Package for a micro-electro mechanical device

• US 9,006,877 B2
• Filed: 10/31/2008
• Issued: 04/14/2015
• Est. Priority Date: 02/09/2004
• Status: Active Grant

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Michael, Don, Rossman, Mari J., Bower, Bradley, Haluzak, Charles Craig, Sterner, John R., Qi, Quan, Kane, John
• Primary Examiner(s): Fulk, Steven J
• Application Number:
  US12/262,288
• Publication Number:
  US 20090057790A1
• Time in Patent Office: 2,356 Days
• Field of Search: 257/E21.501, 257/E23.137, 257/682, 438/51
• US Class Current: 257/682
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate

Abstract

A package for a micro-electromechanical device (MEMS package) includes an inner enclosure having an inner cavity defined therein, and a fill port channel communicating with the inner cavity and of sufficient length to allow a quantity of adhesive to enter the fill port channel while preventing the adhesive from entering the inner cavity.

Claims

1. A package for a micro-electromechanical device (MEMS package), comprising:

an inner enclosure having an inner cavity defined therein;

a fill port channel communicating with the inner cavity and of sufficient length to allow a quantity of adhesive to enter the fill port channel while preventing the adhesive from entering the inner cavity; and

a flow control structure extending at least partially into the inner enclosure, the flow control structure preventing the adhesive from entering the cavity by physically separating the fill port channel from the inner cavity.

2. The MEMS package of claim 1, further comprising locking features formed on the flow control structure, the locking features causing the fill port channel to have a variable cross section.

3. The MEMS package of claim 2, the locking features comprising at least one tapered section to form a choke point in the fill port channel.

4. The MEMS package of claim 2, wherein the flow control structure comprises a peninsula.

5. A package for a micro-electromechanical device (MEMS package), comprising:

an inner enclosure having an inner cavity defined therein;

a fill port channel communicating with the inner cavity and of sufficient length to allow a quantity of adhesive to enter the fill port channel while preventing the adhesive from entering the inner cavity; and

a locking feature disposed within the fill port channel creating a variable cross section in the fill port channel, in which said locking feature comprises a surface angled into said fill port channel so as to gradually narrow the fill port channel thereby creating said variable cross section in the fill port channel.