Apparatuses and methods for atomic layer deposition
First Claim
1. A method for depositing a material on a substrate, comprising:
- exposing a substrate sequentially to a titanium precursor gas and a nitrogen plasma to form a titanium nitride material on the substrate during an atomic layer deposition process within a deposition chamber, wherein the titanium precursor gas comprises tetrakis(dimethylamido) titanium, the nitrogen plasma is generated from a remote plasma system, and the atomic layer deposition process comprises;
flowing the titanium precursor gas into an annular channel within an inlet manifold assembly, wherein the annular channel surrounds a centralized channel, the centralized channel extends through the inlet manifold assembly, and a chamber lid assembly comprising the inlet manifold assembly is coupled with a chamber body forming the deposition chamber;
flowing the titanium precursor gas from the annular channel into the centralized channel via a plurality of injection holes which extend from the annular channel through a sidewall of the centralized channel, and to the centralized channel;
flowing the titanium precursor gas through the centralized channel, through a showerhead assembly attached with the chamber lid assembly, and absorbing a layer of the tetrakis(dimethylamido) titanium on the substrate;
generating the nitrogen plasma by igniting a process gas comprising nitrogen (N2) with the remote plasma system;
flowing the nitrogen plasma through the centralized channel, through the showerhead assembly, and towards the substrate; and
exposing the layer of the tetrakis(dimethylamido) titanium to the nitrogen plasma to form the titanium nitride material on the substrate.
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Accused Products
Abstract
Embodiments of the invention provide apparatuses and methods for atomic layer deposition (ALD), such as plasma-enhanced ALD (PE-ALD). In some embodiments, a PE-ALD chamber is provided which includes a chamber lid assembly coupled with a chamber body having a substrate support therein. In one embodiment, the chamber lid assembly has an inlet manifold assembly containing an annular channel encompassing a centralized channel, wherein the centralized channel extends through the inlet manifold assembly, and the inlet manifold assembly further contains injection holes extending from the annular channel, through a sidewall of the centralized channel, and to the centralized channel. The chamber lid assembly further contains a showerhead assembly disposed below the inlet manifold assembly, a water box disposed between the inlet manifold assembly and the showerhead assembly, and a remote plasma system (RPS) disposed above and coupled with the inlet manifold assembly, and in fluid communication with the centralized channel.
142 Citations
6 Claims
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1. A method for depositing a material on a substrate, comprising:
exposing a substrate sequentially to a titanium precursor gas and a nitrogen plasma to form a titanium nitride material on the substrate during an atomic layer deposition process within a deposition chamber, wherein the titanium precursor gas comprises tetrakis(dimethylamido) titanium, the nitrogen plasma is generated from a remote plasma system, and the atomic layer deposition process comprises; flowing the titanium precursor gas into an annular channel within an inlet manifold assembly, wherein the annular channel surrounds a centralized channel, the centralized channel extends through the inlet manifold assembly, and a chamber lid assembly comprising the inlet manifold assembly is coupled with a chamber body forming the deposition chamber; flowing the titanium precursor gas from the annular channel into the centralized channel via a plurality of injection holes which extend from the annular channel through a sidewall of the centralized channel, and to the centralized channel; flowing the titanium precursor gas through the centralized channel, through a showerhead assembly attached with the chamber lid assembly, and absorbing a layer of the tetrakis(dimethylamido) titanium on the substrate; generating the nitrogen plasma by igniting a process gas comprising nitrogen (N2) with the remote plasma system; flowing the nitrogen plasma through the centralized channel, through the showerhead assembly, and towards the substrate; and exposing the layer of the tetrakis(dimethylamido) titanium to the nitrogen plasma to form the titanium nitride material on the substrate. - View Dependent Claims (2, 3, 4, 5, 6)
Specification