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Method of fabricating an electromagnetic component

  • US 9,009,951 B2
  • Filed: 04/23/2013
  • Issued: 04/21/2015
  • Est. Priority Date: 04/24/2012
  • Status: Active Grant
First Claim
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1. A method of fabricating an electromagnetic component comprising:

  • forming a coil portion having a multi-layer stack structure wherein the step of forming the coil portion comprises;

    providing a substrate;

    forming a first patterned photoresist layer on the substrate, the first patterned photoresist layer comprising an opening;

    filling the opening with plated copper, thereby forming a first conductive trace;

    removing the first patterned photoresist layer;

    covering the first conductive trace with a dielectric layer having thereon a via hole;

    plating a copper layer over the dielectric layer, wherein the copper layer fills the via hole;

    forming a second patterned photoresist layer on the copper layer; and

    etching the copper layer not covered by the second patterned photoresist layer, thereby forming a second conductive trace stacked on the first conductive trace, wherein the first and second conductive traces constitute a winding of the coil portion;

    forming a molded body to encapsulate the coil portion, wherein the molded body comprises a magnetic material; and

    forming two electrodes to electrically connected to two terminals of the coil portion respectively.

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