Method for introducing electrical insulations in printed circuit boards

• US 9,021,691 B2
• Filed: 03/23/2011
• Issued: 05/05/2015
• Est. Priority Date: 05/04/2010
• Status: Active Grant

• Current Assignee: LPKF Laser & Electronics AG
• Original Assignee: LPKF Laser & Electronics AG
• Inventors: van Aalst, Jan
• Primary Examiner(s): TRINH, MINH N
• Application Number:
  US13/695,888
• Publication Number:
  US 20130055566A1
• Time in Patent Office: 1,504 Days
• Field of Search: 29830-831, 29846-847, 298/25, 430/311, 430313-315, 174/255, 174260-264
• US Class Current: 29/846
• CPC Class Codes: H05K 2203/0746 Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
• CPC Class Codes: H05K 2203/107 Using laser light shaping a substrate by laser ablation H05K3/0026
• CPC Class Codes: H05K 3/027 the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A method for introducing electrical insulations in a printed circuit board includes selectively introducing groove-shaped recesses between different regions of an electrically conductive layer on a substrate along a machining path using a thermal energy input such that end portions of each of the recesses or different ones of the recesses are joined to one another. The end portions are introduced parallel to one another without overlap such that a strip-shaped region of the conductive layer is initially retained between the end portions so as to insulate the different regions.

Claims

1. A method for introducing electrical insulations in a printed circuit board, the method comprising:

selectively introducing groove-shaped recesses between different regions of an electrically conductive layer on a substrate along a machining path using a thermal energy input such that end portions of each of the recesses or different ones of the recesses are joined to one another;

wherein the end portions are introduced parallel to one another without overlap such that a strip-shaped region of the conductive layer is initially retained between the end portions so as to insulate the different regions, the strip-shape region self-detaching from the substrate when there is a reduction of adhesion forces of the strip-shaped region that results from heat input when introducing the end portions, and

wherein at least one of an additional weakening and an additional recess is introduced in the conductive layer on the substrate in a geometric center region between the end portions.

2. The method according to claim 1, wherein the end portions are introduced as a curve or a bend of the recesses.

3. The method according to claim 1, wherein the recesses to be joined are introduced along parallel machining paths and the end portions are introduced substantially at right angles to the machining paths.

4. The method according to claim 1, wherein the end portions extend at least in portions along parallel straight lines and delimit therebetween the strip-shaped region with a constant width.

5. The method according to claim 1, further comprising removing the strip-shaped region delimited between the end portions using a fluid flow.

6. The method according to claim 1, wherein each of the end portions, along a main extension, has a constant width.

7. The method according to claim 1, wherein the thermal energy input is provided by a laser beam.