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Wireless bus for intra-chip and inter-chip communication, including wireless-enabled component (WEC) embodiments

  • US 9,008,589 B2
  • Filed: 09/08/2010
  • Issued: 04/14/2015
  • Est. Priority Date: 01/27/2010
  • Status: Active Grant
First Claim
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1. A wireless-enabled component (WEC), comprising:

  • a core module configured to perform one or more functions of the WEC;

    a wireless transceiver, coupled via an interface to the core module, configured to transmit or receive a data signal wirelessly to or from another WEC;

    a power interface configured to receive a modulated power signal, distinct from the data signal, from an external source and to provide power to the core module and the wireless transceiver; and

    a demodulator, coupled to the power interface, configured to demodulate the modulated power signal to generate configuration information and to provide the configuration information to the wireless transceiver and the core module.

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