Galvanic isolators and coil transducers

• US 9,019,057 B2
• Filed: 03/31/2008
• Issued: 04/28/2015
• Est. Priority Date: 08/28/2006
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Inventors: Fouquet, Julie E., Ng, Gek Yong, Baumgartner, Richard, Trott, Gary R.
• Primary Examiner(s): Chan, Tsz
• Application Number:
  US12/059,979
• Publication Number:
  US 20080179963A1
• Time in Patent Office: 2,584 Days
• Field of Search: 336/65, 336/200, 336206-208, 336/232
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 19/08 Transformers having magnetic bias, e.g. for handling pulses
• CPC Class Codes: H01F 2019/085 Transformer for galvanic isolation
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 27/40 Structural association with built-in electric component, e.g. fuse
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48195 the item being a discrete passive component
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/30111 matching
• CPC Class Codes: H03F 2203/45008 the addition of two signals being made by a resistor addition circuit for producing the common mode signal
• CPC Class Codes: H03F 2203/45101 Control of the DC level being present
• CPC Class Codes: H03F 2203/45586 the IC comprising offset generating means
• CPC Class Codes: H03F 3/45192 Folded cascode stages
• CPC Class Codes: H03F 3/45475 using IC blocks as the active amplifying circuit
• CPC Class Codes: H03H 7/52 One-way transmission networks, i.e. unilines
• CPC Class Codes: H04L 25/0266 Arrangements for providing Galvanic isolation, e.g. by means of magnetic or capacitive coupling
• CPC Class Codes: Y10T 29/4902 : Electromagnet, transformer or inductor

Abstract

Disclosed herein are various embodiments of coil transducers and galvanic isolators configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. A coil transducer is provided across which data or power signals may be transmitted and received by primary and secondary coils disposed on opposing sides thereof without high voltage breakdowns occurring therebetween. At least portions of the coil transducer are formed of an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material. Circuits are disclosed herein that permit high speed data signals to be transmitted through the coil transducer and faithfully and accurately reconstructed on the opposing side thereof. The coil transducer may be formed in a small package using, by way of example, printed circuit board, CMOS and other fabrication and packaging processes.

Claims

1. A coil transducer, comprising:

a generally planar electrically insulating substrate comprising opposing upper and lower surfaces, the substrate comprising an electrically insulating, non-metallic, non-semiconductor low dielectric loss material having a dielectric loss tangent at room temperature that is less than or equal to 0.05;

a first electrical conductor forming a first coil, the first coil being disposed upon, in or near the upper surface, and

a second electrical conductor forming a second coil, the second coil being disposed upon, in or near the lower surface;

wherein the first coil is separated from the second coil by at least portions of the substrate, no electrical conductors, vias or terminals are located in portions of the substrate disposed between the first coil and the second coil, the first and second coils are spatially arranged and configured respecting one another such that at least one of power and data signals may be transmitted by the first coil to the second coil across a dielectric barrier comprising the non-semiconductor low dielectric loss material disposed therebetween, the dielectric barrier exceeds about 1 mil in thickness, and a breakdown voltage between the first coil and the second coil exceeds 2,000 volts RMS.

2. The coil transducer of claim 1, wherein the substrate is configured to impart substantial mechanical rigidity and strength to the coil transducer.

3. The coil transducer of claim 1, wherein the substrate material further comprises a material selected from the group consisting of one or more of fiberglass, glass, ceramic, polyimide, polyimide film, a polymer, an organic material, a flex circuit material, epoxy, epoxy resin, a printed circuit board material, PTFE and glass, PTFE and ceramic, PTFE, glass and ceramic, plastic and thermoset plastic.

4. The coil transducer of claim 1, wherein the coil transducer comprises a plurality of layers in addition to the substrate, at least one of the layers comprising the low dielectric loss material.

