Conductive vias in a substrate
First Claim
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1. A method comprising:
- forming a via hole in a substrate, the via hole having a sidewall surface and a bottom surface, the substrate comprising a photosensitive layer, the via hole extending into the photosensitive layer of the substrate;
forming a dielectric layer on the substrate, the dielectric layer covering the sidewall surface and the bottom surface of the via hole in the substrate;
after the forming the dielectric layer, performing an annealing process on the dielectric layer;
completely removing the dielectric layer from the sidewall surface of the via hole; and
forming a conductive material in the via hole in the substrate.
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Abstract
A method of forming a conductive via in a substrate includes forming a via hole covered by a dielectric layer followed by an annealing process. The dielectric layer can getter the mobile ions from the substrate. After removing the dielectric layer, a conductive material is formed in the via hole, forming a conductive via in the substrate.
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Citations
20 Claims
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1. A method comprising:
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forming a via hole in a substrate, the via hole having a sidewall surface and a bottom surface, the substrate comprising a photosensitive layer, the via hole extending into the photosensitive layer of the substrate; forming a dielectric layer on the substrate, the dielectric layer covering the sidewall surface and the bottom surface of the via hole in the substrate; after the forming the dielectric layer, performing an annealing process on the dielectric layer; completely removing the dielectric layer from the sidewall surface of the via hole; and forming a conductive material in the via hole in the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method comprising:
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forming a via hole in a substrate, wherein the substrate comprises mobile ions; forming a dielectric layer on sidewalls and bottom surfaces of the via holes; after the forming the dielectric layer, removing at least one of the mobile ions from the substrate; and completely removing the dielectric layer from sidewalls and bottom surfaces of the via holes. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification