Sensor with subassemblies featuring storage devices

• US 9,014,998 B2
• Filed: 10/09/2009
• Issued: 04/21/2015
• Est. Priority Date: 11/05/2008
• Status: Active Grant

• Current Assignee: VEGA Grieshaber KG (Grieshaber Verwaltungsgesellschaft mbH)
• Original Assignee: VEGA Grieshaber KG (Grieshaber Verwaltungsgesellschaft mbH)
• Inventors: Gaiser, Martin, Haas, Juergen, Motzer, Juergen
• Primary Examiner(s): Breene, John
• Assistant Examiner(s): Perez Bermudez, Yaritza H
• Application Number:
  US12/576,559
• Publication Number:
  US 20100256942A1
• Time in Patent Office: 2,020 Days
• Field of Search: 702/104, 702/108, 702116-118, 702/183, 737/63, 738/65, 295/93
• US Class Current: 702/104
• CPC Class Codes: G01F 23/284 Electromagnetic waves
• CPC Class Codes: G01F 23/802 Particular electronic circuits for digital processing equipment
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part

Abstract

A sensor includes an electronic module that comprises several electronic subassemblies and a processor that can be electrically coupled to the electronic subassemblies. The subassemblies respectively feature a programmable storage device with subassembly-specific data of the respective subassembly. The content of the respective programmable storage devices can be read out and evaluated by the processor.

Claims

1. A method for manufacturing a sensor, comprising:

determining subassembly-specific data of each of a plurality of electronic subassemblies, the data comprising test data determined using functional tests of the respective subassembly, the functional tests being performed before assembly of the subassemblies into an electronic module of the sensor;

storing the subassembly-specific data in respective storage devices of the subassemblies;

assembling the subassemblies into the electronic module;

electrically coupling the subassemblies to a processor of the electronic module;

reading out the data from the storage devices by the processor during an initial start-up of the sensor; and

evaluating the storage device contents by means of the processor;

wherein the processor uses the data to check if a respective subassembly has successfully passed a functional test of the subassembly, to check if the subassemblies of the electronic module were assembled correctly, and to perform a calibration of the electronic module using the test data of the respective subassembly;

wherein the data comprises an identification code for identifying the subassembly or the manufacturer;

wherein the data is evaluated by the processor before starting an operating mode of the sensor.

2. The method of claim 1, further comprising:

configuring an operation of the electronic module as a function of the data.

3. A sensor, comprising:

an electronic module installed in the sensor and including an assembly of electronic subassemblies, wherein each subassembly includes a programmable storage device with subassembly-specific data of the respective subassembly comprising test data determined using functional tests of the respective subassembly, the functional tests being performed before assembly of the subassemblies into the electronic module; and

a processor electrically coupled to the subassemblies,

wherein content of the respective programmable storage devices is read out and evaluated by the processor;

wherein the processor evaluates the data to check if a respective subassembly has successfully passed a functional test of the subassembly, to check if the subassemblies of the electronic module were assembled correctly, and to perform a calibration of the electronic module using the test data of the respective subassembly;

wherein the data comprises an identification code for identifying the subassembly or the manufacturer;

wherein the data is evaluated by the processor before starting an operating mode of the sensor.

4. The sensor of claim 3, wherein the storage devices include non-volatile storage devices.

5. The sensor of claim 3, wherein the identification code is a serial number.

6. The sensor of claim 3, wherein the test data comprises measured values of the subassembly that were determined by means of tests.

7. The sensor according to claim 3, wherein the test data includes manufacturing irregularities of the subassembly that were determined using tests.

8. The sensor of claim 3, wherein an operation of the electronic module is configured as a function of the data.

9. The sensor of claim 3, wherein an operation of the electronic module is calibrated as a function of the data.

10. The sensor of claim 3, wherein the data includes information on a type of functional tests carried out on the subassembly and wherein the data is verified with data expected by the processor in order to check a completeness of the functional tests of the subassemblies.

11. The sensor of claim 3, wherein the subassemblies include at least one of a microwave subassembly, an interface subassembly, a power supply subassembly, a detector subassembly and a frequency control subassembly.

12. The sensor of claim 3, wherein the sensor includes a level sensor.