar waveguide.

7. The method according to claim 6, wherein a cavity height of said leaky wave antenna is dependent on spacing between conductive lines in said coplanar waveguide.

8. The method according to claim 1, wherein said input impedances of said plurality of feed points depend on a position of each of said plurality of feed points in said leaky wave antenna.

9. The method according to claim 1, wherein said leaky wave antenna is integrated in one of:

an integrated circuit, an integrated circuit package, or a printed circuit board.

10. The method according to claim 9, wherein said integrated circuit is flip-chip-bonded to said integrated circuit package that is coupled to said printed circuit board.

11. A system for enabling communication, the system comprising:

a circuit in a wireless device comprising a leaky wave antenna, said circuit including a power amplifier and being configured to;

configure said power amplifier in said wireless device at a desired output power level;

couple said configured power amplifier to one of a plurality of feed points within a cavity of said leaky wave antenna, wherein each of said plurality of feed points within said cavity has a different height, and the one of the plurality of feed points to which the power amplifier is coupled has an input impedance corresponding to an output impedance of said configured power amplifier; and

transmit wireless RF signals utilizing said leaky wave antenna via said coupled one of the plurality of feed points.

12. The system according to claim 11, wherein said circuit configures a resonant frequency of said leaky wave antenna utilizing micro-electro-mechanical systems (MEMS) deflection.

13. The system according to claim 11, wherein said circuit configures said leaky wave antenna to transmit said RF signals in a desired direction.

14. The system according to claim 11, wherein said leaky wave antenna comprises a microstrip waveguide.

15. The system according to claim 14, wherein a cavity height of said leaky wave antenna is dependent on spacing between conductive lines in said microstrip waveguide.

16. The system according to claim 11, wherein said leaky wave antenna comprises a coplanar waveguide.

17. The system according to claim 16, wherein a cavity height of said leaky wave antenna is dependent on spacing between conductive lines in said coplanar waveguide.

18. The system according to claim 11, wherein said input impedances of said plurality of feed points depends on on a position of each of said plurality of feed points in said leaky wave antenna.

19. The system according to claim 11, wherein said leaky wave antenna is integrated in one of:

an integrated circuit, an integrated circuit package, or a printed circuit board.

20. The system according to claim 19, wherein said integrated circuit is flip-chip-bonded to said integrated circuit package that is coupled to said printed circuit board.