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Optoelectronic system

  • US 8,999,736 B2
  • Filed: 07/21/2010
  • Issued: 04/07/2015
  • Est. Priority Date: 07/04/2003
  • Status: Expired due to Term
First Claim
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1. A method of making an optoelectronic system comprising:

  • providing a temporary substrate;

    providing un-packaged optoelectronic elements having sidewalls, top surfaces, and bottom surfaces, at least one of the unpackaged optoelectronic elements having an electrode provided on a side of the bottom surfaces;

    attaching the bottom surfaces to the temporary substrate such that a trench is formed between two of the un-packaged optoelectronic elements;

    providing an adhesive material to fully fill the trench and cover the un-packaged. optoelectronic elements such that the sidewalls and top surfaces of the un-packaged optoelectronic elements are fully enclosed by the adhesive material;

    providing a transparent substrate on the adhesive material; and

    removing the temporary substrate without removing all the adhesive material covering the optoelectronic elements.

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