LED package and a backlight unit unit comprising said LED package

• US 9,022,632 B2
• Filed: 07/03/2009
• Issued: 05/05/2015
• Est. Priority Date: 07/03/2008
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, Geun-Young, Onishi, Tomohisa, Lee, Jung-Hun, Kim, Young-Taek, Park, Jong-Jin, Yun, Mi-Jeong, Park, Young-Sam, Hahm, Hun-Joo, Kim, Hyung-Suk, Han, Seong-Yeon, Kim, Do-Hun, Kim, Dae-Yeon, Kim, Dae-Hyun, Park, Jung-Kyu
• Primary Examiner(s): Negron, Ismael
• Assistant Examiner(s): Kryukova, Erin
• Application Number:
  US13/002,419
• Publication Number:
  US 20110199787A1
• Time in Patent Office: 2,132 Days
• Field of Search: 362/97.3, 362/613, 362/612, 362/616, 257/678, 257/684, 257/693, 257/696, 257/730, 257/734
• US Class Current: 362/612
• CPC Class Codes: G02B 6/0023 provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
• CPC Class Codes: G02B 6/005 provided by one optical element, or plurality thereof, placed on the light output side of the light guide
• CPC Class Codes: G02B 6/0073 Light emitting diode [LED]
• CPC Class Codes: G02F 1/133601 for spatial active dimming
• CPC Class Codes: G02F 1/133606 including a specially adapted diffusing, scattering or light controlling members
• CPC Class Codes: G02F 1/133607 the light controlling member including light directing or refracting elements, e.g. prisms or lenses
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01049 Indium [In]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting diode (LED) package includes: a main body mounted on a substrate; a light emitting diode that is mounted in the main body and emits light; and a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted. A backlight unit includes: a light guide plate configured to allow a light source to proceed to a liquid crystal panel; a light emitting diode (LED) mounted in a main body mounted on a substrate and generating a light source; and an LED package having a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted, and being mounted on the light guide plate.

Claims

1. A light emitting diode (LED) package comprising:

a main body mounted on a board, the main body having an opening;

a light emitting diode (LED) that is mounted in the main body and emits light; and

a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted,

wherein the lead frame extends along at least three sides of the main body that intersect with each other,

wherein portions of the lead frame that extend along the at least three sides of the main body define an area that includes the LED,

wherein the lead frame is bent to be dented inwardly toward an inside of the main body to have an inwardly dented portion for receiving the LED therein, and a rear surface of the inwardly dented portion of the lead frame is exposed outside from a rear surface of the main body, and the inwardly dented portion and the LED received therein are exposed outside from a front surface of the main body through the opening, and wherein the lead frame comprises a top electrode electrically connected with the board to allow the LED to be mounted to be parallel to a front surface of the board;

a bent portion integrally formed with the top electrode and bent toward a different side from the top electrode; and

a side electrode formed at an end portion of the bent portion and electrically connected to the board to allow the LED to be mounted to be perpendicular to the board.

2. The LED package of claim 1, wherein the side electrode is mounted at one side of the main body.

3. The LED package of claim 2, wherein the top electrode is formed in an elongated manner on a lower surface of the main body.

4. The LED package of claim 1, wherein the top electrode is mounted at one side of the main body.

5. The LED package of claim 4, wherein the side electrode is formed in an elongated manner on another side of the main body.

6. A light emitting diode (LED) package comprising:

a main body mounted on a board, the main body having an opening;

an LED mounted in the main body;

a lead frame electrically connected with the LED; and

a contact portion formed on a surface of the main body and providing a mounting area to be mounted on the board,

wherein the lead frame extends along at least three sides of the main body that intersect with each other,

wherein portions of the lead frame that extend along the at least three sides of the main body define an area that includes the LED,

wherein the lead frame is bent to be dented inwardly toward an inside of the main body to have an inwardly dented portion for receiving the LED therein, and a rear surface of the inwardly dented portion of the lead frame is exposed outside from a rear surface of the main body, and the inwardly dented portion and the LED received therein are exposed outside from a front surface of the main body through the opening, and wherein the lead frame comprises;

a top electrode electrically connected with the board to allow the LED to be mounted to be parallel to a front surface of the board;

a bent portion integrally formed with the top electrode and bent toward a different side from the top electrode; and

a side electrode formed at an end portion of the bent portion and electrically connected to the board to allow the LED to be mounted to be perpendicular to the board.

7. The LED package of claim 6, wherein the lead frame is exposed to allow the main body to be side-mounted or top-mounted.

8. The LED package of claim 6, wherein the side electrode is mounted at one side of the main body.

9. The LED package of claim 8, wherein the top electrode is formed in an elongated manner on a lower surface of the main body.

