Systems and methods for encapsulating electronics in a mountable device
First Claim
1. A method for fabricating a mountable device, the method comprising:
- fabricating a bio-compatible structure that includes an electronic component and a conductive pattern, wherein the electronic component has a first surface and a second surface opposite the first surface and includes electrical contacts on the second surface, wherein fabricating the bio-compatible structure comprises;
forming a first layer of a bio-compatible material;
positioning the first surface of the electronic component on the first layer of the bio-compatible material;
forming a second layer of the bio-compatible material over the first layer of the bio-compatible material and the second surface of the electronic component;
exposing the electrical contacts on the second surface of the electronic component by removing a portion of the second layer of the bio-compatible material;
after exposing the electrical contacts, forming the conductive pattern, wherein the conductive pattern defines sensor electrodes on the second layer of the bio-compatible material and electrical interconnects between the sensor electrodes and the electrical contacts;
forming a third layer of the bio-compatible material over the conductive pattern, wherein the third layer of the bio-compatible material includes a portion covering the sensor electrodes; and
exposing the sensor electrodes by removing the portion of the third layer of the bio-compatible material covering the sensor electrodes; and
surrounding the bio-compatible structure with a polymer, wherein the polymer defines at least one mounting surface of the mountable device.
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Accused Products
Abstract
A mountable device includes a bio-compatible structure embedded in a polymer that defines at least one mounting surface. The bio-compatible structure includes an electronic component having electrical contacts, sensor electrodes, and electrical interconnects between the sensor electrodes and the electrical contacts. The bio-compatible structure is fabricated such that it is fully encapsulated by a bio-compatible material, except for the sensor electrodes. In the fabrication, the electronic component is positioned on a first layer of bio-compatible material and a second layer of bio-compatible material is formed over the first layer of bio-compatible material and the electronic component. The electrical contacts are exposed by removing a portion of the second layer, a conductive pattern is formed to define the sensor electrodes and electrical interconnects, and a third layer of bio-compatible material is formed over the conductive pattern. The sensor electrodes are exposed by removing a portion of the third layer.
182 Citations
15 Claims
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1. A method for fabricating a mountable device, the method comprising:
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fabricating a bio-compatible structure that includes an electronic component and a conductive pattern, wherein the electronic component has a first surface and a second surface opposite the first surface and includes electrical contacts on the second surface, wherein fabricating the bio-compatible structure comprises; forming a first layer of a bio-compatible material; positioning the first surface of the electronic component on the first layer of the bio-compatible material; forming a second layer of the bio-compatible material over the first layer of the bio-compatible material and the second surface of the electronic component; exposing the electrical contacts on the second surface of the electronic component by removing a portion of the second layer of the bio-compatible material; after exposing the electrical contacts, forming the conductive pattern, wherein the conductive pattern defines sensor electrodes on the second layer of the bio-compatible material and electrical interconnects between the sensor electrodes and the electrical contacts; forming a third layer of the bio-compatible material over the conductive pattern, wherein the third layer of the bio-compatible material includes a portion covering the sensor electrodes; and exposing the sensor electrodes by removing the portion of the third layer of the bio-compatible material covering the sensor electrodes; and surrounding the bio-compatible structure with a polymer, wherein the polymer defines at least one mounting surface of the mountable device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification