Complex passive design with special via implementation
First Claim
Patent Images
1. An integrated passive device, comprising:
- a substrate;
a first conductive trace over the substrate;
a second conductive trace over the first conductive trace; and
an interlayer dielectric between a portion of the first conductive trace and the second conductive trace to electrically isolate the first conductive trace from the second conductive trace, the interlayer dielectric having a hole, the hole being at least partially filled and defining a via to provide direct electrical connection between the conductive traces, wherein a width of the hole is greater than a width of each of the conductive traces, both widths being lateral dimensions of the device.
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Abstract
This disclosure provides systems, methods and apparatus for vias in an integrated circuit structure such as a passive device. In one aspect, an integrated passive device includes a first conductive trace and a second conductive trace over the first conductive trace with an interlayer dielectric between a portion of the first conductive trace and the second conductive trace. One or more vias are provided within the interlayer dielectric to provide electrical connection between the first conductive trace and the second conductive trace. A width of the vias is greater than a width of at least one of the conductive traces.
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Citations
34 Claims
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1. An integrated passive device, comprising:
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a substrate; a first conductive trace over the substrate; a second conductive trace over the first conductive trace; and an interlayer dielectric between a portion of the first conductive trace and the second conductive trace to electrically isolate the first conductive trace from the second conductive trace, the interlayer dielectric having a hole, the hole being at least partially filled and defining a via to provide direct electrical connection between the conductive traces, wherein a width of the hole is greater than a width of each of the conductive traces, both widths being lateral dimensions of the device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. An integrated passive device, comprising:
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a substrate; first means for conducting electricity, positioned over the substrate; second means for conducting electricity, positioned over the first conducting means; means for electrically isolating the first conducting means and the second conducting means, positioned between a portion of the first conducting means and the second conducting means; and means for providing electrical connection in the electrically isolating means between the first conducting means and the second conducting means, wherein the means for providing electrical connection is defined by a hole in the electrically isolating means, the hole being at least partially filled by the second conducting means, and wherein a width of the hole is greater than a width of each of the first conducting means and the second conducting means, both widths being lateral dimensions of the device. - View Dependent Claims (17, 18, 19, 20, 21)
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22. A method of manufacturing an integrated passive device, comprising:
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providing a substrate; depositing a first conductive trace over the substrate; depositing a first interlayer dielectric over the first conductive trace; forming a hole in the first interlayer dielectric, wherein a width of the hole is greater than a width of the first conductive trace, the hole defining a via for electrical interconnection between conductive traces; depositing a second conductive trace in the hole over the first conductive trace to form the via, wherein the width of the hole is greater than a width of the second conductive trace, both widths being lateral dimensions of the device; and depositing a second interlayer dielectric over the second conductive trace. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
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Specification