10. The LED package of claim 6, wherein the top electrode is mounted at one side of the main body.

11. The LED package of claim 10, wherein the side electrode is formed in an elongated manner on another side of the main body.

12. The LED package of claim 6, wherein the contact portion is formed at a central portion of the main body.

13. The LED package of claim 6, wherein the contact portion is mounted at a side of the main body and has an end bent toward the board.

14. The LED package of claim 6, wherein the contact portion and the lead frame are integrally formed.

15. A backlight unit comprising:

a light guide plate configured to allow a light to proceed to a liquid crystal panel; and

a light emitting diode (LED) package comprising;

a main body mounted on a board, the main body having an opening,

an LED mounted in the main body and generating the light, and

a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted, and being mounted on the light guide plate,

wherein the lead frame extends along at least three sides of the main body that intersect with each other,

wherein portions of the lead frame that extend along the at least three sides of the main body define an area that includes the LED,

wherein the lead frame is bent to be dented inwardly toward an inside of the main body to have an inwardly dented portion for receiving the LED therein, and a rear surface of the inwardly dented portion of the lead frame is exposed outside from a rear surface of the main body, and the inwardly dented portion and the LED received therein are exposed outside from a front surface of the main body through the opening, and wherein the lead frame comprises;

a top electrode electrically connected with the board to allow the LED to be mounted to be parallel to a front surface of the board;

a bent portion integrally formed with the top electrode and bent toward a different side from the top electrode; and

a side electrode formed at an end portion of the bent portion and electrically connected to the board to allow the LED to be mounted to be perpendicular to the board.

16. The backlight unit of claim 15, further comprising:

a contact portion formed on the surface of the main body and providing a mounting area to be mounted on the board.

17. The backlight unit of claim 16, wherein the contact portion and the lead frame are integrally formed.

18. The backlight unit of claim 16, wherein the contact portion is formed at a central portion of the main body.

19. The backlight unit of claim 16, wherein the contact portion is mounted at a side of the main body and has an end portion bent toward the board.

20. The backlight unit of claim 15, wherein a plurality of light guiding plates are integrally formed.

21. The backlight unit of claim 15, further comprising:

a reflection plate disposed at a lower portion of the light guide plate.

22. The backlight unit of claim 15, further comprising:

an optical sheet disposed at an upper portion of the light guide plate.

23. A light emitting diode (LED) package comprising:

a main body, the main body having an opening;

an LED that is mounted in the main body and emits light; and

a lead frame comprising;

a first lead part on which the LED is mounted, and

a side electrode along a first side of the main body that is perpendicular to the first lead part, wherein the side electrode is electrically connected to the first lead part, and is exposed to be electrically connectable to a board such that the main body is side-mountable on the board to perpendicularly dispose the LED to the board,

wherein portions of the lead frame that extend along at least three sides of the main body define an area that includes the LED,

wherein the first lead part is bent to be dented inwardly toward an inside of the main body to have an inwardly dented portion for receiving the LED therein, and a rear surface of the inwardly dented portion of the first lead part is exposed outside from a rear surface of the main body, and the inwardly dented portion and the LED received therein are exposed outside from a front surface of the main body through the opening, wherein the lead frame further comprises a top portion along a second side of the main body, perpendicular to the first side,

wherein the top portion is electrically connected to the first lead part by electrically conductive wiring, and

wherein the top portion is a top electrode exposed to be electrically connectable to the board such that the main body is top-mountable on the board.

24. The LED package of claim 23, wherein:

the lead frame further comprises a bent portion integrally formed with the top electrode and bent toward a different side from the top electrode and from the first side; and

the side electrode is at an end of the top portion.

25. The LED package of claim 24, wherein the side electrode, the bent portion, and the top electrode are integrally formed.

26. The LED package of claim 25, wherein the side electrode is mounted at one side of the main body.

27. The LED package of claim 26, wherein the top electrode is formed in an elongated manner on a lower surface of the main body.

28. The LED package of claim 25, wherein the top electrode is mounted at one side of the main body.

29. The LED package of claim 28, wherein the side electrode is formed in an elongated manner on the first side of the main body.

30. The LED package of claim 23, wherein the side electrode is connected to the first side of the main body and is separated from the first lead part.

31. The LED package of claim 30, wherein the lead frame further comprises another side electrode along the first side of the main body and exposed to be electrically connectable to the board such that the main body is side-mountable on the board to perpendicularly dispose the LED to the board, wherein the other side electrode is separated from the side electrode and is connected to the first lead part.

32. The LED package of claim 30, wherein the lead frame further comprises a second lead part, parallel to the first lead part along a same side of the main body, that is separated from the first lead part and is connected to the side electrode.