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Systems and methods for encapsulating electronics in a mountable device

  • US 9,009,958 B2
  • Filed: 09/23/2013
  • Issued: 04/21/2015
  • Est. Priority Date: 03/27/2013
  • Status: Active Grant
First Claim
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1. A method for fabricating a mountable device, the method comprising:

  • fabricating a bio-compatible structure that includes an electronic component and a conductive pattern, wherein the electronic component has a first surface and a second surface opposite the first surface and includes electrical contacts on the second surface, wherein fabricating the bio-compatible structure comprises;

    forming a first layer of a bio-compatible material;

    positioning the first surface of the electronic component on the first layer of the bio-compatible material;

    forming a second layer of the bio-compatible material over the first layer of the bio-compatible material and the second surface of the electronic component;

    exposing the electrical contacts on the second surface of the electronic component by removing a portion of the second layer of the bio-compatible material;

    after exposing the electrical contacts, forming the conductive pattern, wherein the conductive pattern defines sensor electrodes on the second layer of the bio-compatible material and electrical interconnects between the sensor electrodes and the electrical contacts;

    forming a third layer of the bio-compatible material over the conductive pattern, wherein the third layer of the bio-compatible material includes a portion covering the sensor electrodes; and

    exposing the sensor electrodes by removing the portion of the third layer of the bio-compatible material covering the sensor electrodes; and

    surrounding the bio-compatible structure with a polymer, wherein the polymer defines at least one mounting surface of the mountable device.

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