Vent hole sealing in multiple die sensor device

• US 9,018,029 B1
• Filed: 12/06/2013
• Issued: 04/28/2015
• Est. Priority Date: 12/06/2013
• Status: Active Grant

• Current Assignee: NXP USA, Inc. (NXP Semiconductors NV)
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Bowles, Philip H., Holm, Paige M., Hooper, Stephen R., Liu, Lianjun, Roop, Raymond M.
• Primary Examiner(s): Diallo, Mamadou
• Assistant Examiner(s): SYLVIA, CHRISTINA A
• Application Number:
  US14/099,502
• Time in Patent Office: 508 Days
• Field of Search: 257/682, 257/684, 257/723, 257/E23.128, 257/E23.18, 257/E23.181, 257415-417, 438/51
• US Class Current: 438/51
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 7/02 containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence
• CPC Class Codes: B81C 1/00293 maintaining a controlled atmosphere with processes not provided for in B81C1/00285
• CPC Class Codes: B81C 1/00793 Avoid contamination, e.g. absorption of impurities or oxidation
• CPC Class Codes: B81C 2203/0145 Hermetically sealing an opening in the lid

Abstract

Embodiments of methods of fabricating a sensor device include attaching first and second die to one another to define first and second cavities in which first and second sensors of the sensor device are disposed, respectively. The second die has an opening in communication with the second cavity. The methods further include obstructing the opening, attaching a third die to the second die. The first cavity is hermetically sealed by attaching the first and second die. The second cavity is hermetically sealed by attaching the third die to the second die.

Claims

1. A method of fabricating a sensor device, the method comprising:

attaching first and second die to one another to define first and second cavities in which first and second sensors of the sensor device are disposed, respectively, the second die having an opening in communication with the second cavity;

obstructing the opening; and

attaching a third die to the second die;

wherein the first cavity is hermetically sealed by attaching the first and second die; and

wherein the second cavity is hermetically sealed by attaching the third die to the second die.

2. The method of claim 1, wherein obstructing the opening comprises depositing a plug in the opening.

3. The method of claim 2, wherein the plug comprises an epoxy material.

4. The method of claim 2, wherein:

attaching the first and second die comprises attaching first and second wafers comprising the first and second die, respectively;

depositing the plug is performed after attaching the first and second wafers; and

the method further comprises dicing the first and second wafers to form a die stack comprising the first and second sensors.

5. The method of claim 1, wherein obstructing the opening comprises depositing a film on the second die to cover the opening.

6. The method of claim 5, wherein:

attaching the first and second die comprises attaching first and second wafers comprising the first and second die, respectively;

depositing the film is performed after attaching the first and second wafers; and

the method further comprises dicing the first and second wafers to form a die stack comprising the first and second sensors.

7. The method of claim 1, wherein:

the first and second sensors are disposed on the first die; and

the second die is configured as a cap die.

8. The method of claim 1, wherein the third die comprises an application-specific integrated circuit (ASIC).

9. The method of claim 1, wherein the third die comprises a third sensor.

10. The method of claim 1, further comprising attaching a further die to the second die.

11. The method of claim 1, further comprising attaching a further die to the third die.

12. A method of fabricating a sensor device, the method comprising:

attaching first and second wafers to one another to define first and second cavities in which first and second sensors of the sensor device are disposed, respectively, the second wafer having a vent hole in communication with the second cavity;

depositing an obstruction on the second wafer to obstruct the opening; and

attaching a die over the second cavity to hermetically seal the second cavity with the opening remaining obstructed by the obstruction.

13. The method of claim 12, wherein depositing the obstruction comprises depositing a plug in the opening.

14. The method of claim 12, further comprising dicing the first and second wafers to form a die stack comprising the first and second sensors, wherein attaching the die comprises attaching the die to the die stack after dicing the first and second wafers.

15. The method of claim 12, wherein:

the first and second sensors are disposed on the first wafer; and

the second wafer is configured as a cap wafer.

16. A sensor device comprising:

a first die;

a second die attached to the first die to define first and second cavities in which first and second sensors are disposed, respectively, the second die having an opening in communication with the second cavity;

an obstruction disposed relative to the opening to obstruct the opening; and

a third die attached to the second die to seal the second cavity.

17. The sensor device of claim 16, wherein the third die is attached to the second die with a seal ring that surrounds the opening to hermetically seal the second cavity.

18. The sensor device of claim 16, wherein the obstruction comprises a plug in the opening.

19. The sensor device of claim 16, wherein the obstruction comprises a film on the second die covering the opening.

20. The sensor device of claim 16, wherein:

the first cavity has a first pressure; and

the second cavity has a second pressure higher than the first pressure.