Gate length independent silicon-on-nothing (SON) scheme for bulk FinFETs
First Claim
1. A method for fabricating a FinFET transistor, the method comprising:
- forming fin structures overlying a semiconductor substrate, wherein each fin structure includes a channel material and extends in a longitudinal direction from a first end to a second end;
depositing an anchoring material over the fin structures;
recessing the anchoring material to form a lower trench surface bounding trenches adjacent the fin structures, wherein the anchoring material remains in contact with the first end and the second end of each fin structure; and
forming a void between the semiconductor substrate and the channel material of each fin structure with a gate length independent etching process, wherein the channel material of each fin structure is suspended over the semiconductor substrate, and wherein each void is bounded by a lower void surface that is positioned above the lower trench surface of the anchoring material.
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Abstract
Methods for fabricating integrated circuits and FinFET transistors on bulk substrates with active channel regions isolated from the substrate with an insulator are provided. In accordance with an exemplary embodiment, a method for fabricating an integrated circuit includes forming fin structures overlying a semiconductor substrate, wherein each fin structure includes a channel material and extends in a longitudinal direction from a first end to a second end. The method deposits an anchoring material over the fin structures. The method includes recessing the anchoring material to form trenches adjacent the fin structures, wherein the anchoring material remains in contact with the first end and the second end of each fin structure. Further, the method forms a void between the semiconductor substrate and the channel material of each fin structure with a gate length independent etching process, wherein the channel material of each fin structure is suspended over the semiconductor substrate.
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Citations
19 Claims
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1. A method for fabricating a FinFET transistor, the method comprising:
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forming fin structures overlying a semiconductor substrate, wherein each fin structure includes a channel material and extends in a longitudinal direction from a first end to a second end; depositing an anchoring material over the fin structures; recessing the anchoring material to form a lower trench surface bounding trenches adjacent the fin structures, wherein the anchoring material remains in contact with the first end and the second end of each fin structure; and forming a void between the semiconductor substrate and the channel material of each fin structure with a gate length independent etching process, wherein the channel material of each fin structure is suspended over the semiconductor substrate, and wherein each void is bounded by a lower void surface that is positioned above the lower trench surface of the anchoring material. - View Dependent Claims (2, 3, 4)
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5. A method for fabricating an integrated circuit, the method comprising:
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forming fin structures overlying a semiconductor substrate, wherein each fin structure includes a channel material; depositing a first dielectric material between the fin structures; removing non-selected fin structures from the semiconductor substrate to form a gap between the first dielectric material adjacent a first selected fin structure and the first dielectric material adjacent a second selected fin structure; depositing a shallow trench isolation material in the gap; recessing the first dielectric material to form trenches between adjacent fin structures, between the first selected fin structure and the shallow trench isolation material, and between the second selected fin structure and the shallow trench isolation material; forming a void between the channel material and semiconductor substrate in each fin structure to isolate the channel material; and forming a gate structure overlying the fin structure after forming the void. - View Dependent Claims (6, 7, 8, 9, 10)
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11. A method for fabricating an integrated circuit, the method comprising:
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forming a fin structure overlying a semiconductor substrate, wherein the fin structure includes an underlying layer having sidewalls, a sacrificial layer having sidewalls and overlying the underlying layer, and a channel material overlying the sacrificial layer, and wherein the fin structure is positioned between a first trench and a second trench; depositing an anchoring material in the first trench and in the second trench; recessing the anchoring material to a lower trench surface to expose the sidewalls of the sacrificial layer and a portion of the sidewalls of the underlying layer; etching through the sidewalls of the sacrificial layer and forming a void in the fin structure between the channel material and the semiconductor substrate; depositing a dielectric material in the void to create an isolation block under the channel material, wherein the isolation block has sidewalls; and forming a gate structure overlying the fin structure and in direct contact with the sidewalls of the isolation block. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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Specification