Light-emitting device having a plurality of concentric light transmitting areas

• US 9,024,334 B2
• Filed: 11/09/2010
• Issued: 05/05/2015
• Est. Priority Date: 11/13/2009
• Status: Expired due to Fees

• Current Assignee: Heavy Duty Lighting LLC (Ni, Wang & Massand, PLLC)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Agatani, Makoto, Hata, Toshio, Uemura, Toyonori
• Primary Examiner(s): NGUYEN, DUY T V
• Application Number:
  US12/942,327
• Publication Number:
  US 20110116252A1
• Time in Patent Office: 1,638 Days
• Field of Search: 257/88, 257/100, 438/28, 362/84
• US Class Current: 257/88
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/15 including semiconductor components having potential barriers, specially adapted for light emission
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/504 Elements with two or more wavelength conversion materials
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/167 incorporating printed resistors
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: Y10T 29/49764 with testing or indicating

Abstract

The light-emitting device of the present invention includes LED chips provided on a ceramic substrate and a sealing material in which the LED chips are embedded. The sealing material contains a fluorescent substance and divided into a first fluorescent-substance-containing resin layer and a second fluorescent-substance-containing resin layer by a first resin ring and a second resin ring.

Claims

1. A light-emitting device comprising:

a plurality of light-emitting elements provided on a substrate; and

a sealing material in which the plurality of light-emitting elements are embedded, the sealing material containing a fluorescent substance and being divided into a plurality of continuous areas by a partition wall, wherein

each of the plurality of continuous areas is annular or circular, seen from a top view, as a result of the partition wall, and

each of the plurality of continuous areas is not divided into smaller segments by the partition wall comprising resin and by any other partition walls.

2. The light-emitting device as set forth in claim 1, wherein:

the partition wall comprising the resin (i) is formed on the substrate in such a manner that the partition wall comprising the resin has a circular shape or a cyclic polygonal shape when the substrate is viewed from above and (ii) includes at least two partition walls which comprises the resin and are formed concentrically,

the sealing material contains plural kinds of fluorescent substances,

the sealing material in each of the plurality of continuous areas is different in at least one of fluorescent substance content and fluorescent substance composition,

the substrate is further provided with a first electrode land for external connection and a second electrode land for external connection which (i) are respectively provided on both end areas of the substrate and (ii) are not covered with the sealing material,

the first electrode land for external connection and the second electrode land for external connection are connected to a patterned electrode wire provided on the substrate, and

electric power is supplied via the patterned electrode wire to the plurality of light-emitting elements included in the plurality of continuous areas.

3. The light-emitting device as set forth in claim 2, wherein:

the plurality of light-emitting elements are provided along a circle which is concentric with the partition wall comprising the resin.

4. The light-emitting device as set forth in claim 1, wherein:

the sealing material in each of the plurality of continuous areas is different in at least one of fluorescent substance content and fluorescent substance composition.

5. The light-emitting device as set forth in claim 1, wherein:

the sealing material contains plural kinds of fluorescent substances.

6. The light-emitting device as set forth in claim 1, wherein:

the partition wall comprising the resin is colored with milky white or white.

7. The light-emitting device as set forth in claim 1, wherein:

the plurality of light-emitting elements are separated into a plurality of groups in which light-emitting elements in a same group are connected to each other via a patterned wire(s).

8. The light-emitting device as set forth in claim 1, further comprising:

at least one of a protective element and a printed resistor, between a main surface of the substrate and the partition wall comprising the resin.

9. The light-emitting device as set forth in claim 8, wherein:

the at least one of the protective element and the printed resistor is wholly covered with the partition wall comprising the resin.

10. The light-emitting device as set forth in claim 1, wherein:

the substrate is further provided with a first electrode land for external connection and a second electrode land for external connection which (i) are respectively provided on both end areas of the main surface of the substrate and (ii) are not covered with the sealing material.

11. The light-emitting device as set forth in claim 1, wherein:

the substrate is provided with a bridge electrode with which one of the plurality of light-emitting elements embedded in a first area is connected to another one of the plurality of light-emitting elements embedded in a second area, the first area and the second area being areas among the plurality of continuous areas.

12. The light-emitting device as set forth in claim 11, wherein:

the bridge electrode is provided between the substrate and the partition wall comprising the resin and traverses the partition wall comprising the resin.

13. The light-emitting device as set forth in claim 11, wherein:

the plurality of light-emitting elements are connected in series via the bridge electrode.

14. The light-emitting device as set forth in claim 1, wherein:

the partition wall comprising the resin contains at least one of a thickener and a diffusing agent.