Process for manufacturing a Z-directed component for a printed circuit board using a sacrificial constraining material

• US 9,009,954 B2
• Filed: 06/20/2012
• Issued: 04/21/2015
• Est. Priority Date: 08/31/2011
• Status: Active Grant

• Current Assignee: Lexmark International Incorporated (Ninestar Corporation)
• Original Assignee: Lexmark International Incorporated (Ninestar Corporation)
• Inventors: Hardin, Keith Bryan, Hall, Paul Kevin, Kratzer, Zachary Charles Nathan, Zhang, Qing
• Primary Examiner(s): PHAN, THIEM D
• Application Number:
  US13/528,097
• Publication Number:
  US 20130340244A1
• Time in Patent Office: 1,035 Days
• Field of Search: 298/25, 295/921, 296/021, 29605-607, 29830-832, 298/45, 298/46, 336/178, 336/200, 336/223, 336/232
• US Class Current: 29/825
• CPC Class Codes: B28B 7/0091 Transformable moulds allowing the change of shape of an initial moulded preform by preform deformation or the change of its size by moulding on the preform
• CPC Class Codes: H01G 2/06 specially adapted for mounting on a printed-circuit support
• CPC Class Codes: H01G 4/33 Thin- or thick-film capacitors thin- or thick-film circuits H01L27/00; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor H01L28/40
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors
• CPC Class Codes: H05K 1/0251 related to vias or transitions between vias and transmission lines
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/184 Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
• CPC Class Codes: H05K 2201/09645 Patterning on via walls; Plural lands around one hole
• CPC Class Codes: H05K 2201/10053 Switch
• CPC Class Codes: H05K 2201/10984 Component carrying a connection agent, e.g. solder, adhesive soldering leadless components having an array of bottom contacts H05K3/3436; BGA components H05K2201/10734
• CPC Class Codes: H05K 3/4046 using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49153 with shaping or forcing terminal into base aperture
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes forming the Z-directed component in a cavity formed by a constraining material that defines the outer shape of the Z-directed component. The constraining material is dissipated to release the Z-directed component from the constraining material and the Z-directed component is fired.

Claims

1. A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board, comprising:

forming the Z-directed component in a cavity formed by a constraining material that defines the outer shape of the Z-directed component;

dissipating the constraining material to release the Z-directed component from the constraining material; and

firing the Z-directed component.

2. The method of claim 1, wherein the constraining material is dissipated by heat when the Z-directed component is fired.

3. The method of claim 1, wherein the constraining material is dissipated by a solvent or plasma treatment.

4. The method of claim 1, wherein forming the Z-directed component includes:

providing successive layers of the constraining material, each layer of the constraining material having a cavity formed therein defining the outer shape of a corresponding layer of the Z-directed component; and

selectively filling each cavity with at least one material to form each layer of the Z-directed component.

5. A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board, comprising:

providing successive layers of a constraining material, each layer of the constraining material having a cavity formed therein defining the outer shape of a corresponding layer of the Z-directed component;

selectively filling each cavity with at least one material to form each layer of the Z-directed component, wherein each cavity is selectively filled prior to providing the next successive layer of the constraining material;

dissipating the constraining material to release the Z-directed component from the constraining material; and

firing the Z-directed component.

6. The method of claim 5, wherein the constraining material is dissipated by heat when the Z-directed component is fired.

7. The method of claim 5, wherein the constraining material is dissipated by a solvent or plasma treatment.

8. The method of claim 5, wherein each successive layer of the constraining material is stacked on top of the previous layer of the constraining material.

9. The method of claim 8, wherein the layers of the constraining material are formed on top of a substrate that survives when the constraining material is dissipated.

10. The method of claim 9, wherein the substrate includes a depression therein that forms a tapered end of the Z-directed component.

11. The method of claim 9, wherein a top surface of the substrate is coated with a release layer and the release layer dissipates with the constraining material to release the Z-directed component from the substrate.

12. The method of claim 5, wherein at least a portion of the cavities formed in the constraining material are filled with a plurality of different materials.

13. The method of claim 12, wherein the plurality of different materials are selectively applied using photo etching techniques.

14. The method of claim 5, further comprising filling a channel extending outward from at least one of the cavities in the constraining material to form a support structure positioned to support the Z-directed component after the constraining material dissipates.

15. The method of claim 14, wherein the support structure connects adjacent Z-directed components in an array of Z-directed components.

16. The method of claim 15, wherein the support structure stair steps across at least two of the layers of the constraining material.

17. The method of claim 5, further comprising filling a channel extending outward from at least one of the cavities in the constraining material to form a support structure positioned to support the Z-directed component after the constraining material dissipates, wherein each successive layer of the constraining material is stacked on top of the previous layer of the constraining material, wherein at least a portion of the cavities formed in the constraining material are filled with a plurality of different materials, wherein the constraining material is dissipated by heat when the Z-directed component is fired.

18. A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board, comprising:

providing a first layer of a constraining material having a first cavity formed therein defining the outer shape of a first layer of the Z-directed component;

selectively filling the first cavity with at least one material to form a first layer of the Z-directed component;

combining the first layer of the Z-directed component with additional layers to form the Z-directed component;

dissipating the constraining material to release the Z-directed component from the constraining material; and

firing the Z-directed component.

19. The method of claim 18, wherein the constraining material is dissipated by heat when the Z-directed component is fired.

20. The method of claim 18, wherein the constraining material is dissipated by a solvent or plasma treatment.

21. The method of claim 18, wherein combining the first layer of the Z-directed component with additional layers to form the Z-directed component includes forming additional layers of the Z-directed component on top of the first layer of the Z-directed component.