Method of fabricating an electromagnetic component
First Claim
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1. A method of fabricating an electromagnetic component comprising:
- forming a coil portion having a multi-layer stack structure wherein the step of forming the coil portion comprises;
providing a substrate;
forming a first patterned photoresist layer on the substrate, the first patterned photoresist layer comprising an opening;
filling the opening with plated copper, thereby forming a first conductive trace;
removing the first patterned photoresist layer;
covering the first conductive trace with a dielectric layer having thereon a via hole;
plating a copper layer over the dielectric layer, wherein the copper layer fills the via hole;
forming a second patterned photoresist layer on the copper layer; and
etching the copper layer not covered by the second patterned photoresist layer, thereby forming a second conductive trace stacked on the first conductive trace, wherein the first and second conductive traces constitute a winding of the coil portion;
forming a molded body to encapsulate the coil portion, wherein the molded body comprises a magnetic material; and
forming two electrodes to electrically connected to two terminals of the coil portion respectively.
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Abstract
An electromagnetic component includes a coil portion with a multi-layer stack structure, a molded body encapsulating the coil portion, and two electrodes respectively coupled to two terminals of the coil portion. The coil portion is fabricated using plating, laminating and/or pressing manufacturing techniques.
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Citations
6 Claims
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1. A method of fabricating an electromagnetic component comprising:
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forming a coil portion having a multi-layer stack structure wherein the step of forming the coil portion comprises; providing a substrate; forming a first patterned photoresist layer on the substrate, the first patterned photoresist layer comprising an opening; filling the opening with plated copper, thereby forming a first conductive trace; removing the first patterned photoresist layer; covering the first conductive trace with a dielectric layer having thereon a via hole; plating a copper layer over the dielectric layer, wherein the copper layer fills the via hole; forming a second patterned photoresist layer on the copper layer; and etching the copper layer not covered by the second patterned photoresist layer, thereby forming a second conductive trace stacked on the first conductive trace, wherein the first and second conductive traces constitute a winding of the coil portion; forming a molded body to encapsulate the coil portion, wherein the molded body comprises a magnetic material; and forming two electrodes to electrically connected to two terminals of the coil portion respectively. - View Dependent Claims (2, 3, 4)
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5. A method of fabricating an electromagnetic component comprising:
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forming a coil portion having a multi-layer stack structure wherein the step of forming the coil portion comprises; providing a substrate having thereon a first patterned conductive trace; laminating the substrate with a build-up layer comprising an insulating layer and a copper foil; forming a blind via in the build-up layer; forming a plated copper layer on the build-up layer, wherein the plated copper layer fills into blind via to form a via electrically connecting the first conductive trace to the plated copper layer; and patterning the plated copper layer and the copper foil thereby forming a second patterned conductive trace, wherein the first and second patterned conductive traces constitute a winding of the coil portion; forming a molded body to encapsulate the coil portion, wherein the molded body comprises a magnetic material; and forming two electrodes to electrically connected to two terminals of the coil portion respectively. - View Dependent Claims (6)
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Specification