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Laser material processing system

  • US 9,018,562 B2
  • Filed: 04/09/2007
  • Issued: 04/28/2015
  • Est. Priority Date: 04/10/2006
  • Status: Active Grant
First Claim
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1. A laser material processing system comprising:

  • a laser operable to emit a femtosecond or picosecond laser beam pulse;

    a shaper operable to shape the pulse;

    an optic member located in the path of the pulse to broaden the bandwidth of the pulse;

    a programmable controller connected to the shaper;

    a detector connected to the controller; and

    a workpiece micromachined by the pulse, the workpiece including at least one of;

    silicon or a dielectric material;

    the controller receiving pulse characteristic signals detected by the detector to optimize laser pulse characteristics for the micromachining of the workpiece;

    wherein the laser pulse characteristics are optimized based at least in part on the signals which are laser induced breakdown spectroscopy signals; and

    wherein the detector detects emissions from the workpiece as it is being micromachined.

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