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Complex passive design with special via implementation

  • US 9,001,031 B2
  • Filed: 07/30/2012
  • Issued: 04/07/2015
  • Est. Priority Date: 07/30/2012
  • Status: Active Grant
First Claim
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1. An integrated passive device, comprising:

  • a substrate;

    a first conductive trace over the substrate;

    a second conductive trace over the first conductive trace; and

    an interlayer dielectric between a portion of the first conductive trace and the second conductive trace to electrically isolate the first conductive trace from the second conductive trace, the interlayer dielectric having a hole, the hole being at least partially filled and defining a via to provide direct electrical connection between the conductive traces, wherein a width of the hole is greater than a width of each of the conductive traces, both widths being lateral dimensions of the device.

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