LED module

• US 9,022,612 B2
• Filed: 08/07/2008
• Issued: 05/05/2015
• Est. Priority Date: 08/07/2008
• Status: Active Grant

• Current Assignee: MAG Instrument Incorporated
• Original Assignee: MAG Instrument Incorporated
• Inventors: Maglica, Anthony, West, Stacey H., Radloff, Robert P.
• Primary Examiner(s): Husar, Stephen F
• Application Number:
  US12/188,201
• Publication Number:
  US 20100033972A1
• Time in Patent Office: 2,462 Days
• Field of Search: 362/294, 362/373, 362/249.02, 362/646
• US Class Current: 362/294
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21L 4/027 the light sources being a LED
• CPC Class Codes: F21V 15/04 Resilient mountings, e.g. shock absorbers shock absorbing devices of vehicle headlamp housings B60Q1/0491; in general F16F15/04
• CPC Class Codes: F21V 19/005 by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
• CPC Class Codes: F21V 23/006 the substrate being distinct from the light source holder
• CPC Class Codes: F21V 23/04 the elements being switches safety devices F21V25/00
• CPC Class Codes: F21V 23/0414 specially adapted to be used with portable lighting devices
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21V 29/507 of means for protecting lighting devices from damage, e.g. housings
• CPC Class Codes: F21V 29/508 of electrical circuits
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21W 2102/00 Exterior vehicle lighting devices for illuminating purposes
• CPC Class Codes: F21W 2111/10 for personal use, e.g. hand-held
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 1/0207 using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
• CPC Class Codes: H05K 2201/09309 Core having two or more power planes; Capacitive laminate of two power planes
• CPC Class Codes: H05K 2201/09518 Deep blind vias, i.e. blind vias connecting the surface circuit to circuit layers deeper than the first buried circuit layer
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 3/429 : Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Abstract

A light emitting diode (“LED”) module with improved thermal characteristics is provided. The module includes an LED, a first circuit board, a second circuit board, a lower insulator, an upper insulator, a lower contact, upper contacts, and a heat sink. Preferably, the heat sink comprises an outer housing and a contact ring. The LED and the heat sink are attached to the first circuit board via solder. In addition to serving as a substrate for the LED, the first circuit board (which contains a plurality of thermally conductive layers connected by vias) facilitates the transfer of heat away from the LED to the heat sink. The module also has improved mechanical and electrical properties, including redundant electrical connections, stable mechanical connections, and a shock-absorbing lower contact. The lower insulator can also be configured to prevent misalignment of the power source with the lower contact when the module is used in a flashlight or other lighting device.

Claims

1. A lighting module, comprising:

a circuit board;

a light emitting diode attached to said circuit board; and

a heat sink attached to said circuit board;

wherein said heat sink includes an outer housing and a ring that is at least partially located within the outer housing; and

wherein said circuit board has a plurality of thermally conductive layers.

2. The lighting module of claim 1, wherein two or more of said plurality of thermally conductive layers are connected by vias.

3. The lighting module of claim 2, wherein one or more of said vias are blind vias.

4. The lighting module of claim 1, wherein said heat sink is in thermal and electrical communication with said light emitting diode through said circuit board.

5. The lighting module of claim 1, wherein said lighting module further comprises a second circuit board, and said second circuit board is in electrical communication with said circuit board.

6. The lighting module of claim 5, wherein said second circuit board controls said light emitting diode.

7. The lighting module of claim 6, wherein said second circuit board serves as an electronic switch for said light emitting diode.

8. The lighting module of claim 5, wherein said second circuit board is in electrical communication with said circuit board through a plurality of electrical connectors.

9. The lighting module of claim 8, wherein two or more of said plurality of electrical conductors are equally spaced relative to the longitudinal centerline of said second circuit board.

10. The lighting module of claim 5, wherein said second circuit board is capable of maintaining electrical communication with said circuit board in a plurality of orientations relative to said circuit board.

11. The lighting module of claim 5, wherein said lighting module further comprises a contact, and said contact is in electrical communication with said second circuit board.

12. The lighting module of claim 11, wherein said contact is in electrical communication with said second circuit board through a plurality of electrical connectors.

13. The lighting module of claim 12, wherein two or more of said plurality of electrical conductors are equally spaced relative to the longitudinal centerline of said second circuit board.

14. The lighting module of claim 1 , wherein the ring is located to conduct heat from the LED to the outer housing.

15. The lighting module of claim 1, wherein the ring is located between the circuit board and the outer housing.

16. The lighting module of claim 1, wherein the ring includes at least one fin that engages the outer housing.

17. The lighting module of claim 16, wherein the ring includes a plurality of fins that are compressed when they engage the outer housing.

18. A lighting module, comprising:

a thermally conductive circuit board;

a lighting emitting diode attached to said thermally conductive circuit board with a first solder composition; and

a heat sink, comprising a ring that is a thermally conductive member and an outer housing, wherein the ring is attached to said thermally conductive circuit board with a second solder composition;

wherein said ring is attached to said outer housing with a third solder composition or by a press fit, said third solder composition having a liquidous temperature lower than the liquidous temperature of said first and said second solder compositions.

19. The lighting module of claim 18, wherein said first solder composition and said second solder composition are identical.

20. The lighting module of claim 19, wherein said light emitting diode is in electrical communication with said heat sink.

23. The lighting device of claim 18, wherein said contact of said lighting module is a leaf spring.

21. A lighting device, comprising:

a body; and

a lighting module, housed within the body, comprising a light emitting diode, a circuit board, and a heat sink that includes a ring and an outer housing;

wherein said light emitting diode is attached to said circuit board;

wherein said ring is attached to said circuit board and said outer housing; and

wherein said heat sink is in electrical communication with said body and said light emitting diode.

22. The lighting device of claim 21, wherein said body houses a power source having an anode contact and a cathode contact, wherein said lighting module further comprises a contact in electrical communication with said circuit board, and wherein said lighting module is configured to prevent electrical communication between said cathode contact of said power source and said contact of said lighting module, while allowing electrical communication between said anode contact of said power source and said contact of said lighting module.

24. A lighting module, comprising:

a circuit board;

a light emitting diode (LED) attached to the circuit board; and

a heat sink including a ring and a housing;

wherein the ring and housing transfer heat away from the LED; and

wherein the ring is attached to the circuit board and the housing with solder.

25. The lighting module of claim 24, wherein the ring is located to transfer heat away from the LED to the housing.

26. The lighting module of claim 24, wherein the ring is located at least partially within the housing.

27. The lighting module of claim 24, wherein the ring contacts the circuit board and the housing.

28. The lighting module of claim 24, wherein the solder used to attach the ring to the housing is different than the solder used to attach the ring to the circuit board.

29. The lighting module of claim 24, wherein the ring forms part of an electrical path.

30. The lighting module of claim 29, wherein the ring includes a central cavity that electrically isolates the ring from forming another electrical path.

31. The lighting module of claim 24, wherein the ring is made of beryllium copper.

32. The lighting module of claim 24, wherein the circuit board includes at least one thermally conductive layer, and the ring conducts heat from the at least one thermally conductive layer to the housing.