Semiconductor chip assembly with post/base heat spreader and dual adhesives
First Claim
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1. A semiconductor chip assembly, comprising:
- a semiconductor device;
a heat spreader that includes a post and a base, wherein the post is adjacent to the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions;
a first adhesive and a second adhesive, wherein the first adhesive includes a first opening, contacts the second adhesive at an adhesive interface and extends laterally from the adhesive interface in the lateral directions, and the second adhesive includes a second opening and extends upwardly from the adhesive interface above the first adhesive in the upward direction; and
a conductive trace that includes a pad and a terminal;
wherein the semiconductor device is mounted on the heat spreader, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base;
wherein the first adhesive is mounted on and extends above the base, extends between the conductive trace and the base and extends laterally from the adhesive interface to or beyond the terminal;
wherein the second adhesive extends above the post and the conductive trace, extends below the pad, extends between the post and the pad, overlaps the conductive trace, does not overlap the semiconductor device, does not cover the pad in the upward direction and extends laterally from the post to or beyond the terminal;
wherein the pad is mounted on the first adhesive and extends above the base; and
wherein the post extends through the first opening and into the second opening, and the base extends below the semiconductor device and the pad.
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Accused Products
Abstract
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and first and second adhesives. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base through an opening in the first adhesive, and the base extends laterally from the post. The first adhesive extends between the base and the conductive trace and the second adhesive extends between the post and the conductive trace. The conductive trace provides signal routing between a pad and a terminal.
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Citations
45 Claims
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1. A semiconductor chip assembly, comprising:
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a semiconductor device; a heat spreader that includes a post and a base, wherein the post is adjacent to the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; a first adhesive and a second adhesive, wherein the first adhesive includes a first opening, contacts the second adhesive at an adhesive interface and extends laterally from the adhesive interface in the lateral directions, and the second adhesive includes a second opening and extends upwardly from the adhesive interface above the first adhesive in the upward direction; and a conductive trace that includes a pad and a terminal; wherein the semiconductor device is mounted on the heat spreader, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base; wherein the first adhesive is mounted on and extends above the base, extends between the conductive trace and the base and extends laterally from the adhesive interface to or beyond the terminal; wherein the second adhesive extends above the post and the conductive trace, extends below the pad, extends between the post and the pad, overlaps the conductive trace, does not overlap the semiconductor device, does not cover the pad in the upward direction and extends laterally from the post to or beyond the terminal; wherein the pad is mounted on the first adhesive and extends above the base; and wherein the post extends through the first opening and into the second opening, and the base extends below the semiconductor device and the pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A semiconductor chip assembly, comprising:
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a semiconductor device; a heat spreader that includes a post and a base, wherein the post is adjacent to the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; a first adhesive and a second adhesive, wherein the first adhesive includes a first opening, contacts the second adhesive at an adhesive interface and extends laterally from the adhesive interface in the lateral directions, and the second adhesive includes a second opening and extends upwardly from the adhesive interface above the first adhesive in the upward direction; a substrate that includes a dielectric layer, wherein an aperture extends through the substrate; and a conductive trace that includes a pad and a terminal; wherein the semiconductor device is mounted on the heat spreader, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base; wherein the first adhesive is mounted on and extends above the base, extends laterally from the post to or beyond the terminal and is sandwiched between the base and the substrate; wherein the second adhesive extends into a gap in the aperture between the post and the substrate, extends laterally from the post to or beyond the terminal, is sandwiched between the post and the dielectric layer, overlaps the conductive trace and does not overlap the semiconductor device; wherein the substrate is mounted on the first adhesive and the dielectric layer extends above the base; wherein the pad is mounted on and extends above the dielectric layer; and wherein the post extends through the first opening and into the second opening and into the aperture, and the base extends below the semiconductor device, the substrate and the adhesives. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40)
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41. A semiconductor chip assembly, comprising:
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a semiconductor device; a heat spreader that includes a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; a first adhesive and a second adhesive, wherein the first adhesive includes a first opening, contacts the second adhesive at an adhesive interface and extends laterally from the adhesive interface in the lateral directions, and the second adhesive includes a second opening and extends upwardly from the adhesive interface above the first adhesive in the upward direction; and a substrate that includes a pad, a terminal, a routing line and a dielectric layer, wherein the pad, the terminal and the routing line contact and extend above the dielectric layer, an electrically conductive path between the pad and the terminal includes the routing line, and an aperture extends through the substrate; wherein the semiconductor device is mounted on and overlaps the post, extends above the adhesives, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base; wherein the first adhesive is mounted on and extends above the base, is sandwiched between the base and the substrate, surrounds the post in the lateral directions, is overlapped by the pad, the terminal and the routing line and extends to peripheral edges of the assembly; wherein the second adhesive extends above the conductive trace and the heat spreader, extends below the pad, extends into a gap in the aperture between the post and the substrate, extends across most or all of the dielectric layer in the gap, is sandwiched between the post and the dielectric layer in the gap, surrounds the post in the lateral directions, overlaps the routing line, does not overlap the semiconductor device, extends laterally from the post to or beyond the terminal and extends to peripheral edges of the assembly; wherein the substrate is mounted on the first adhesive and the dielectric layer extends above the base; and wherein the post extends through the first opening and into the second opening and into the aperture and above the dielectric layer, and the base extends below the semiconductor device, the substrate and the adhesives, covers the semiconductor device, the post, the substrate and the adhesives in the downward direction and extends to peripheral edges of the assembly. - View Dependent Claims (42, 43, 44, 45)
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Specification