Semiconductor device and method of manufacturing same

• US 9,000,429 B2
• Filed: 07/17/2014
• Issued: 04/07/2015
• Est. Priority Date: 04/24/2002
• Status: Expired due to Term

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Yamazaki, Shunpei, Seo, Satoshi, Kuwabara, Hideaki
• Primary Examiner(s): Trinh, Hoa B
• Application Number:
  US14/334,209
• Publication Number:
  US 20150014664A1
• Time in Patent Office: 264 Days
• Field of Search: 257/40, 257/59, 257/72, 257/66, 257/93, 257/79, 257/103, 257/290, 257/217, 257/294, 257/94, 257/96, 257/97, 257/99
• US Class Current: 257/40
• CPC Class Codes: G01J 1/4228 arrangements with two or more detectors, e.g. for sensitivity compensation
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 33/0041 characterised by field-effect operation
• CPC Class Codes: H10K 2102/3026 Top emission
• CPC Class Codes: H10K 50/81 Anodes
• CPC Class Codes: H10K 50/813 characterised by their shape
• CPC Class Codes: H10K 50/818 Reflective anodes, e.g. ITO combined with thick metallic layers
• CPC Class Codes: H10K 50/82 Cathodes
• CPC Class Codes: H10K 50/824 combined with auxiliary electrodes
• CPC Class Codes: H10K 50/828 Transparent cathodes, e.g. comprising thin metal layers
• CPC Class Codes: H10K 50/841 Self-supporting sealing arrangements
• CPC Class Codes: H10K 50/856 comprising reflective means
• CPC Class Codes: H10K 50/87 Arrangements for heating or cooling
• CPC Class Codes: H10K 59/12 Active-matrix OLED [AMOLED] displays
• CPC Class Codes: H10K 59/1201 Manufacture or treatment
• CPC Class Codes: H10K 59/1213 the pixel elements being TFTs
• CPC Class Codes: H10K 59/122 Pixel-defining structures or layers, e.g. banks
• CPC Class Codes: H10K 59/124 Insulating layers formed between TFT elements and OLED elements
• CPC Class Codes: H10K 59/131 Interconnections, e.g. wiring lines or terminals
• CPC Class Codes: H10K 59/30 Devices specially adapted for multicolour light emission
• CPC Class Codes: H10K 59/35 : comprising red-green-blue [RGB] subpixels
• CPC Class Codes: H10K 59/38 : comprising colour filters or colour changing media [CCM]
• CPC Class Codes: H10K 71/00 : Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 77/10 : Substrates, e.g. flexible substrates
• CPC Class Codes: Y02E 10/549 : Organic PV cells
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A FET is formed on a semiconductor substrate, a curved surface having a radius of curvature is formed on an upper end of an insulation, a portion of a first electrode is exposed corresponding to the curved surface to form an inclined surface, and a region defining a luminescent region is subjected to etching to expose the first electrode. Luminescence emitted from an organic chemical compound layer is reflected by the inclined surface of the first electrode to increase a total quantity of luminescence taken out in a certain direction.

Claims

1. A display device comprising:

a single crystal semiconductor substrate;

a pixel portion comprising a plurality of pixels;

wherein each of the plurality of pixels comprises;

a transistor comprising a channel formation region;

a first insulating layer over the transistor;

a first electrode over the first insulating layer;

a second insulating layer covering a peripheral portion of the first electrode;

a layer comprising an organic material over the first electrode and the second insulating layer; and

a second electrode over the layer comprising the organic material,

wherein a source or a drain of the transistor is electrically connected to the first electrode,

wherein a thickness of the first electrode in a region covered by the second insulating layer is larger than a thickness of the first electrode in a region exposed from the second insulating layer,

wherein the channel formation region is in the single crystal semiconductor substrate,

wherein the channel formation region is surrounded by an element separation film which is on the single crystal semiconductor substrate, and

wherein the first electrode overlaps the element separation film.

2. The display device according to claim 1, further comprising a nitride insulating film over and in contact with the element separation film and a gate electrode of the transistor.

3. The display device according to claim 1,

wherein the element separation film is an oxide film formed by oxidation of part of the single crystal semiconductor substrate.

4. The display device according to claim 1,

wherein the element separation film is an oxide film embedded in a trench in the single crystal semiconductor substrate.

5. The display device according to claim 1, wherein the first electrode has a stacked structure of a layer containing titanium and a layer containing aluminum.

6. The display device according to claim 1, wherein the layer comprising the organic material is capable of emitting white light.

7. The display device according to claim 6, further comprising:

a light-transmitting substrate over the second electrode and a colored layer on the light-transmitting substrate.

8. The display device according to claim 1, further comprising:

a driver circuit of the pixel portion;

a controller circuit; and

a D/A converter,

wherein the driver circuit, the controller circuit and the D/A converter are fabricated on the single crystal semiconductor substrate.

