White LED assembly with LED string and intermediate node substrate terminals

• US 9,012,932 B2
• Filed: 05/22/2014
• Issued: 04/21/2015
• Est. Priority Date: 12/22/2011
• Status: Active Grant

• Current Assignee: Bridgelux Incorporated
• Original Assignee: Bridgelux Incorporated
• Inventors: Xu, Tao, Solomensky, Michael
• Primary Examiner(s): Nguyen, Dao H
• Application Number:
  US14/285,599
• Publication Number:
  US 20140252384A1
• Time in Patent Office: 334 Days
• Field of Search: 257/40, 257/88, 257/91, 257/98, 257/E27.12, 257/E33.001, 257/E33.061, 257/E33.067, 438/22, 438/27
• US Class Current: 257/88
• CPC Class Codes: F21K 9/64 using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
• CPC Class Codes: F21Y 2107/50 on planar substrates or supports, but arranged in different planes or with differing orientation, e.g. on plate-shaped supports with steps on which light-generating elements are mounted
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/153 in a repetitive configuration, e.g. LED bars
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/005 Processes
• CPC Class Codes: H01L 33/405 Reflective materials
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/505 : characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 : the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/54 : having a particular shape
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A white LED assembly includes a string of series-connected blue LED dice mounted on a substrate. The substrate has a plurality of substrate terminals. A first of the substrate terminals is coupled to be a part of first end node of the string. A second of the substrate terminals is coupled to be a part of an intermediate node of the string. A third of the substrate terminals is coupled to be a part of a second end node of the string. Other substrate terminals may be provided and coupled to be parts of corresponding other intermediate nodes of the string. A single contiguous amount of phosphor covers all the LED dice, but does not cover any of the substrate terminals. In one example, the amount of phosphor contacts the substrate and has a circular periphery. All the LEDs are mounted to the substrate within the circular periphery.

Claims

1. A device comprising:

a substrate having a first terminal, a second terminal, a third terminal, and a fourth terminal;

a first light emitting diode (LED);

a second LED;

a third LED, wherein the first LED, the second LED and the third LED are coupled together as a string of series-connected LEDs such that a current flows from the first terminal, through the first LED, through the second terminal, through the second LED, through the third terminal, through the third LED and to the fourth terminal; and

a single contiguous amount of phosphor that contacts the substrate and that covers the first LED, the second LED and the third LED, wherein the single contiguous amount of phosphor does not cover any of the first, second, third or fourth terminals.

2. The device of claim 1, wherein the single contiguous amount of phosphor contacts a portion of a top surface of the substrate, wherein the portion has a periphery, wherein the first LED is fixed to the substrate within the periphery, wherein the second LED is fixed to the substrate within the periphery, and wherein the third LED is fixed to the substrate within the periphery.

3. The device of claim 2, wherein the periphery has a circular shape.

4. The device of claim 3, wherein the substrate has a first corner, a second corner, a third corner and a fourth corner, wherein the first terminal is located closer to the first corner than to any of the second, third and fourth corners, wherein the second terminal is located closer to the second corner than to any of the first, third and fourth corners, wherein the third terminal is located closer to the third corner than to any of the first, second and fourth corners, and wherein the fourth terminal is located closer to the fourth corner than to any of the first, second and third corners.

5. The device of claim 1, wherein the substrate comprises a printed circuit board and a layer of highly reflective material, wherein the highly reflective material comprises silicone and titanium dioxide powder, wherein the layer of highly reflective material is disposed on a portion of a top surface of the printed circuit board, and wherein the single contiguous amount of phosphor contacts the layer of highly reflective material.

6. The device of claim 1, wherein the single contiguous amount of phosphor comprises phosphor particles suspended in a substantially transparent binding material.

7. The device of claim 1, wherein a first wire bond couples the first terminal to the first LED, wherein a second wire bond couples the second terminal to the first LED, wherein a third wire bond couples the second terminal to the second LED, wherein a fourth wire bond couples the third terminal to the second LED, wherein a fifth wire bond couples the third terminal to the third LED, wherein a fifth wire bond couples the third terminal to the third LED, and wherein a sixth wire bond couples the fourth terminal to the third LED.

8. The device of claim 7, wherein the first LED, the second LED, and the third LED are fixed to the substrate in a triangular pattern.

9. The device of claim 1, wherein the first LED is a blue LED die.

10. The device of claim 1, wherein the second terminal is a part of an intermediate node along the string.

11. A method comprising:

coupling a plurality of LED dice to a substrate such that the LED dice form a string of series-connected LED dice, such that a first terminal is a part of a first node of the string, such that a second terminal is a part of a second node of the string, such that a third terminal is a part of a third node of the string, and such that a fourth terminal is a part of a fourth node of the string; and

forming a single contiguous amount of phosphor such that the phosphor contacts the substrate and covers the string of LEDs but such that the phosphor does not cover any of the first, second, third or fourth terminals, wherein the string of series-connected LED dice, the substrate, and the single contiguous amount of phosphor together comprise an LED assembly.

12. The method of claim 11, wherein the single contiguous amount of phosphor is formed such that the single contiguous amount of phosphor contacts a portion of a top surface of the substrate, wherein the single contiguous amount of phosphor does not contact any part of the substrate other than the portion, and wherein the portion has a circular periphery.

13. The method of claim 11, wherein the coupling comprises:

wire bonding the first terminal to a first electrode of a first LED die;

wire bonding the second terminal to a second electrode of the first LED die;

wire bonding the second terminal to a first electrode of a second LED die;

wire bonding the third terminal to a second electrode of the second LED die;

wire bonding the third terminal to a first electrode of a third LED die; and

wire bonding the fourth terminal to a second electrode of the third LED die, wherein the first, second and third LED dice together are the string of series-connected LED dice.

14. The method of claim 11, wherein the coupling involves fixing the plurality of LED dice to the substrate using silver epoxy.

15. The method of claim 11, wherein the substrate includes a highly reflective layer, and wherein the single contiguous amount of phosphor is formed so that the single contiguous amount of phosphor covers the highly reflective layer.

16. A device comprising:

a substrate having a first terminal, a second terminal, and a third terminal;

a first LED die;

a second LED die;

a single contiguous amount of phosphor that covers the first LED die, that covers the second LED die, and that contacts the substrate, wherein the single contiguous amount of phosphor does not cover any of the first, second and third terminals;

first means for coupling the first terminal to a first electrode of the first LED die;

second means for coupling the second terminal to a second electrode of the first LED die, and for coupling the second terminal to a first electrode of the second LED die; and

third means for coupling the third terminal to a second electrode of the second LED die.

17. The device of claim 16, wherein the first means comprises a bond wire, wherein the second means comprises a pair of bond wires, and wherein the third means comprises a bond wire.

18. The device of claim 17, wherein the first means further comprises a wire bond area of a first metal layer portion, wherein the second means further comprises a wire bond area of a second metal layer portion, wherein the third means further comprises a wire bond area of a third metal layer portion, and wherein the first, second, and third metal layer portions are parts of the substrate.

19. The device of claim 18, wherein the first LED die is a blue LED die, and wherein the second LED die is a blue LED die.

20. The device of claim 19, wherein the substrate comprises a printed circuit board and a layer of highly reflective material, wherein the highly reflective material comprises a titanium dioxide powder suspended in silicone.