Multi-dimensional light-emitting device

• US 9,000,457 B2
• Filed: 07/19/2011
• Issued: 04/07/2015
• Est. Priority Date: 07/19/2010
• Status: Active Grant

• Current Assignee: Epistar Corporation (Ennostar, Inc.)
• Original Assignee: Epistar Corporation (Ennostar, Inc.)
• Inventors: Shen, Chien-Fu, Hon, Schang-Jing, Ko, Tsun-Kai, Hsieh, Min-Hsun, Han, Cheng Nan, Wang, Alexander Chan
• Primary Examiner(s): HENRY, CALEB E
• Application Number:
  US13/186,218
• Publication Number:
  US 20120012867A1
• Time in Patent Office: 1,358 Days
• Field of Search: 257/79, 257/88, 257/89, 361/231
• US Class Current: 257/89
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2105/12 characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
• CPC Class Codes: F21Y 2113/13 comprising an assembly of point-like light sources
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

The present application provides a multi-dimensional light-emitting device electrically connected to a power supply system. The multi-dimensional light-emitting device comprises a substrate, a blue light-emitting diode array and one or more phosphor layers. The blue light-emitting diode array, disposed on the substrate, comprises a plurality of blue light-emitting diode chips which are electrically connected. The multi-dimensional light-emitting device comprises a central area and a plurality of peripheral areas, which are arranged around the central area. The phosphor layer covers the central area. When the power supply system provides a high voltage, the central area and the peripheral areas of the multi-dimensional light-emitting device provide a first light and a plurality of second lights, respectively. The first light and the second lights are blended into a mixed light.

Claims

1. A multi-dimensional light-emitting device, comprising:

a carrier having a central region and a peripheral region surrounding the central region;

a first optoelectronic element configured to emit a first light and arranged on the central region, comprising;

a blue light-emitting diode array arranged on the carrier, and including a plurality of blue light-emitting diode chips; and

a first wavelength converter on the blue light-emitting diode array; and

a plurality of second optoelectronic elements configured to emit a second light having a wavelength longer than that of the first light, and wholly arranged on the peripheral region;

wherein at least one of the second optoelectronic elements comprises one or more red light-emitting diode chips.

2. The multi-dimensional light-emitting device of claim 1, wherein the first wavelength converter comprises a yellow wavelength converter.

3. The multi-dimensional light-emitting device of claim 2, wherein at least one of the second optoelectronic elements comprises one or more blue light-emitting diode chips and a red wavelength converter.

4. The multi-dimensional light-emitting device of claim 1, wherein at least one of the second optoelectronic elements comprises a heat dissipation structure connected to the one or more red light-emitting diode chips.

5. The multi-dimensional light-emitting device of claim 4, wherein the heat dissipation structure comprises a material selected from the group consisting of copper, aluminum, silicon, and any combination thereof.

6. The multi-dimensional light-emitting device of claim 1, wherein the first wavelength converter comprises a red wavelength converter.

7. The multi-dimensional light-emitting device of claim 1, wherein the first light can be mixed with the second light to produce a mixed light having a color temperature between 2500K and 3800K.

8. The multi-dimensional light-emitting device of claim 1, wherein the first light can be mixed with the second light to produce a mixed light having a color temperature about 3000K.

9. The multi-dimensional light-emitting device of claim 1, wherein a power ratio of the first optoelectronic element to the second optoelectronic element is ranged between 2 and 5.

10. The multi-dimensional light-emitting device of claim 1, further comprising a shading structure for preventing the second optoelectronic element from absorbing the first light from the first optoelectronic element.

11. The multi-dimensional light-emitting device of claim 1, wherein the second optoelectronic elements decrease in efficiency more than the blue light-emitting diode chip when temperature increases.

12. A multi-dimensional light-emitting device, comprising:

a carrier having a central region and a peripheral region surrounding the central region;

a first optoelectronic element configured to emit a first light and arranged on the central region, comprising;

a blue light-emitting diode array arranged on the carrier, and including a plurality of blue light-emitting diode chips; and

a first wavelength converter on the blue light-emitting diode array; and

a plurality of second optoelectronic elements configured to emit a second light having a wavelength longer than that of the first light, and wholly arranged on the peripheral region;

wherein at least one of the second optoelectronic elements comprises one or more green light-emitting diode chips.

13. The multi-dimensional light-emitting device of claim 12, wherein the first light can be mixed with the second light to produce a mixed light having a color temperature between 2500K and 3800K.

14. The multi-dimensional light-emitting device of claim 12, wherein a power ratio of the first optoelectronic element to the second optoelectronic element is ranged between 2 and 5.

15. The multi-dimensional light-emitting device of claim 12, further comprising a shading structure capable of preventing the second optoelectronic element from absorbing the first light from the first optoelectronic element.

16. A multi-dimensional light-emitting device, comprising:

a carrier having a central region and a peripheral region surrounding the central region;

a first optoelectronic element configured to emit a first light and arranged on the central region, comprising;

a blue light-emitting diode array arranged on the carrier, and including a plurality of blue light-emitting diode chips; and

a first wavelength converter on the blue light-emitting diode array; and

a plurality of second optoelectronic elements configured to emit a second light having a wavelength longer than that of the first light, and wholly arranged on the peripheral region;

wherein at least one of the second optoelectronic elements has a temperature coefficient different from that of the blue light-emitting diode chip.

17. The multi-dimensional light-emitting device of claim 16, wherein the first light can be mixed with the second light to produce a mixed light having a color temperature between 2500K and 3800K.

18. The multi-dimensional light-emitting device of claim 16, wherein a power ratio of the first optoelectronic element to the second optoelectronic element is ranged between 2 and 5.

19. The multi-dimensional light-emitting device of claim 16, further comprising a shading structure for preventing the second optoelectronic element from absorbing the first light from the first optoelectronic element.