Tj temperature calibration, measurement and control of semiconductor devices
First Claim
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1. A method of providing a first semiconductor die in a semiconductor package, comprising:
- (a) embedding a plurality of temperature sensors within the first semiconductor die;
(b) scanning one or more of the plurality of temperature sensors within the first semiconductor die while the semiconductor die first is operating to determine whether a temperature at one or more locations of the operating first semiconductor die exceed a predetermined temperature;
(c) determining that one or more locations of the first semiconductor die exceed the predetermined temperature; and
(d) configuring a package in which the first semiconductor die is to be included so that the first semiconductor die is mounted atop a second semiconductor die with the one or more locations of the first semiconductor die that exceed a predetermined temperature hanging over an edge of the second semiconductor die.
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Abstract
A semiconductor device, such as a semiconductor die, is disclosed including embedded temperature sensors for scanning the junction temperature, Tj, at one or more locations of the semiconductor die while the die is operating. Once a temperature of a hot spot is detected that is above a temperature specified for the die or package containing the die, the die/package may be discarded. Alternatively, the functionality of the die may be altered in a way that reduces the temperature of the hot spots.
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Citations
28 Claims
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1. A method of providing a first semiconductor die in a semiconductor package, comprising:
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(a) embedding a plurality of temperature sensors within the first semiconductor die; (b) scanning one or more of the plurality of temperature sensors within the first semiconductor die while the semiconductor die first is operating to determine whether a temperature at one or more locations of the operating first semiconductor die exceed a predetermined temperature; (c) determining that one or more locations of the first semiconductor die exceed the predetermined temperature; and (d) configuring a package in which the first semiconductor die is to be included so that the first semiconductor die is mounted atop a second semiconductor die with the one or more locations of the first semiconductor die that exceed a predetermined temperature hanging over an edge of the second semiconductor die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of providing a controller die in a semiconductor package, comprising:
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(a) embedding a plurality of temperature sensors within the controller die; (b) scanning one or more of the plurality of temperature sensors within the controller die to determine whether a temperature at one or more locations of the controller die exceed a predetermined temperature; (c) determining that one or more locations of the controller die exceed the predetermined temperature; and (d) configuring a package in which the controller die is to be included so that the controller die is mounted atop a memory die with the one or more locations of the controller die that exceed a predetermined temperature hanging over an edge of the memory die. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28)
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13. A method of providing a first semiconductor die in a semiconductor package, comprising:
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(a) embedding a plurality of temperature sensors within the first semiconductor die; (b) scanning one or more of the plurality of temperature sensors within the first semiconductor die to determine whether a temperature at one or more locations of the first semiconductor die exceed a predetermined temperature; (c) determining that one or more locations of the first semiconductor die exceed the predetermined temperature; and (d) configuring a package in which the first semiconductor die and a second semiconductor die are to be included with the first and second semiconductor die lying one on top of the other, with the one or more locations of the first semiconductor die that exceed a predetermined temperature positioned over an edge of the second semiconductor die. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification