UV LED curing assembly

• US 9,018,600 B2
• Filed: 05/26/2011
• Issued: 04/28/2015
• Est. Priority Date: 05/28/2010
• Status: Active Grant

• Current Assignee: Baldwin UV Limited (Forsyth Baldwin LLC)
• Original Assignee: Baldwin UV Limited (Forsyth Baldwin LLC)
• Inventors: Stowell, Quinton, Armitage, David
• Primary Examiner(s): Johnston, Phillip A
• Assistant Examiner(s): LUCK, SEAN M
• Application Number:
  US13/116,067
• Publication Number:
  US 20110290179A1
• Time in Patent Office: 1,433 Days
• Field of Search: 250/492.1
• US Class Current: 250/492.1
• CPC Class Codes: B41F 23/0409 Ultraviolet dryers
• CPC Class Codes: B41F 23/0453 by ultraviolet dryers
• CPC Class Codes: B41J 11/00214 using UV radiation
• CPC Class Codes: F26B 3/28 by radiation, e.g. from the sun
• CPC Class Codes: F26B 3/283 in combination with convection
• CPC Class Codes: F41G 11/003 Mountings with a dove tail element, e.g. "Picatinny rail systems"

Abstract

A curing assembly for curing of inks and the like comprises at least one array of UV LEDs 18. A reflector 4 with an elongate reflective surface 14 partly surrounds the array 18 and has an opening for emission of radiation towards a substrate. A lens 24 is positioned between the array 18 and the opening.

Claims

1. A curing assembly comprising an array of UV LEDs, a lens, and a reflector, the reflector being formed as an elongate reflective surface partly surrounding the array and defining an opening at a distal end of the reflector opposite of the array for emission of radiation towards a substrate supported in a position to receive radiation emitted through the opening for curing a coating thereon, the lens being positioned between the array and the opening defined by the distal end of the reflector, the lens and reflector being configured such that a first portion of an emission of radiation from the LEDs is reflected by the reflector and passes through the opening without passing through the lens and a second portion of the emission of radiation from the LEDs passes through the lens and through the opening without being reflected by the reflector, and a third portion of the emission of radiation from the LEDs is at least one of scattered and reflected by the reflector and passed through the lens and is consistent with a leakage amount;

wherein the first portion of the emission of radiation from the LEDs is greater than the third portion of the emission of radiation from the LEDs;

wherein the second portion of the emission of radiation from the LEDs is greater than the third portion of the emission of radiation from the LEDs; and

wherein the reflective surface and lens have a common focal point at the substrate support position and the first and second portions of the emission of radiation from the LEDs are combined together at a focal region at the substrate support position.

2. A curing assembly as claimed in claim 1 wherein the reflective surface is shaped and positioned to maximize reflection of radiation which does not pass through the lens and to minimize the amount of radiation which is reflected back onto the lens.

3. A curing assembly as claimed in claim 1 wherein the lens is a cylindrical rod.

4. A curing assembly as claimed in claim 1 wherein the lens is a rod of semicircular cross-section.

5. A curing assembly as claimed in claim 1 wherein the lens is a rod formed of quartz.

6. A curing assembly as claimed in claim 1 wherein the lens is a convergent lens arranged to focus radiation at the substrate support position.

7. A curing assembly as claimed in claim 1 wherein a portion of the LEDs in an outer region of the array are arranged in a pattern, and the portion of the LEDs in the pattern of the outer regions of the array are closer together than the other LEDs.

8. A curing assembly as claimed in claim 1 wherein the array defines a plane and a group of LEDs in a central region of the array are rotated relative to another group of LEDs of the array within the plane defined by the array.

9. A curing assembly as claimed in claim 8 wherein the LEDs in the central region are rotated 45 degrees relative the other LEDs.

10. A curing assembly as claimed in claim 8 wherein the LEDs in the central region are spaced further apart than the other LEDs.

11. A curing assembly as claimed in claim 1 wherein the LEDs have a packing density of 15% to 50%.

12. A curing assembly as claimed in claim 1 wherein the LEDs are mounted on a water cooled circuit board.

13. A curing assembly as claimed in claim 1 further comprising a substrate support for supporting a substrate in a position to receive radiation emitted through the opening.

14. A curing assembly as claimed in claim 1 wherein the LEDs have a packing density of 20% to 38%.

15. A curing assembly as claimed in claim 1 wherein a group of LEDs of the array arranged at peripheral edges of the array have a spacing therebetween that is less than a spacing between another group of LEDs of the array arranged in central regions of the array.

16. A curing assembly as claimed in claim 15 wherein the LEDs arranged at the peripheral edges of the array and the LEDs arranged in central regions of the array have a packing density of between 15% and 50%.

17. A curing assembly as claimed in claim 15 wherein the LEDs arranged at the peripheral edges of the array and the LEDs arranged in central regions of the array have a packing density of between 20% and 38%.

18. A curing assembly as claimed in claim 1 wherein a portion of the LEDs of the array that are arranged at longitudinally opposite ends of the array, generally extend in a direction between the distal ends of the reflector across the opening and have a spacing therebetween along the length direction that is less than a spacing along the length direction between other LEDs arranged in central regions of the array.

19. A curing assembly as claimed in claim 18 wherein the LEDs arranged at the peripheral edges of the array and the LEDs arranged in central regions of the array have a packing density of between 15% and 50%.

20. A curing assembly as claimed in claim 18 wherein the LEDs arranged at the peripheral edges of the array and the LEDs arranged in central regions of the array have a packing density of between 20% and 38%.