Photonic semiconductor devices in LLC assembly with controlled molding boundary and method for forming same
First Claim
1. A process for manufacturing a plurality of laminate leadless carrier packages, comprising the steps of:
- preparing a substrate, wherein preparing said substrate comprises laminating a top conductive layer, a bottom conductive layer, and a dielectric layer between said top and bottom conductive layers together, and wherein said top conductive layer comprises a die attach pad, a wire bond pad, and at least two slotted vias;
applying epoxy adhesive to said die attach pad;
mounting a photonic semiconductor chip on said die attach pad;
wire-bonding said photonic semiconductor chip with said wire bond pad using a wire bond;
temporarily filling said slotted vias with temporary fillers;
molding a molding compound to form an encapsulation covering said photonic semiconductor chip, said wire bond, and at least a portion of said top surface of said substrate;
removing said temporary fillers from the slotted vias; and
dicing said substrate into individual laminate leadless carrier packages.
2 Assignments
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Accused Products
Abstract
Embodiments of a laminate leadless carrier package are presented. The package includes an optoelectronic chip, a substrate supporting the optoelectronic chip, a plurality of conductive slotted vias, a wire bond pad disposed on the top surface of the substrate, a wire bond coupled to the optoelectronic chip and the wire bond pad and an encapsulation covering the optoelectronic chip, the wire bond, and at least a portion of the top surface of the substrate. The slotted vias provide electrical connections between the top conductive layer and the bottom conductive layer. The substrate includes a plurality of conductive and dielectric layers laminated together including a bottom conductive layer, a top conductive layer, and a dielectric layer between the top and bottom conductive layers. The encapsulation is a molding compound, and the molding compound is pulled back from at least one of the slotted vias.
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Citations
21 Claims
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1. A process for manufacturing a plurality of laminate leadless carrier packages, comprising the steps of:
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preparing a substrate, wherein preparing said substrate comprises laminating a top conductive layer, a bottom conductive layer, and a dielectric layer between said top and bottom conductive layers together, and wherein said top conductive layer comprises a die attach pad, a wire bond pad, and at least two slotted vias; applying epoxy adhesive to said die attach pad; mounting a photonic semiconductor chip on said die attach pad; wire-bonding said photonic semiconductor chip with said wire bond pad using a wire bond; temporarily filling said slotted vias with temporary fillers; molding a molding compound to form an encapsulation covering said photonic semiconductor chip, said wire bond, and at least a portion of said top surface of said substrate; removing said temporary fillers from the slotted vias; and dicing said substrate into individual laminate leadless carrier packages. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A process for manufacturing a laminate leadless carrier package, comprising the steps of:
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preparing a substrate, wherein preparing said substrate comprises laminating a top conductive layer, a bottom conductive layer, and a dielectric layer between said top and bottom conductive layers together, and wherein said top conductive layer comprises a die attach pad, a wire bond pad, and at least two slotted vias; applying epoxy adhesive to said die attach pad; mounting a photonic semiconductor chip on said die attach pad; wire-bonding said photonic semiconductor chip with said wire bond pad using a wire bond; temporarily filling said slotted vias with temporary fillers; molding a molding compound to form an encapsulation covering said photonic semiconductor chip, said wire bond, and at least a portion of said top surface of said substrate; and removing said temporary fillers from said slotted vias.
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Specification