Contactless connector

• US 9,019,033 B2
• Filed: 01/22/2013
• Issued: 04/28/2015
• Est. Priority Date: 12/23/2011
• Status: Expired due to Fees

• Current Assignee: TE Connectivity Corporation (TE Connectivity Ltd. (United Kingdom))
• Original Assignee: Tyco Electronics Corporation (TE Connectivity Ltd. (United Kingdom))
• Inventors: McCarthy, Sean Patrick, Bishop, Bruce Foster
• Primary Examiner(s): Donovan, Lincoln
• Assistant Examiner(s): Almo, Khareem E
• Application Number:
  US13/747,134
• Publication Number:
  US 20130183902A1
• Time in Patent Office: 826 Days
• Field of Search: None
• US Class Current: 333/24.R
• CPC Class Codes: H01P 3/123 with a complex or stepped cross-section, e.g. ridged or grooved waveguides H01P3/14 takes precedence
• CPC Class Codes: H01P 5/00 Coupling devices of the waveguide type
• CPC Class Codes: H01P 5/024 between hollow waveguides
• CPC Class Codes: H04B 7/24 for communication between two or more posts wireless communication networks H04W

Abstract

A contactless connector includes a waveguide structure having a waveguide body extending between a first end and a second end and a septum received in the waveguide body and extend at least partially along an interior of the waveguide body. The septum divides at least a portion of the waveguide body into a first chamber and a second chamber. The waveguide structure conveys RF signals between the first and second ends. The contactless connector includes a communication module having a circuit board positioned at the first end of the waveguide body with transmit and receive communication chips coupled to the circuit board. The waveguide guides the RF signals from and to the transmit and receive communication chips, and the septum isolates the RF signals associated with the communication chips.

Claims

1. A contactless connector comprising:

a waveguide structure comprising a waveguide body extending between a first end and a second end and a septum received in the waveguide body and extend at least partially along an interior of the waveguide body, the septum dividing at least a portion of the waveguide body into a first chamber and a second chamber, the waveguide structure conveying RF signals between the first and second ends;

a communication module comprising a circuit board positioned at the first end of the waveguide body, the communication module having a transmit communication chip configured to transmit wireless RF signals and a receive communication chip configured to receive wireless RF signals, the transmit and receive communication chips being coupled to the circuit board;

wherein the waveguide guides the RF signals from and to the transmit and receive communication chips, and wherein the septum isolates the RF signals associated with the transmit communication chip from the RF signals associated with the receive communication chip for at least a portion of a length of the waveguide body.

2. The contactless connector of claim 1, wherein the septum is directly coupled to the circuit board and extends from the circuit board along the waveguide body for a length of the waveguide body.

3. The contactless connector of claim 1, wherein the waveguide body comprises a receptacle at the first end and a tube at the second end, the tube having a smaller diameter than a diameter of the receptacle, the circuit board and transmit and receive communication chips being received in the receptacle, the receptacle guiding the RF signals between the communication module and the tube.

4. The contactless connector of claim 3, wherein the receptacle is frustoconical shaped with the tube at the smaller end of the receptacle, the RF signals being guided between the tube and the communication module through the frustoconical shaped portion of the receptacle.

5. The contactless connector of claim 1, wherein the septum has a distal end opposite the communication module, the distal end being stepped.

6. The contactless connector of claim 1, wherein the circuit board includes a ground plane and conductive vias electrically connected to the ground plane, the septum having mounting posts received in the conductive vias to electrically connect the septum to the ground plane of the circuit board.

7. The contactless connector of claim 1, wherein the septum engages an internal surface of the waveguide body by in interference fit.

8. The contactless connector of claim 1, wherein the septum is electrically commoned with the waveguide body.

9. The contactless connector of claim 1, wherein the septum is profiled to match an interior surface of the waveguide body.

10. The contactless connector of claim 1, wherein the waveguide body extends along a longitudinal axis, the communication module being received within the waveguide body such that the transmit and receive communication chips are offset from the longitudinal axis toward one side of the waveguide body in a common direction.

11. The contactless connector of claim 1, wherein the waveguide body redirects the corresponding RF signals from and to the corresponding transmit and receive communication chips.

12. The contactless connector of claim 1, wherein the waveguide body changes a propagation mode of the corresponding RF signals from and to the corresponding transmit and receive communication chips.

13. The contactless connector of claim 1, wherein the waveguide structure combines multiple modes of RF signals allowing duplex communication.

14. A contactless connector comprising:

a waveguide structure comprising a first waveguide module and a second waveguide module configured to wirelessly communication RF signals therebetween, the first waveguide module having a first waveguide body and a first septum received in the first waveguide body, the second waveguide module having a second waveguide body and a second septum received in the second waveguide body;

a first communication module coupled to the first waveguide module, the first communication module comprising a first circuit board having a transmit communication chip and a receive communication chip on the first circuit board, wherein the first waveguide module guides corresponding RF signals from and to the transmit and receive communication chips, and wherein the first septum isolates the RF signals associated with the transmit communication chip from the RF signals associated with the receive communication chip for at least a portion of a length of the first waveguide body; and

a second communication module coupled to the second waveguide module, the second communication module comprising a second circuit board having a transmit communication chip and a receive communication chip on the second circuit board, wherein the second waveguide module guides corresponding RF signals from and to the transmit and receive communication chips, and wherein the second septum isolates the RF signals associated with the transmit communication chip from the RF signals associated with the receive communication chip for at least a portion of a length of the second waveguide body.

15. The contactless connector of claim 14, wherein the septum is directly coupled to the circuit board and extends from the circuit board along the waveguide body for a length of the waveguide body.

16. The contactless connector of claim 14, wherein the waveguide body comprises a receptacle at the first end and a tube at the second end, the tube having a smaller diameter than a diameter of the receptacle, the circuit board and transmit and receive communication chips being received in the receptacle, the receptacle being frustoconical shaped with the tube at the smaller end of the receptacle, the RF signals being guided between the tube and the communication module through the frustoconical shaped portion of the receptacle.

17. The contactless connector of claim 14, wherein the septum has a distal end opposite the communication module, the distal end being stepped.

18. The contactless connector of claim 14, wherein the circuit board includes a ground plane and conductive vias electrically connected to the ground plane, the septum having mounting posts received in the conductive vias to electrically connect the septum to the ground plane of the circuit board.

19. The contactless connector of claim 14, wherein the septum engages an internal surface of the waveguide body by in interference fit.

20. The contactless connector of claim 14, wherein the septum is electrically commoned with the waveguide body.