Radiation detectors and methods of fabricating radiation detectors
First Claim
1. A method for fabricating a radiation detector, the method comprising:
- mechanically polishing at least a first surface of a semiconductor wafer using a polishing sequence including a plurality of polishing steps to form a polished first surface, wherein a last polishing step of the polishing sequence includes polishing with a slurry having a grain size smaller than about 0.1 μ
m to create the polished first surface;
growing a passivation oxide layer on a top of the polished first surface to seal and passivate the polished first surface;
depositing patterned metal contacts on a top of the passivation oxide layer having at least one pattern being (i) a pattern of pixelated anode electrodes or (ii) a pattern of pixelated anode electrodes with grid electrodes having lines of electrodes aligned along centers of gaps between the pixelated anode electrodes;
applying a protecting layer on a top of the patterned metal contacts to protect a first surface of the patterned metal contacts;
etching a second surface of the semiconductor wafer to form an etched second surface;
applying a monolithic cathode electrode on the etched second surface of the semiconductor wafer; and
removing the protecting layer from the patterned metal contacts on the first surface, wherein the patterned metal contacts are formed from one of (i) reactive metals and (ii) stiff-rigid metals for producing inter-band energy-levels in the passivation oxide layer.
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Accused Products
Abstract
Radiation detectors and methods of fabricating radiation detectors are provided. One method includes mechanically polishing at least a first surface of a semiconductor wafer using a polishing sequence including a plurality of polishing steps. The method also includes growing a passivation oxide layer on a top of the polished first surface and depositing patterned metal contacts on a top of the passivation oxide layer. The method further includes applying a protecting layer on the patterned deposited metal contacts, etching a second surface of the semiconductor and applying a monolithic cathode electrode on the etched second surface of the semiconductor. The method additionally includes removing the protecting layer from the patterned metal contacts on the first surface, wherein the patterned metal contacts are formed from one of (i) reactive metals and (ii) stiff-rigid metals for producing inter-band energy-levels in the passivation oxide layer.
20 Citations
25 Claims
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1. A method for fabricating a radiation detector, the method comprising:
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mechanically polishing at least a first surface of a semiconductor wafer using a polishing sequence including a plurality of polishing steps to form a polished first surface, wherein a last polishing step of the polishing sequence includes polishing with a slurry having a grain size smaller than about 0.1 μ
m to create the polished first surface;growing a passivation oxide layer on a top of the polished first surface to seal and passivate the polished first surface; depositing patterned metal contacts on a top of the passivation oxide layer having at least one pattern being (i) a pattern of pixelated anode electrodes or (ii) a pattern of pixelated anode electrodes with grid electrodes having lines of electrodes aligned along centers of gaps between the pixelated anode electrodes; applying a protecting layer on a top of the patterned metal contacts to protect a first surface of the patterned metal contacts; etching a second surface of the semiconductor wafer to form an etched second surface; applying a monolithic cathode electrode on the etched second surface of the semiconductor wafer; and removing the protecting layer from the patterned metal contacts on the first surface, wherein the patterned metal contacts are formed from one of (i) reactive metals and (ii) stiff-rigid metals for producing inter-band energy-levels in the passivation oxide layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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Specification