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High voltage photo-switch package module having encapsulation with profiled metallized concavities

  • US 9,025,919 B2
  • Filed: 10/22/2012
  • Issued: 05/05/2015
  • Est. Priority Date: 06/28/2010
  • Status: Active Grant
First Claim
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1. A photo-conductive switch package module comprising:

  • a photo-conductive substrate having opposing electrode-interface surfaces;

    first metal layers formed on said electrode-interface surfaces;

    a dielectric encapsulation surrounding the photo-conductive substrate and having concavities on opposite sides of the encapsulation, wherein the concavities are bounded in part by the first metal layers; and

    second metal layers lining the concavities and in contact with the first metal layers.

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