Multichip light emitting diode (LED) and method of manufacture

• US 9,006,754 B2
• Filed: 03/31/2010
• Issued: 04/14/2015
• Est. Priority Date: 01/26/2010
• Status: Active Grant

• Current Assignee: Lightizer Co., Ltd.
• Original Assignee: Lightizer Korea Co.
• Inventors: Cho, Byoung gu
• Primary Examiner(s): Whalen, Daniel
• Assistant Examiner(s): CHI, SUBERR L
• Application Number:
  US12/750,823
• Publication Number:
  US 20110241023A1
• Time in Patent Office: 1,840 Days
• Field of Search: 257/88, 257/79, 257/98
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body

Abstract

The present invention provides a multichip LED and method of manufacture in which white light is produced. Specifically, a plurality of electrically interconnected LED chips (e.g., interconnected via red metal wire) is selected for conversion of light to white light. In a typical embodiment, the LED chips comprise: a blue LED chip, a red LED chip, a green LED chip, and a target LED chip whose light output is converted to white light. A wavelength of a light output by one or more of the plurality of chips will be measured. Based on the wavelength measurement, a conformal coating is applied to the one or more of the LED chips. The conformal coating has a phosphor ratio that is based on the wavelength. Moreover, the phosphor ratio is comprised of at least one of the following colors: yellow, green, or red. Using the conformal coating the light output of the target LED is then converted to white light. In a typical embodiment, these steps are performed at the wafer level so that uniformity and consistency in results can be better obtained. Several different approaches can be implemented for isolating the coating area. Examples include the use of a paraffin wax, a silk screen, or a photo resist. Regardless, this approach allows multiple chips to be treated simultaneously.

Claims

1. A multichip light emitting diode (LED), comprising:

a plurality of LED chips fabricated on a wafer, the plurality of LED chips consisting of a blue LED chip, a red LED chip, a green LED chip, and a target LED chip, wherein the plurality of LED chips are in electrical contact with each other via a metal line;

a set of conformal coatings that cover an isolated active area of each of the plurality of LED chips fabricated on the wafer, wherein each conformal coating of the set of conformal coatings comprises a phosphor and silicon ratio producing colors selected from a group consisting of yellow, green, and red that is based on a measurement of a wavelength of a light output that is particular to an LED chip of the plurality of LED chips that is covered by the each conformal coating; and

wherein a light output of the target LED chip is converted to white light using the set of conformal coatings.

2. The multichip LED of claim 1, wherein the isolated active are is isolated by paraffin wax.

3. The multichip LED of claim 1, wherein the isolated active area is isolated by a silk screen.

4. The multichip LED of claim 1, wherein the isolated active area is isolated by a photo resist.

5. A multichip light emitting diode (LED), comprising:

a plurality of LED chips in electrical contact with each other, the plurality of LED chips consisting of a blue LED chip, a red LED chip, a green LED chip, and a target LED chip;

a set of conformal coatings that cover an isolated active area of the plurality of LED chips, wherein each conformal coating of the set of conformal coatings comprises a phosphor and silicon ratio producing colors selected from a group consisting of yellow, green, and red that is based on a measurement of a wavelength of a light output that is particular to an LED chip of the plurality of LED chips that is covered by the each conformal coating;

wherein a light output of the target LED chip is converted to white light using the set of conformal coatings; and

wherein the plurality of LED chips are interconnected with a metal line.

6. The multichip LED of claim 5, where colors are produced by a power supply.

7. The multichip LED of claim 5, wherein the isolated active area is isolated by at least one of paraffin wax, silk screen and photo resist.