5. The coil transducer of claim 1, wherein the breakdown voltage between the first coil and the second coil exceeds 2,000 volts RMS when applied over a time period of about one minute, exceeds 2,000 volts RMS when applied over a time period of about six minutes, or exceeds 2,000 volts RMS when applied over a time period of 24 hours.

6. The coil transducer of claim 1, wherein the breakdown voltage between the first coil and the second coil exceeds 5,000 volts RMS when applied over a time period of about one minute, exceeds 5,000 volts RMS when applied over a time period of about six minutes, or exceeds 5,000 volts RMS when applied over a time period of 24 hours.

7. The coil transducer of claim 1, wherein at least one of the coil transducer and the substrate has a thickness between upper and lower surfaces thereof ranging between about 0.5 mils and about 25 mils, between about 1 mil and about 25 mils, or between about 1.5 mils and about 25 mils.

8. The coil transducer of claim 1, further comprising at least one of an input lead frame and an output lead frame connected to the coil transducer such that electrically conductive portions of the input and output lead frames do not extend beneath the coil transducer to locations directly beneath the first or second coils.

9. The coil transducer of claim 1, further comprising an input lead frame and an output lead frame connected to the coil transducer such that the input lead frame is mechanically connected to an upper side of the coil transducer and the output lead frame is mechanically connected to a bottom side of the coil transducer, the bottom side opposing the top side.

10. The coil transducer of claim 1, further comprising an input lead frame and an output lead frame connected to the coil transducer such that the input and output lead frames are both mechanically connected to one of an upper side of the coil transducer and a bottom side of the coil transducer.

11. The coil transducer of claim 1, further comprising an input lead frame and an output lead frame connected to the galvanic isolator, and a moldable electrically insulating material encapsulating at least portions of the coil transducer and the input and output lead frames.

12. The coil transducer of claim 1, further comprising electrically insulating silicone disposed thereabout, thereover or thereunder.

13. The coil transducer of claim 1, wherein the coil transducer is configured to operate as one of a data transfer device and a power transfer device.

14. The coil transducer of claim 1, wherein the first coil is operably connected to a transmitter circuit and the second coil is operably connected to a receiver circuit.

15. The coil transducer of claim 14, wherein an integrated circuit comprises at least one of the transmitter circuit and the receiver circuit.

16. A coil transducer, comprising:

a generally planar substrate comprising opposing upper and lower surfaces, the substrate comprising an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material comprising one or more of fiberglass, glass, ceramic, polyimide, polyimide film, a polymer, an organic material, a flex circuit material, epoxy, epoxy resin, a printed circuit board material, PTFE and glass, PTFE and ceramic, PTFE, glass and ceramic, plastic and thermoset plastic;

a first electrical conductor forming a first coil, the first coil being disposed upon, in or near the upper surface, and

a second electrical conductor forming a second coil, the second coil being disposed upon, in or near the lower surface;

wherein the first coil is separated from the second coil by at least portions of the substrate, no electrical conductors, vias or terminals are located in portions of the substrate disposed between the first coil and the second coil, the first and second coils are spatially arranged and configured respecting one another such that at least one of power and data signals may be transmitted by the first coil to the second coil across a dielectric barrier comprising the non-semiconductor low dielectric loss material disposed therebetween, the dielectric barrier exceeds about 1 mil in thickness, and a breakdown voltage between the first coil and the second coil exceeds 2,000 volts RMS.

17. The coil transducer of claim 16, wherein the substrate imparts substantial mechanical rigidity and strength to the coil transducer.

18. The coil transducer of claim 16, wherein the substrate comprises a plurality of layers in addition to the substrate, at least one of the layers comprising the low-loss dielectric material.

19. The coil transducer of claim 16, wherein a breakdown voltage between the first coil and the second coil exceeds 2,000 volts RMS when applied over a time period of about one minute, exceeds 2,000 volts RMS when applied over a time period of about six minutes, or exceeds 2,000 volts RMS when applied over a time period of 24 hours.

