Method and structure for controlling stress in a transistor channel
First Claim
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1. A semiconductor device, comprising:
- a strain layer formed over n-type transistors and p-type transistors formed on a silicon substrate; and
a first shallow-trench-isolation oxide around each of the n-type transistors and a second shallow-trench-isolation oxide around each of the p-type transistors,wherein an upper surface of the first shallow-trench-isolation oxide of the n-type transistors is at a level different than a level of an upper surface of the second shallow-trench-isolation oxide of the p-type transistors.
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Abstract
A method for manufacturing a device including an n-type device and a p-type device. In an aspect of the invention, the method involves forming a shallow-trench-isolation oxide (STI) isolating the n-type device from the p-type device. The method further involves adjusting the shallow-trench-isolation oxide corresponding to at least one of the n-type device and the p-type device such that a thickness of the shallow-trench-isolation oxide adjacent to the n-type device is different from a thickness of the shallow-trench-isolation oxide adjacent to the p-type device, and forming a strain layer over the semiconductor substrate.
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Citations
17 Claims
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1. A semiconductor device, comprising:
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a strain layer formed over n-type transistors and p-type transistors formed on a silicon substrate; and a first shallow-trench-isolation oxide around each of the n-type transistors and a second shallow-trench-isolation oxide around each of the p-type transistors, wherein an upper surface of the first shallow-trench-isolation oxide of the n-type transistors is at a level different than a level of an upper surface of the second shallow-trench-isolation oxide of the p-type transistors. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification