Polishing solution distribution apparatus and polishing apparatus having the same

• US 9,017,145 B2
• Filed: 04/11/2011
• Issued: 04/28/2015
• Est. Priority Date: 04/26/2010
• Status: Active Grant

• Current Assignee: Sumco Corporation
• Original Assignee: Sumco Corporation
• Inventors: Kurosawa, Yoshiaki, Hashii, Tomohiro, Kakizono, Yuichi
• Primary Examiner(s): Hail, Joseph J
• Assistant Examiner(s): Carlson, Marc
• Application Number:
  US13/083,833
• Publication Number:
  US 20110263183A1
• Time in Patent Office: 1,478 Days
• Field of Search: 451/64, 451/446, 222/330, 222/478, 222/185.1, 222/926
• US Class Current: 451/64
• CPC Class Codes: B24B 37/08 for double side lapping
• CPC Class Codes: B24B 57/02 for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Abstract

The present invention provides a polishing solution distribution apparatus capable of reducing distribution deviation of polishing solution even when leveling for installation is insufficient or inclination of an installation location varies and a polishing apparatus having the same. The polishing solution distribution apparatus includes a cone-shaped branch body in which a solution pan to store supplied polishing solution is formed and in which plural flow passages radially connected to a side face of the solution pan respectively and having a delivery port to supply polishing solution to a position lower than the connected position are formed, a support portion to support the branch body, and a universal joint mechanism to support the branch body via the support portion at a position being higher than the gravity center of the branch body.

Claims

1. A polishing solution distribution apparatus, comprising:

a branch body having a solution pan to store polishing solution and plural flow passages radially connected at a position to a side face of the solution pan, respectively, and having a delivery port to supply the polishing solution to a position lower than the connected position; and

a support portion unitarily formed with the branch body as an integrated object, the branch body supported at a position higher than the gravity center of the branch body of the support portion by a universal joint mechanism, wherein

the universal joint mechanism supports the integrated object by supporting the support portion,

the integrated object is arranged at a position in which an upper platen of a polishing mechanism is placed between the integrated object and a lower platen of the polishing mechanism,

the universal joint mechanism maintains the integrated object in a horizontal position and allows the integrated object to rotate to move in any direction with respect to the upper platen when polishing a wafer held by the polishing mechanism,

wherein the solution pan is positioned on a central axis of the polishing solution distribution apparatus, and wherein the universal joint mechanism is provided at an outer periphery of the branch body with respect to a plan view of the polishing solution distribution apparatus.

2. The polishing solution distribution apparatus according to claim 1, wherein the plural flow passages have the same inclination in the flow direction thereof while connected to the side face at the same height position.

3. The polishing solution distribution apparatus according to claim 1, wherein

the supply portion of the polishing solution is arranged at a position higher than the solution pan and the supply portion supplies polishing solution to the solution pan by dropping the polishing solution, and

the support portion is supported by the universal joint mechanism.

4. The polishing solution distribution apparatus according to claim 1, wherein a deadweight to set a height position of the gravity center of the branch body to be lower than a supported height position of the branch body by the universal joint mechanism is attached to the branch body.

5. The polishing solution distribution apparatus according to claim 1, further comprising plural branch piping flexibly configured to supply the polishing solution to a predetermined position of the polishing mechanism to perform polishing of a polishing object respectively connected to delivery ports of the plural flow passages.

7. The polishing solution distribution apparatus according to claim 3, further comprising plural branch piping flexibly configured to the supply polishing solution to a predetermined position of the polishing mechanism to perform polishing of a polishing object respectively connected to delivery ports of the plural flow passages.

8. The polishing solution distribution apparatus according to claim 4, further comprising plural branch piping flexibly configured to supply the polishing solution to a predetermined position of the polishing mechanism to perform polishing of a polishing object respectively connected to delivery ports of the plural flow passages.

9. The polishing solution distribution apparatus according to claim 1, further comprising a funnel configured to supply the polishing solution to a predetermined position of the polishing mechanism to perform polishing of a polishing object arranged below the delivery port having an opening portion directed upward.

11. The polishing solution distribution apparatus according to claim 3, further comprising a funnel configured to supply the polishing solution to a predetermined position of the polishing mechanism to perform polishing of a polishing object arranged below the delivery port having an opening portion directed upward.

12. The polishing solution distribution apparatus according to claim 4, further comprising a funnel configured to supply the polishing solution to a predetermined position of the polishing mechanism to perform polishing of a polishing object arranged below the delivery port having an opening portion directed upward.

