Linked semiconductor module unit and electronic circuit-integrated motor device using same

• US 9,025,336 B2
• Filed: 12/02/2013
• Issued: 05/05/2015
• Est. Priority Date: 06/24/2009
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Minato, Hideki, Kabune, Hideki, Furumoto, Atsushi
• Primary Examiner(s): Chen, Xiaoliang
• Application Number:
  US14/094,217
• Publication Number:
  US 20140084722A1
• Time in Patent Office: 519 Days
• Field of Search: 361/730, 622/284, 622/592, 310/1, 310/52, 310/62, 310/71, 310/89, 310/429, 219/623, 318/139, 318/432, 318/689, 180/444
• US Class Current: 361/730
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/37147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/4103 Connectors having different sizes
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73221 Strap and wire connectors
• CPC Class Codes: H01L 2224/84 using a strap connector
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 24/37 of an individual strap connector
• CPC Class Codes: H01L 24/41 of a plurality of strap connectors
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H02K 11/0094 : Structural association with other electrical or electronic devices
• CPC Class Codes: H02K 11/026 : Suppressors associated with brushes, brush holders or their supports
• CPC Class Codes: H02K 11/028 : Suppressors associated with the rotor
• CPC Class Codes: H02K 11/05 : Rectifiers associated with casings, enclosures or brackets
• CPC Class Codes: H02K 11/33 : Drive circuits, e.g. power electronics H02K11/38 takes precedence
• CPC Class Codes: H02K 2211/03 : Machines characterised by circuit boards, e.g. pcb
• CPC Class Codes: H02K 3/522 : for generally annular cores with salient poles
• CPC Class Codes: H02K 9/227 : Heat sinks

Abstract

A linked semiconductor module unit links a plurality of semiconductor modules by a first bus bar and a second bus bar, which are embedded in resin parts. The linked semiconductor module unit is disposed in a place other than on a printed circuit board. The semiconductor module linking structure is implemented readily by molding the bus bars together with semiconductor chips and lands to form the resin parts.

Claims

1. An electronic circuit-integrated motor device comprising:

a tubular motor case;

a stator positioned on a radially inside part of the motor case and wound with a multiple-phase coil;

a rotor positioned in a radially inside part of the stator;

a shaft fit in the rotor to be rotatable the rotor;

a plurality of semiconductor modules, each having a switching element for changing a coil current flowing to the multiple-phase coil; and

a linking member linking the plurality of semiconductor modules to form a linked semiconductor module unit,

wherein each of the semiconductor modules includes at least one semiconductor chip that forms the switching element, a land on which the semiconductor chip is mounted, and a resin part that encapsulates the semiconductor chip and embeds the land therein,

wherein the linking member is comprised of embedded portions, each embedded in a respective said resin part, and exposed portions that extend between the embedded portions and are exposed from the resin parts, said embedded portions and said exposed portions being formed integrally and continuously in one piece,

wherein the linking member includes a bent portion that is bent at the exposed portion, and

further comprising a heat sink mounted on an axial end wall of the motor case in a raised manner, wherein the linked semiconductor module unit is bent at a radially inside part of the heat sink along the heat sink, and positioned around a rotation axis of the motor.

2. The electronic circuit-integrated motor device according to claim 1, wherein:

the linking member includes a first conductive member and a second conductive member, the first conductive member being connected to a power source, the second conductive member being electrically connected with a connection member to the heat sink connected to a ground.

3. The electronic circuit-integrated motor device according to claim 1, wherein:

the plurality of semiconductor modules are disposed within an axial projection range of the motor case.

4. The electronic circuit-integrated motor device according to claim 1, further comprising:

a control circuit connected to the semiconductor modules for controlling an on/off operation of the switching element of each of the semiconductor modules,

wherein each of the semiconductor modules has control terminals connecting the control circuit and the switching element, and

wherein the linking member is conductive to supply power to the switching element of each of the semiconductor modules.

5. The electronic circuit-integrated motor device according to claim 1, wherein:

the land of each said semiconductor module is formed integrally with said linking member.