20. The coil transducer of claim 16, wherein a breakdown voltage between the first coil and the second coil exceeds 5,000 volts RMS when applied over a time period of about one minute, exceeds 5,000 volts RMS when applied over a time period of about six minutes, or exceeds 5,000 volts RMS when applied over a time period of 24 hours.

21. The coil transducer of claim 16, wherein at least one of the coil transducer and the substrate has a thickness between upper and lower surfaces thereof ranging between about 0.5 mils and about 25 mils, between about 1 mil and about 25 mils, or between about 1.5 mils and about 25 mils.

22. The coil transducer of claim 16, further comprising at least one of an input lead frame and an output lead frame connected to the coil transducer such that electrically conductive portions of the input and output lead frames do not extend beneath the substrate to locations directly beneath the first or second coils.

23. The coil transducer of claim 16, further comprising an input lead frame and an output lead frame connected to the coil transducer such that the input lead frame is mechanically connected to an upper side of the coil transducer and the output lead frame is mechanically connected to a bottom side of the coil transducer, the bottom side opposing the top side.

24. The coil transducer of claim 16, further comprising an input lead frame and an output lead frame connected to the coil transducer such that the input and output lead frames are both mechanically connected to one of an upper side of the coil transducer and a bottom side of the coil transducer.

25. The coil transducer of claim 16, further comprising an input lead frame and an output lead frame connected to the coil transducer, and a moldable electrically insulating material encapsulating at least portions of the coil transducer and the input and output lead frames.

26. The coil transducer of claim 16, further comprising electrically insulating silicone disposed thereabout, thereover or thereunder.

27. The coil transducer of claim 16, wherein the coil transducer is configured to operate as one of a data transfer device and a power transfer device.

28. The coil transducer of claim 16, wherein the first coil is operably connected to a transmitter circuit and the second coil is operably connected to a receiver circuit.

29. A method of making a coil transducer, comprising:

providing a generally planar electrically insulating substrate comprising opposing upper and lower surfaces, the substrate comprising an electrically insulating, non-metallic, non-semiconductor low dielectric loss material having a dielectric loss tangent at room temperature that is less than or equal to 0.05;

providing a first electrical conductor forming a first coil, the first coil being disposed on the upper surface;

providing a second electrical conductor forming a second coil, the second coil being disposed on the lower surface, and

configuring the first coil, second coil and the substrate in respect of one another such that the first coil is separated from the second coil by at least portions of the substrate, no electrical conductors, vias or terminals are located in portions of the substrate disposed between the first coil and the second coil, the first and second coils are spatially arranged and configured respecting one another such that at least one of power and data signals may be transmitted by the first coil to the second coil across a dielectric barrier comprising the non-semiconductor low dielectric loss material disposed therebetween, and a breakdown voltage between the first coil and the second coil exceeds 2,000 volts RMS.

30. A method of making a coil transducer, comprising:

providing a generally planar substrate comprising opposing upper and lower surfaces, the substrate comprising an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material comprising one or more of fiberglass, glass, ceramic, polyimide, polyimide film, a polymer, an organic material, a flex circuit material, epoxy, epoxy resin, a printed circuit board material, PTFE and glass, PTFE and ceramic, PTFE, glass and ceramic, plastic and thermoset plastic;

providing a first electrical conductor forming a first coil, the first coil being disposed on the upper surface;

providing a second electrical conductor forming a second coil, the second coil being disposed on the lower surface, and

configuring the first coil, second coil and the substrate in respect of one another such that the first coil is separated from the second coil by at least portions of the substrate, no electrical conductors, vias or terminals are located in portions of the substrate disposed between the first coil and the second coil, the first and second coils are spatially arranged and configured respecting one another such that at least one of power and data signals may be transmitted by the first coil to the second coil across a dielectric barrier comprising the non-semiconductor low dielectric loss material disposed therebetween, and a breakdown voltage between the first coil and the second coil exceeds 2,000 volts RMS.