13. The polishing solution distribution apparatus according to claim 5, further comprising a funnel configured to supply the polishing solution to a predetermined position of the polishing mechanism to perform polishing of a polishing object arranged below the branch piping having an opening portion directed upward.

15. The polishing solution distribution apparatus according to claim 7, further comprising a funnel configured to supply the polishing solution to a predetermined position of the polishing mechanism to perform polishing of a polishing object arranged below the branch piping having an opening portion directed upward.

16. The polishing solution distribution apparatus according to claim 8, further comprising a funnel configured to supply the polishing solution to a predetermined position of the polishing mechanism to perform polishing of a polishing object arranged below the branch piping having an opening portion directed upward.

18. The polishing solution distribution apparatus according to claim 1, wherein the upper platen has a polishing solution supply hole protruding in a vertical direction and connected with said integrated object by a flexible branch piping, the polishing solution supply hole connected with said delivery port by said branch piping.

6. A polishing solution distribution apparatus, comprising:

a branch body having a solution pan to store polishing solution and plural flow passages radially connected at a position to a side face of the solution pan, respectively, and having a delivery port to supply the polishing solution to a position lower than the connected position;

a support portion unitarily formed with the branch body as an integrated object, the branch body supported at a position higher than the gravity center of the branch body of the support portion by a universal joint mechanism; and

plural branch piping flexibly configured to supply the polishing solution to a predetermined position of the polishing mechanism to perform polishing of a polishing object respectively connected to delivery ports of the plural flow passages, wherein

the universal joint mechanism supports the integrated object by supporting the support portion,

the integrated object is arranged at a position in which an upper platen of a polishing mechanism is placed between the integrated object and a lower platen of the polishing mechanism,

the universal joint mechanism maintains the integrated object and allows the integrated object to rotate to move in any direction with respect to the upper platen when polishing a wafer held by the polishing mechanism,

wherein the solution pan is positioned on a central axis of the polishing solution distribution apparatus, and wherein the universal joint mechanism is provided at an outer periphery of the branch body with respect to a plan view of the polishing solution distribution apparatus.

14. The polishing solution distribution apparatus according to claim 6, further comprising a funnel configured to supply the polishing solution to a predetermined position of the polishing mechanism to perform polishing of a polishing object arranged below the branch piping having an opening portion directed upward.

10. A polishing solution distribution apparatus, comprising:

a branch body having a solution pan to store polishing solution and plural flow passages radially connected at a position to a side face of the solution pan, respectively, and having a delivery port to supply the polishing solution to a position lower than the connected position;

a support portion unitarily formed with the branch body as an integrated object, the branch body supported at a position higher than the gravity center of the branch body of the support portion by a universal joint mechanism; and

a funnel configured to the supply polishing solution to a predetermined position of the polishing mechanism to perform polishing of a polishing object arranged below the delivery port having an opening portion directed upward, wherein

the universal joint mechanism supports the integrated object by supporting the support portion,

the integrated object is arranged at a position in which an upper platen of a polishing mechanism is placed between the integrated object and a lower platen of the polishing mechanism,

the universal joint mechanism maintains the integrated object in a horizontal position and allows the integrated object to rotate to move in any direction against with respect to the upper platen when polishing a wafer held by the polishing mechanism,

wherein the solution pan is positioned on a central axis of the polishing solution distribution apparatus, and wherein the universal joint mechanism is provided at an outer periphery of the branch body with respect to a plan view of the polishing solution distribution apparatus.

17. A polishing apparatus, comprising:

a polishing solution distribution apparatus, the apparatus comprising;

a branch body having a solution pan to store polishing solution and plural flow passages radially connected at a position to a side face of the solution pan, respectively, and having a delivery port to supply the polishing solution to a position lower than the connected position; and

a support portion unitarily formed with the branch body as an integrated object, the branch body supported at a position higher than the gravity center of the branch body of the support portion by a universal joint mechanism, wherein

the universal joint mechanism supports the integrated object by supporting the support portion,

the integrated object is arranged at a position in which an upper platen of a polishing mechanism is placed between the integrated object and a lower platen of the polishing mechanism,

the universal joint mechanism maintains the integrated object and allows the integrated object to rotate to move in any direction with respect to the upper platen when polishing a wafer held by the polishing mechanism,

wherein the solution pan is positioned on a central axis of the polishing solution distribution apparatus, and wherein the universal joint mechanism is provided at an outer periphery of the branch body with respect to a plan view of the polishing solution distribution apparatus.