Method of fabricating capacitive touch panel
First Claim
1. A method of fabricating a touch panel, comprising:
- providing a substrate;
forming a plurality of bridge components on the substrate;
forming a plurality of insulation mounds on the substrate, wherein each insulation mound covers each bridge component and exposes a portion of each bridge component; and
forming a plurality of groups of first conductive patterns arrange in a first direction, a plurality of groups of second conductive patterns arranged in a second direction, and a plurality of connection components on the substrate, wherein each first conductive pattern is electrically connected to another adjacent first conductive pattern in the same group by each connection component, each group of the second conductive patterns is interlaced with and insulated from each group of the first conductive pattern, and each second conductive pattern is electrically connected to another adjacent second conductive pattern in the same group by each bridge component below each insulation mound.
1 Assignment
0 Petitions
Accused Products
Abstract
The present disclosure relates to a method of fabricating a capacitive touch pane where a plurality of groups of first conductive patterns are formed along a first direction, a plurality of groups of second conductive patterns are formed along a second direction, and a plurality of connection components are formed on a substrate. Each first conductive pattern is electrically connected to another adjacent first conductive pattern in the same group by each connection component and each group of the second conductive patterns is interlaced with and insulated from each group of the first conductive patterns. Next, a plurality of curved insulation mounds are formed to cover the first connection components. Then, a plurality of bridge components are formed to electrically connect each second conductive pattern with another adjacent second conductive pattern in the same group.
5 Citations
10 Claims
-
1. A method of fabricating a touch panel, comprising:
-
providing a substrate; forming a plurality of bridge components on the substrate; forming a plurality of insulation mounds on the substrate, wherein each insulation mound covers each bridge component and exposes a portion of each bridge component; and forming a plurality of groups of first conductive patterns arrange in a first direction, a plurality of groups of second conductive patterns arranged in a second direction, and a plurality of connection components on the substrate, wherein each first conductive pattern is electrically connected to another adjacent first conductive pattern in the same group by each connection component, each group of the second conductive patterns is interlaced with and insulated from each group of the first conductive pattern, and each second conductive pattern is electrically connected to another adjacent second conductive pattern in the same group by each bridge component below each insulation mound. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
Specification