Laser diode device
First Claim
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1. A laser diode device, comprising:
- a housing comprising a mounting part;
a laser diode chip based on a nitride compound semiconductor material disposed on the mounting part, said chip comprising, on a substrate, semiconductor layers with an active layer for generating light and said chip having a radiation coupling-out area with a radiation coupling-out region for emitting the generated light, a rear side area situated opposite the radiation coupling-out area, and side areas connecting the radiation coupling-out area and the rear side area; and
a solder layer disposed between said chip and the mounting part,wherein the laser diode chip is mounted directly on the mounting part by the solder layer and the solder layer has a thickness of greater than or equal to 3 μ
m; and
wherein the laser diode chip comprises, in an underside facing the mounting part, at least one anchoring element for the solder layer, said at least one anchoring element being formed by a depression or elevation in the underside and spaced from all edges of said chip.
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Abstract
A laser diode device is specified, comprising a housing having a mounting part and a laser diode chip based on a nitride compound semiconductor material in the housing on the mounting part, wherein the laser diode chip is mounted directly on the mounting part using a solder layer, and the solder layer has a thickness of greater than or equal to 3 μm.
25 Citations
21 Claims
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1. A laser diode device, comprising:
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a housing comprising a mounting part; a laser diode chip based on a nitride compound semiconductor material disposed on the mounting part, said chip comprising, on a substrate, semiconductor layers with an active layer for generating light and said chip having a radiation coupling-out area with a radiation coupling-out region for emitting the generated light, a rear side area situated opposite the radiation coupling-out area, and side areas connecting the radiation coupling-out area and the rear side area; and a solder layer disposed between said chip and the mounting part, wherein the laser diode chip is mounted directly on the mounting part by the solder layer and the solder layer has a thickness of greater than or equal to 3 μ
m; andwherein the laser diode chip comprises, in an underside facing the mounting part, at least one anchoring element for the solder layer, said at least one anchoring element being formed by a depression or elevation in the underside and spaced from all edges of said chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A laser diode device, comprising:
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a housing comprising a mounting part; a laser diode chip based on a nitride compound semiconductor material disposed on the mounting part, said chip comprising, on a substrate, semiconductor layers with an active layer for generating light and said chip having a radiation coupling-out area with a radiation coupling-out region for emitting the generated light, a rear side area situated opposite the radiation coupling-out area, and side areas connecting the radiation coupling-out area and the rear side area; and a solder layer disposed between said chip and the mounting part, wherein the laser diode chip is mounted directly on the mounting part by the solder layer and the solder layer has a thickness of greater than or equal to 3 μ
m,wherein the substrate is an electrically conducting substrate made of crystalline (In,Al,Ga)N, wherein the laser diode chip is mounted on the mounting part directly with the substrate or with an electrical connection layer on the side of the substrate facing away from the semiconductor layers; and wherein the laser diode chip comprises, in an underside facing the mounting part, at least one anchoring element for the solder layer, said at least one anchoring element being formed by a depression or elevation in the underside and spaced from all edges of said chip. - View Dependent Claims (20, 21)
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Specification