Modular printhead for OLED printing

• US 9,023,670 B2
• Filed: 11/05/2013
• Issued: 05/05/2015
• Est. Priority Date: 06/14/2007
• Status: Expired due to Fees

• Current Assignee: Kateeva, Inc.
• Original Assignee: Kateeva, Inc.
• Inventors: Golda, Dariusz, Gassend, Valerie, Kim, Hyeun-Su
• Primary Examiner(s): Patel, Reema
• Application Number:
  US14/072,720
• Publication Number:
  US 20140057373A1
• Time in Patent Office: 546 Days
• Field of Search: 438/21, 347/20, 347/14, 347/85
• US Class Current: 438/21
• CPC Class Codes: B41J 2/335 Structure of thermal heads
• CPC Class Codes: B41J 2/3359 Manufacturing processes
• CPC Class Codes: B81C 1/00309 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The disclosure generally relates to a modular printhead configured for ease of access and quick replacement of the printhead. In one embodiment, the disclosure is directed to an integrated printhead which includes: a printhead die supporting a plurality of micropores thereon; a support structure for supporting the printhead die; a heater interposed between the printhead die and the support structure; and an electrical trace connecting the heater to a supply source. The support structure accommodates the electrical trace through a via formed within it so as to form a solid state printhead containing all of the connections within and providing easily replaceable printhead.

Claims

1. A method for forming an integrated printhead device, the method comprising:

forming a plurality of micropores on a distal surface of a printhead die;

forming a heater on the proximal surface of the printhead die;

forming at least one electrical trace on a support structure;

connecting the support structure to one of the electrical heater or the printhead die through a connection joint;

wherein the support structure provides a solid state connection between an electrical supply source and the heater and wherein the connection joint provides a path for said connection.

2. The method of claim 1, wherein the at least one micropore defines a blind micropore.

3. The method of claim 1, wherein the printhead die comprises a silicon material.

4. The method of claim 1, wherein the support structure further comprises a ceramic material.

5. The method of claim 1, wherein the distal surface of the printhead is configured to define a flatness tolerance of about 5-10 micron.

6. The method of claim 1, further comprising connecting the heater to a complementary supply source through a complementary electrical trace.

7. The method of claim 1, wherein the integrated printhead chip defines a solid state device excluding external wiring.

8. The method of claim 1, further comprising forming a trench through the printhead die.

9. The method of claim 1, further comprising connecting the support structure to at least one of the heater or the printhead die through a plurality connection joints.

10. The method of claim 1, further comprising forming a connection joint by forming an under-bump metal (UBM) at a connection site on the heater, depositing a solder bump on the UMB and interposing a package pad between the solder bump and the support structure.