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Package systems having an opening in a substrate thereof and manufacturing methods thereof

  • US 9,000,578 B2
  • Filed: 10/08/2010
  • Issued: 04/07/2015
  • Est. Priority Date: 10/08/2010
  • Status: Active Grant
First Claim
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1. A package system comprising:

  • a first substrate;

    a second substrate electrically coupled with the first substrate, the second substrate comprising at least one first opening; and

    at least one electrical bonding material disposed between the first substrate and the second substrate, wherein a first portion of the at least one electrical bonding material is at least partially filled in the at least one first opening, and the first substrate comprises at least one second opening.

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