Package systems having an opening in a substrate thereof and manufacturing methods thereof
First Claim
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1. A package system comprising:
- a first substrate;
a second substrate electrically coupled with the first substrate, the second substrate comprising at least one first opening; and
at least one electrical bonding material disposed between the first substrate and the second substrate, wherein a first portion of the at least one electrical bonding material is at least partially filled in the at least one first opening, and the first substrate comprises at least one second opening.
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Abstract
A package system includes a first substrate and a second substrate. The second substrate is electrically coupled with the first substrate. The second substrate includes at least one first opening. At least one electrical bonding material is disposed between the first substrate and the second substrate. A first portion of the at least one electrical bonding material is at least partially filled in the at least one first opening.
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Citations
20 Claims
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1. A package system comprising:
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a first substrate; a second substrate electrically coupled with the first substrate, the second substrate comprising at least one first opening; and at least one electrical bonding material disposed between the first substrate and the second substrate, wherein a first portion of the at least one electrical bonding material is at least partially filled in the at least one first opening, and the first substrate comprises at least one second opening. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A package system comprising:
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a first substrate comprising a semiconductor pad; a second substrate comprising a metallic pad electrically coupled with the semiconductor pad, wherein the second substrate comprises at least one first opening, and the first substrate comprises at least one second opening, and a portion of a material of the metallic pad at least partially fills the at least one first opening or the at least one second opening. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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16. A package system comprising:
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a first substrate; a second substrate electrically coupled with the first substrate, the second substrate comprising at least one first opening; and at least one electrical bonding material disposed between the first substrate and the second substrate, wherein the at least one electrical bonding material comprises a pad and at least one guard ring disposed around the pad and a gap between the pad and the at least one guard ring, wherein the first substrate comprises at least one second opening, wherein the second opening is positioned between the pad and the at least one guard ring. - View Dependent Claims (17, 18, 19, 20)
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Specification