9. A display module comprising the display device according to claim 1 and a FPC bonded to the single crystal semiconductor substrate.

10. An electronic equipment comprising the display module according to claim 9, wherein the electronic equipment is one selected from the group consisting of a video camera, a digital camera, a head-mount display, a car navigation, a DVD player, an electronic game equipment, a portable information terminal and a personal computer.

11. A display device comprising:

a single crystal semiconductor substrate;

a pixel portion comprising a plurality of pixels;

wherein each of the plurality of pixels comprises;

a transistor comprising a channel formation region;

a first insulating layer over the transistor;

a first electrode over the first insulating layer and having a depression portion;

a second insulating layer covering the first electrode except the depression portion;

a layer comprising an organic material over the first electrode and the second insulating layer; and

a second electrode over the layer comprising the organic material,

wherein the first electrode has a stacked structure of a layer containing titanium and a layer containing aluminum,

wherein the layer containing aluminum is in contact with the layer comprising the organic material in the depression portion,

wherein a source or a drain of the transistor is electrically connected to the first electrode,

wherein the channel formation region is in the single crystal semiconductor substrate,

wherein the channel formation region is surrounded by an element separation film which is on the single crystal semiconductor substrate, and

wherein the first electrode overlaps the element separation film.

12. The display device according to claim 11, further comprising a nitride insulating film over and in contact with the element separation film and a gate electrode of the transistor.

13. The display device according to claim 11,

wherein the element separation film is an oxide film formed by oxidation of part of the single crystal semiconductor substrate.

14. The display device according to claim 11,

wherein the element separation film is an oxide film embedded in a trench in the single crystal semiconductor substrate.

15. The display device according to claim 11, wherein the layer comprising the organic material is capable of emitting white light.

16. The display device according to claim 15, further comprising a light-transmitting substrate over the second electrode and a colored layer on the light-transmitting substrate.

17. The display device according to claim 11, further comprising:

a driver circuit of the pixel portion;

a controller circuit; and

a D/A converter,

wherein the driver circuit, the controller circuit and the D/A converter are fabricated on the single crystal semiconductor substrate.

18. A display module comprising the display device according to claim 11 and a FPC bonded to the single crystal semiconductor substrate.

19. An electronic equipment comprising the display module according to claim 18, wherein the electronic equipment is one selected from the group consisting of a video camera, a digital camera, a head-mount display, a car navigation, a DVD player, an electronic game equipment, a portable information terminal and a personal computer.

20. A display device comprising:

a single crystal semiconductor substrate;

a pixel portion comprising a plurality of pixels;

wherein each of the plurality of pixels comprises;

a first transistor comprising a first channel formation region;

a second transistor comprising a second channel formation region;

a first insulating layer over the first transistor and the second transistor;

a first electrode over the first insulating layer;

a second insulating layer covering a peripheral portion of the first electrode;

a layer comprising an organic material over the first electrode and the second insulating layer; and

a second electrode over the layer comprising the organic material,

wherein a thickness of the first electrode in a region covered by the second insulating layer is larger than a thickness of the first electrode in a region exposed from the second insulating layer,

wherein a source or a drain of the first transistor is electrically connected to a gate of the second transistor,

wherein a source or a drain of the second transistor is electrically connected to the first electrode,

wherein an element separation film is provided between the first channel formation region and the second channel formation region, and

wherein the first electrode overlaps the element separation film.

21. The display device according to claim 20, further comprising a nitride insulating film over and in contact with the element separation film and a gate electrode of each of the first transistor and the second transistor.

22. The display device according to claim 20,

wherein the element separation film is an oxide film formed by oxidation of part of the single crystal semiconductor substrate.

23. The display device according to claim 20,

wherein the element separation film is an oxide film embedded in a trench in the single crystal semiconductor substrate.

24. The display device according to claim 20, wherein the first electrode has a stacked structure of a layer containing titanium and a layer containing aluminum.

25. The display device according to claim 20, wherein the layer comprising the organic material is capable of emitting white light.

26. The display device according to claim 25, further comprising a light-transmitting substrate over the second electrode and a colored layer on the light-transmitting substrate.

27. The display device according to claim 20, further comprising:

a driver circuit of the pixel portion;

a controller circuit; and

a D/A converter,

wherein the driver circuit, the controller circuit and the D/A converter are fabricated on the single crystal semiconductor substrate.

28. A display module comprising the display device according to claim 20 and a FPC bonded to the single crystal semiconductor substrate.

29. An electronic equipment comprising the display module according to claim 28, wherein the electronic equipment is one selected from the group consisting of a video camera, a digital camera, a head-mount display, a car navigation, a DVD player, an electronic game equipment, a portable information terminal and a personal computer.