Method and device for wafer scale packaging of optical devices using a scribe and break process

• US 9,006,878 B2
• Filed: 09/27/2010
• Issued: 04/14/2015
• Est. Priority Date: 12/08/2004
• Status: Active Grant

• Current Assignee: Miradia Inc. (Walsin Lihwa Corporation)
• Original Assignee: Miradia Inc. (Walsin Lihwa Corporation)
• Inventors: Yang, Xiao Charles, Chen, Dongmin, Chen, Philip
• Primary Examiner(s): Such, Matthew W
• Assistant Examiner(s): Kalam, Abul
• Application Number:
  US12/891,518
• Publication Number:
  US 20110012166A1
• Time in Patent Office: 1,660 Days
• Field of Search: None
• US Class Current: 257/684
• CPC Class Codes: B81B 2201/047 Optical MEMS not provided for in B81B2201/042 - B81B2201/045
• CPC Class Codes: B81C 1/00873 characterised by special arrangements of the devices, allowing an easier separation
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 33/483 Containers

Abstract

A multilayered integrated optical and circuit device. The device has a first substrate comprising at least one integrated circuit chip thereon, which has a cell region and a peripheral region. Preferably, the peripheral region has a bonding pad region, which has one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads. The device has a second substrate with at least one or more deflection devices thereon coupled to the first substrate. At least one or more bonding pads are exposed on the first substrate. The device has a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member. The one or more bonding pads and the antistiction region are exposed while the one or more deflection devices is maintained within the portion of the cavity region.

Claims

1. A multilayered integrated optical and circuit device, the device comprising:

a first substrate comprising a plurality of dies, each of the plurality of dies having at least one integrated circuit chip thereon, the at least one integrated circuit chip comprising a cell region and a peripheral region, the peripheral region comprising a bonding pad region, the bonding pad region comprising one or more electrical wire bonding pads and an antistiction region surrounding each of the one or more bonding pads;

a second substrate comprising a plurality of optical devices, each of the plurality of optical devices having at least one or more deflection devices thereon, wherein each of the plurality of optical devices is coupled to the at least one integrated circuit chip on the first substrate and exposing at least one or more bonding pads on the first substrate;

a transparent member overlying the second substrate and forming a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member, thereby forming a plurality of cavity regions to allow the at least one or more deflection devices in each of the plurality of optical devices to move within a portion of the plurality of cavity regions, wherein the one or more bonding pads and the antistiction region of each of the plurality of integrated circuit chips are disposed outside the cavity region while each of the plurality of optical devices are maintained within a portion of the plurality of cavity regions.

2. The device of claim 1 wherein the first substrate comprises a silicon wafer containing the at least one integrated circuit chip.

3. The device of claim 1 wherein the transparent member comprises a transparent plate coupled to a frame structure, the frame structure forming a portion of the cavity region bounded by a portion of the transparent plate.

4. The device of claim 1 wherein the transparent member comprises a covalent bond to a portion of the second substrate.

5. The device of claim 1 wherein the antistiction region comprises a metal material.

6. The device of claim 1 wherein the transparent member comprises a portion bonded to regions surrounding each of the cell regions.

7. The device of claim 1 wherein the transparent member comprises a substantially planar glass member coupled to a frame member.

8. The device of claim 7 wherein the frame member includes a plurality of cavities.

9. The device of claim 7 wherein the substantially planar glass member is sealed to the frame member.

10. A multilayered integrated optical and circuit device, the device comprising:

a first substrate comprising a plurality of dies, each of the plurality of dies having at least one integrated circuit chip thereon, the at least one integrated circuit chip comprising a cell region and a peripheral region, the peripheral region comprising a bonding pad region, the bonding pad region comprising one or more electrical wire bonding pads;

a second substrate comprising;

a plurality of optical devices, each of the plurality of optical devices having at least one or more deflection devices thereon, wherein each of the plurality of optical devices is coupled to the at least one integrated circuit chip on the first substrate and exposing at least one or more bonding pads on the first substrate; and

an antistiction region surrounding each of the one or more bonding pads and exposing at least one bonding pad from the one or more bonding pads on the first substrate; and

a transparent member overlying the second substrate and forming a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member, thereby forming a plurality of cavity regions to allow the at least one or more deflection devices in each of the plurality of optical devices to move within a portion of the plurality of cavity regions, wherein the one or more bonding pads and the antistiction region of each of the plurality of integrated circuit chips are disposed outside the cavity region while each of the plurality of optical devices are maintained within a portion of the plurality of cavity regions.

11. The multilayered integrated optical and circuit device of claim 10 wherein the first substrate is a CMOS wafer.

12. The multilayered integrated optical and circuit device of claim 10 wherein the second substrate includes single crystal silicon.

13. The multilayered integrated optical and circuit device of claim 10 wherein the antistiction region comprises at least one of aluminum, titanium, titanium nitride, gold, silver or copper.

14. The multilayered integrated optical and circuit device of claim 10 wherein the antistiction region comprises one or more dummy metal layers surrounding the one or more bonding pads.